Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (-40°C to 125°C) and consider thermal management techniques such as heat sinks, thermal interfaces, and airflow.
The recommended power sequencing is to power up the device with a single 3.3V or 5V supply, and ensure that the input voltage is within the recommended operating range (2.97V to 3.63V or 4.75V to 5.25V).
To prevent ESD damage, use ESD protection devices such as TVS diodes or ESD arrays on the input lines. For latch-up prevention, ensure that the device is operated within the recommended operating conditions, and consider using a latch-up protection circuit if necessary.
Follow standard PCB assembly and rework techniques, such as using a soldering iron with a temperature-controlled tip, and ensuring that the device is handled by trained personnel to prevent damage.
5962-9679801VIA datasheet
by Texas Instruments
