A good PCB layout for the BAT721,215 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermal interface material with a high thermal conductivity coefficient.
When selecting an inductor for the BAT721,215, consider the inductor's saturation current, DC resistance, and self-resonant frequency. Choose an inductor with a high saturation current rating, low DC resistance, and a self-resonant frequency above the switching frequency.
Optimize the output capacitor selection by choosing a capacitor with a low equivalent series resistance (ESR), high capacitance, and a voltage rating that meets or exceeds the output voltage. Consider using a ceramic or polymer capacitor with a low ESR and high capacitance.
To minimize EMI in a BAT721,215-based design, use a common-mode choke, add a differential-mode filter, and ensure proper PCB layout and grounding. Additionally, consider using shielding and filtering components, such as ferrite beads and capacitors, to reduce EMI emissions.
BAT721,215 datasheet
by NXP Semiconductors
