A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
Use a reliable clock source, ensure proper termination of transmission lines, and implement error detection and correction mechanisms such as CRC and checksums.
The device has a thermal pad on the bottom, so ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the ambient temperature within the recommended range.
Use a power sequencing scheme that ensures the analog supply is powered up before the digital supply. Use a low-dropout regulator (LDO) or a switching regulator with a low output voltage ripple to minimize noise.
Use shielding, filtering, and grounding techniques to minimize EMI and RFI. Ensure that the PCB layout and component placement minimize radiation and susceptibility.
DP8573AV/NOPB datasheet
by Texas Instruments
