High Density GHz BGA Sockets; Max Pincount: 441; Top Pitch (mm): 0.5; IC Array X: 21; IC Array Y: 21; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: no; IC Total Height Max (mm): 1.28; IC Size X (mm): 11; IC Size Y (mm): 11; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.15; IC Ball Height Min (mm): 0.27; IC Ball Height Max (mm): 0.17; IC Ball Diameter Max (mm): 0.4; Max Package Code: Part Description: GHz BGA Socket (ZIF)-Epoxy
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