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    DSASW0017878.pdf

    by Freescale Semiconductor
    • Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowa
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    "thermal via" 24 leads qfn 5x5 4 mm 16 lead PQFN Package 6-SN62 AN2467 AN3778 joint pcb thermal Design guide trace PQFN 8 leads PQFN 8x8 PQFN-16 PQFN-24 PQFN-24 package qfn 5x5 thermal resistance QFN PACKAGE Junction to PCB thermal resistance QFN-16 rf 4 mm PQFN SAC-305 SAC305 SAC305 reflow system in package

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