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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
CLTEQ-FEED-TRAY TE Connectivity Ltd CLTEQ-FEED-TRAY
70V3579S5BF Integrated Device Technology Inc CABGA-208, Tray
SSTUF32864BHLF Integrated Device Technology Inc CABGA-96, Tray
SSTUB32871AHLF Integrated Device Technology Inc CABGA-96, Tray
SSTUA32866BHLF Integrated Device Technology Inc CABGA-96, Tray
TSI577-10GCLV Integrated Device Technology Inc TEPBGA-399, Tray

daewon tray Datasheets Context Search

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ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray , 14 X 20 DAEWON Tray Part# 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919 , , Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping


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PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
2011 - daewon tray

Abstract: Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Text: 100 11  11 — 144 13  13 169 Parts or Tray Daewon 12F-1111-1XX (2) A , , four trays containing devices and one cover tray ). ■Stack Plastic Quad Flat Pack (PQFP) and , tray ). ■Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA ,  27 256 27  27 356 35  35 600 45  45 Remark Tray Revision Altera Part Number Plastic BGA Daewon 125-2727-9XX (2) A E20-12211-00 40 Ceramic BGA


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PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
DAEWON tray drawing

Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Text: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 , for product presentation to a pick-and-place system. for a listing of tray suppliers). The fiber tray , static dissipative polysulfone material, or equivalent. The temperature at which each tray can withstand continuous operation varies. See the notes section of each tray dimension drawing for specific information


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Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray drawing JEDEC Kostat DAEWON tray 48 daewon CERAMIC PIN GRID ARRAY CPGA AMD D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication , recycled material (see page 7-5 for a listing of AMD's tray suppliers). The fiber tray material is either , polysulfone material, or equivalent. The temperature at which each tray can withstand continuous operation varies. See the notes section of each tray dimensions drawing for specific information. Pin One


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PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray drawing JEDEC Kostat DAEWON tray 48 daewon CERAMIC PIN GRID ARRAY CPGA AMD D-12G-56LD-A13
EN4900GC

Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Text: still be RoHS and REACH compliant. 3 www.energymicro.com Tray and Tape Material Current New Tray for QFN32 Peak TX QFN0606 1.0 1435 6 rev D Daewon JQFA-0606-0.85T Tray for QFN64 Daewon JMFA-0909-0.85T Daewon JQFA-0909-0.85T Tray for BGA112 UBoT UB10101.50823XA Daewon JCL , per tray or tape&reel, nor the reel size. Internal, External boxes and labels The internal and


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PDF PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
2012 - FC-BGA

Abstract: T0812012 daewon tray
Text: FCMBGA tray vendors: ■Daewon (www.daewonspic.com) ■Kostat (www.kostat.com) Document , remain secure in the tray carriers except during transfer operations from tray to tray . You must also use the correct lidless FCBGA trays. Table 6 lists the lidless FCBGA tray specifications for different packages. Table 6. Tray Specifications Package Size (Pin Count) Tray Part Number 17 mm x 17 mm (U358, M1019) Daewon 1F1-1717-A19 23 mm x 23 mm (F484) Daewon T0812012 25 mm x 25


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PDF AN-659-1 FC-BGA T0812012 daewon tray
1999 - daewon

Abstract: CO-029 daewon tray 21154-AB 125-3131-913N DAEWON JEDEC TRAY Shipping Trays 21154-BB
Text: : 21154-AB and 21154-BB Shipment Tray Transition Date of PCN Publication: 4/23/99 Type of Change , trays used for shipping these devices will be changed from the current Daewon * part number 125-3131-913, Rev. A to Daewon * part number 125-3131-913N Rev. B. Forecasted Key Milestones: Date Customer Must , withstand temperatures of up to 140 degrees C. The replacement tray is standard to Intel and is used in the


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PDF 31X31 21154-AB 21154-BB daewon CO-029 daewon tray 21154-AB 125-3131-913N DAEWON JEDEC TRAY Shipping Trays 21154-BB
2012 - KS-886H

Abstract: Kostat tray
Text: Package Size (Pin Count) Tray Part Number 27 mm x 27 mm (F672) Daewon 125-2727-919 29 mm x 29 , TCFCBGA tray vendors: ■Daewon (www.daewonspic.com) ■Kostat (www.kostat.com) Document , . They should remain secure in their TCFCBGA tray carriers except during transfer operations from tray to tray . You must use the correct TCFCBGA trays specified for the size and pin count of the thermal composite TCFCBGA. Table 4 lists the TCFCBGA tray specifications for the different TCFCBGA packages. Do


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PDF AN-657-1 KS-886H Kostat tray
tqfp 7x7 tray

Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
Text: m a teria l name xxx-xxxx-xxx TRAY MADE IN KOREA DETAIL " F" DAEWON VENDOR NAME TQFP , MEET ALL REQUIREMENTS OF AMKOR/ANAM # 0 1 -0 4 3 1 -2 2 8 3 PROCUREMENT SPEC FOR SHIPPING TRAY . 2 , . TOTAL USABLE CELL COUNT IS 250. 4. TRAY VACUUN PICKUP METHDD REQUIRES A S 8 MM SQUARE (MINIMUM) WALLED PICKUP AREA. LDCATED AS CLD SE TD THE CENTER DF THE TRAY AS IS PRACTICABLE. 5. CHAMFER DENOTES PACKAGE , ON SIDE OF TRAY AND SHALL BE CHANGED IN ALPHABETICAL ORDER (A ~ Z ) WHEN ANY CHANGE OF DIMENSIONS


