GHz BGA Sockets-1.27mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: 19; IC Array Y: 19; Max Pincount: 361; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.2; Max Package Code: BGA361; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)