High Density GHz BGA Sockets; Max Pincount: 225; Top Pitch (mm): 0.5; IC Array X: 15; IC Array Y: 15; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.2; IC Size X (mm): 10; IC Size Y (mm): 10; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.2; IC Ball Height Max (mm): 0.25; IC Ball Diameter Max (mm): 0.35; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD
Findchips