GHz BGA Sockets-0.8mm; IC Size X (mm): 12; IC Size Y (mm): 12; IC Array X: 13; IC Array Y: 13; Max Pincount: 169; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): 0.34; IC Ball Height Min (mm): 0.2; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: BGA169F; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF)
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