High Density GHz BGA Sockets; Max Pincount: 289; Top Pitch (mm): 0.65; IC Array X: 17; IC Array Y: 17; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.35; IC Size X (mm): 13; IC Size Y (mm): 13; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.28; IC Ball Height Max (mm): 0.36; IC Ball Diameter Max (mm): 0.45; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD
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