DASF0045523.pdf by Fairchild Semiconductor

Partial File Text AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form fac
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7525A smt entek ht plus FDMC2523P FDMC8554 IPC-4101B IPC-7525 IPC-A-610D IPC-SM-7525A IPC610D IPC7525 IPCA610D J-STD-001C JESD22-B102D Lead Free reflow soldering profile BGA POWER33 sac 305