High Frequency GHz Sockets; Max Pincount: 900; Top Pitch (mm): 1; IC Array X: 30; IC Array Y: 30; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 3.42; IC Size X (mm): 31; IC Size Y (mm): 31; IC Size Tolerance (mm): 0.2; IC Ball Coplanarity (mm): 0.2; IC Ball Height Min (mm): 0.3; IC Ball Height Max (mm): IC Ball Diameter Max (mm): 0.7; Max Package Code: BGA900; Part Description: GHz BGA Socket (ZIF)
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