Wurth Elektronik provides a recommended PCB layout in their application notes, which includes guidelines for trace width, spacing, and component placement to ensure optimal performance and minimize electromagnetic interference (EMI).
The datasheet provides thermal resistance values, but for optimal thermal management, it's recommended to use a thermal pad or heat sink, and ensure good airflow around the component. Additionally, following Wurth Elektronik's guidelines for PCB layout and component placement can help reduce thermal issues.
Wurth Elektronik recommends following the IPC-J-STD-001 standard for soldering, with a peak temperature of 260°C (500°F) and a dwell time of 3-5 seconds. It's also important to use a solder with a melting point above 217°C (423°F) to ensure reliable connections.
The 64800113722DEC is a moisture-sensitive device, so it's essential to handle it in a dry environment, and store it in a sealed package or dry box when not in use. Baking the component at 125°C (257°F) for 24 hours can also help remove any moisture that may have accumulated during storage.
The 64800113722DEC is designed to withstand moderate vibration, but extreme vibration can cause mechanical stress and affect its performance. It's recommended to use additional mechanical support or potting compounds to secure the component and ensure reliable operation in high-vibration environments.
