GHz BGA Sockets-0.8mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: 32; IC Array Y: 32; Max Pincount: 1024; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): IC Ball Height Min (mm): 0.27; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 2.5; Max Package Code: BGA1024; Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Mold Cap; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
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