GHz BGA Sockets-0.8mm; IC Size X (mm): 12.5; IC Size Y (mm): 10; IC Array X: 15; IC Array Y: 9; Max Pincount: 135; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): 0.41; IC Ball Height Min (mm): 0.31; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: flat; Socket Lid: swivel; Part Description: GHz BGA Socket (ZIF)-Epoxy
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