GHz BGA Sockets-1.0mm; IC Size X (mm): 37.5; IC Size Y (mm): 37.5; IC Array X: 36; IC Array Y: 36; Max Pincount: 1297; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.36; Max Package Code: BGA1297; Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Mold Cap; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)
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