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    DSAZIHA2X00053454.pdf by Intersil

    • Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20M 20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH) Rev 0, 01/15 X Y 0.400 1.74 ±0.030 20x 0.265 ±0.
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