A symmetrical layout with a solid ground plane and minimal signal trace length is recommended for optimal performance. It's also important to keep the component away from high-frequency sources and to use a common mode choke to reduce EMI.
Use a soldering iron with a temperature of 250-270°C and a solder with a melting point of 217-220°C. Apply a small amount of solder paste to the pads and use a gentle touch to avoid damaging the component. Inspect the joints under a microscope to ensure they are smooth and shiny.
The 824001 can operate safely in temperatures ranging from -40°C to 125°C. However, it's recommended to derate the component's performance at temperatures above 85°C to ensure reliability.
Use an oscilloscope to measure the voltage and current waveforms at the input and output of the component. Check for signs of overheating, such as a burnt smell or discoloration. Verify that the component is properly soldered and that the PCB layout is correct.
Yes, the 824001 is designed to withstand vibrations up to 10g. However, it's recommended to use a secure mounting method, such as a screw or adhesive, to prevent the component from shifting during operation.
824001 datasheet
by Wurth Elektronik
