Toshiba provides a recommended PCB layout in their application note AN2018041, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SSM3J168F,LXHF has a high power dissipation rating, so proper thermal management is crucial. Toshiba recommends using a heat sink with a thermal resistance of 10°C/W or less, and ensuring good airflow around the device. Additionally, the device should be mounted on a multi-layer PCB with a thermal via structure to dissipate heat effectively.
The SSM3J168F,LXHF has an operating temperature range of -40°C to 150°C, but Toshiba recommends derating the device's power dissipation above 125°C to ensure reliable operation.
To ensure EMC, Toshiba recommends following proper PCB layout and design guidelines, using a metal shield or enclosure, and implementing filtering and shielding techniques to minimize electromagnetic radiation. Additionally, the device should be placed at least 10mm away from other components to minimize electromagnetic interference.
Toshiba recommends storing the SSM3J168F,LXHF in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. The device should be stored in its original packaging or an anti-static bag to prevent damage from electrostatic discharge.
