High Density GHz BGA Sockets; Max Pincount: 25; Top Pitch (mm): 0.4; IC Array X: 5; IC Array Y: 5; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 0.5; IC Size X (mm): 2; IC Size Y (mm): 2; IC Size Tolerance (mm): 0.03; IC Ball Coplanarity (mm): 0.05; IC Ball Height Min (mm): 0.13; IC Ball Height Max (mm): 0.17; IC Ball Diameter Max (mm): 0.25; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)-HD
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