Diodes Incorporated recommends a PCB layout with a solid ground plane and thermal vias under the device to improve heat dissipation. A minimum of 2oz copper thickness is recommended for optimal thermal performance.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current handling capability according to the temperature derating curve provided in the datasheet. Additionally, ensure proper heat sinking and thermal management to keep the junction temperature below the maximum rated value.
Diodes Incorporated recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a solder with a melting point of 220°C (428°F) or higher.
Yes, the ATS277H-PG-B-A is qualified to AEC-Q101 standards, making it suitable for high-reliability and automotive applications. However, it is recommended to consult with Diodes Incorporated's application engineers to ensure the device meets the specific requirements of your application.
Diodes Incorporated recommends using a human-body model (HBM) ESD protection of at least 2kV and a machine model (MM) ESD protection of at least 200V to prevent damage to the device.
