GHz BGA Sockets-1.27mm; IC Size X (mm): 35; IC Size Y (mm): 35; IC Array X: 26; IC Array Y: 26; Max Pincount: 676; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.5; Max Package Code: BGA676; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
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