The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure the device is properly biased, make sure to provide a stable input voltage within the recommended range (4.5V to 5.5V), and use a suitable output capacitor (e.g., 10uF) to filter the output voltage. Additionally, ensure the input and output capacitors are placed close to the device to minimize parasitic inductance.
The maximum output current of the AOZ1361DI-02 is 1A. However, it's recommended to derate the output current based on the ambient temperature and PCB layout to ensure reliable operation. A safe operating current is typically around 0.8A to 0.9A.
To protect the device from overvoltage and undervoltage conditions, consider adding overvoltage protection (OVP) and undervoltage lockout (UVLO) circuits. These can be implemented using external components such as zener diodes, resistors, and comparators.
The AOZ1361DI-02 has built-in ESD protection, but it's still recommended to add external ESD protection devices (e.g., TVS diodes) to protect the device from electrostatic discharge events. Follow the manufacturer's guidelines for ESD protection circuit design.
AOZ1361DI-02 datasheet
by Alpha & Omega Semiconductor
