DSA0051381.pdf by OKI Electric Industry

Partial File Text Oki's Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market's Requirement for a New Packaging Technology · The need for increased functionality, smaller device size and lo
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72 ball w-csp ED-4701 FBGA tray mobile phone oki qfp tray SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability