High Density GHz BGA Sockets; Max Pincount: 784; Top Pitch (mm): 0.5; IC Array X: 28; IC Array Y: 28; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 2.5; IC Size X (mm): 15; IC Size Y (mm): 15; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.16; IC Ball Height Max (mm): 0.26; IC Ball Diameter Max (mm): 0.37; Max Package Code: BGA784; Part Description: GHz BGA Socket (ZIF)-HD
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