High Density GHz BGA Sockets; Max Pincount: 49; Top Pitch (mm): 0.75; IC Array X: 7; IC Array Y: 7; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.2; IC Size X (mm): 6; IC Size Y (mm): 6; IC Size Tolerance (mm): 0.05; IC Ball Coplanarity (mm): 0.28; IC Ball Height Min (mm): 0.08; IC Ball Height Max (mm): 0.37; IC Ball Diameter Max (mm): 0.18; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD
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