A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, with a voltage rating of at least 25V. The capacitor should be placed as close as possible to the VIN pin.
Use a shielded enclosure, keep the ACST1210-7T away from antennas and other EMI-sensitive components, and use a common-mode choke or ferrite bead on the input lines. Also, ensure good PCB layout practices, such as separating analog and digital grounds.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, with a voltage rating of at least 5V. The capacitor should be placed as close as possible to the VOUT pin.