GHz BGA Sockets-1.0mm; IC Size X (mm): 21; IC Size Y (mm): 21; IC Array X: 20; IC Array Y: 20; Max Pincount: 400; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.84; IC Ball Height Max (mm): 0.91; IC Ball Height Min (mm): 0.71; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.087; Max Package Code: Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flip Chip + Caps; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)-HD
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