GHz BGA Sockets-1.0mm; IC Size X (mm): 42.5; IC Size Y (mm): 42.5; IC Array X: 42; IC Array Y: 42; Max Pincount: 860; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.3; Max Package Code: BGA860A; Backing Plate: yes; Cavity Down: yes; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF)