GHz BGA Sockets-1.27mm; IC Size X (mm): 25; IC Size Y (mm): 25; IC Array X: 19; IC Array Y: 19; Max Pincount: 360; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.93; IC Ball Height Max (mm): 1; IC Ball Height Min (mm): 0.8; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.24; Max Package Code: Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
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