STMicroelectronics provides a recommended PCB layout in the application note AN4965, which includes guidelines for thermal pad connection, copper pouring, and via placement to ensure optimal thermal performance.
The thermal shutdown feature is enabled by default. To handle it, monitor the TSD (Thermal Shutdown) pin, which goes low when the device reaches the thermal shutdown temperature (typically 150°C). When TSD is low, the device is disabled, and the output voltage is disconnected from the input. To recover, reduce the power dissipation or improve the thermal design to lower the device temperature.
Although not explicitly stated in the datasheet, STMicroelectronics recommends keeping the input voltage ripple below 10% of the nominal input voltage to ensure stable operation and prevent oscillations.
The ACST1235-8FP is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. For extended temperature ranges, consider using a thermally enhanced package or a different device specifically designed for high-temperature applications.
Follow the guidelines in the application note AN1709, which provides recommendations for PCB layout, component selection, and filtering to ensure EMC compliance with the ACST1235-8FP.
ACST1235-8FP datasheet
by STMicroelectronics
