GHz BGA Sockets-0.8mm; IC Size X (mm): 8; IC Size Y (mm): 8; IC Array X: 9; IC Array Y: 9; Max Pincount: 81; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.4; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.33; Max Package Code: BGA81; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)-Epoxy
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