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PDF A40553. A40626. tqfp 7x7 tray DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
1997 - JEDEC tray standard dimension

Abstract: strapex daewon tray daewon PACKING TRAYS JEDEC tray standard 13 DAEWON JEDEC TRAY loose fill packing material PXHIT-0003 TMS320C44
Text: Trays Into Tray Bundles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing the Tray Bundles Into the Inner Box . . . . . . . . . . . . . . . . . . . . . . . . . . 10 , The devices are first packed in trays. A tray bundle is then formed and is placed in a dry pack bag. The tray bundle (inside of a dry pack bag) is then placed inside an inner (JEDEC) box (this practice , devices into the JEDEC tray . Equipment - Grounded workstation Worktable with grounded conductive


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PDF TMS320C44 SPRZ114 JEDEC tray standard dimension strapex daewon tray daewon PACKING TRAYS JEDEC tray standard 13 DAEWON JEDEC TRAY loose fill packing material PXHIT-0003
PEAK MPPO PP6

Abstract: TRAY MPPO CABGA-208 DAEWON tray drawing IDT70V659S10BFG PEAK tray drawing daewon idt89h DAEWON drawing PEAK TRAY
Text: Tray Supplier Daewon Peak Supplier Part Number 12C-1515-119 Rev A NH BG1515 1.75 0718 , -196 & 208 shipped in tray Date Effective: Contact: Title: Phone #: Fax #: E-mail: 4/27/2009 , side of tray Attachment: Yes No Samples: N/A DESCRIPTION AND PURPOSE OF CHANGE: This , changes in number of units per tray from 112 to 126 and the tray Equipment dimensions. Material , products. Data Sheet Attachment III provides the existing and new tray drawings. Other - Packing


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PDF TB0812-03 CABGA-196 1515BF IDT70V658S15BFG IDT70V658S15BFI IDT70V659S10BF IDT70V659S10BFG IDT70V659S12BF IDT70V659S12BFG PEAK MPPO PP6 TRAY MPPO CABGA-208 DAEWON tray drawing IDT70V659S10BFG PEAK tray drawing daewon idt89h DAEWON drawing PEAK TRAY
12C-1313-119

Abstract: PEAK tray drawing daewon 89HPES4T4ZBBCGI PBGA144 DAEWON tray drawing TRAY MPPO daewon tray CABGA-144 PBGA-144
Text: Tray New Shipping Tray Supplier DAEWON PEAK Supplier Part Number 12C-1313-119 Rev A , part# on side of tray Attachment: Yes No Samples: N/A DESCRIPTION AND PURPOSE OF CHANGE , Equipment There are changes in number of units per tray from 126 to 160 and the tray Material dimensions , of affected products. Other - Packing Material Attachment III provides the existing and new tray , mm x 13 mm PBGA-144 & 13 mm x 13 mm CABGA-144. There are changes in number of units per tray from


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PDF TB0908-03 PBGA-144 CABGA-144 72V36110L7-5BB 72V36110L7-5BBG 72V36110L7-5BBGI 72V36110L7-5BBI 72V3640L6BB 72V3640L6BBG 72V3640L7-5BB 12C-1313-119 PEAK tray drawing daewon 89HPES4T4ZBBCGI PBGA144 DAEWON tray drawing TRAY MPPO daewon tray CABGA-144 PBGA-144
DAEWON tray drawing

Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
Text: 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY . 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220. 4. TRAY , THE CENTER TRAY AS IS PRACTICABLE. 5. CHAMFER DENDTES PACKAGE PIN#1 DRIENTATIDN. INTERPRET DIMENSIONS , EV ISIO N L E T T E R S H A L L BE EN GRAVED TD THE RIGHT OF THE SID NUMBER DN SIDE OF TRAY AND S H A , /SQUARE PER E IA , JE D E C , ACH TRAY SPECIFICATIONS. REV OO DESCRIPTION NTML RELEASE PER DCN #


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PDF 5M-1994. DAEWON tray drawing TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
1999 - f82c735a

Abstract: intel date code marking f82c735 tm1977b daewon 1420 daewon 6300HG B65555 intel code marking MARKING CODE may
Text: ) Material (mold compound, leadframe, tray supplier) Product Marking: (Ink to Laser) Forecasted Key Milestones: Date of Samples Availability: Tray Samples available: Date of Qualification Data Availability , -1420-2.7-0611-3 Ink No FPO # or S/Q Spec # Tray # Marking Method Marking Content Proposed ChipPAC in Korea Korea MP8000 Stamped Copper lead frame Daewon 827-3283-9 Laser Addition of FPO and S/Q Spec #


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PDF F82C735A B65555A f82c735a intel date code marking f82c735 tm1977b daewon 1420 daewon 6300HG B65555 intel code marking MARKING CODE may
1997 - JEDEC tray standard dimension

Abstract: strapex daewon DAEWON JEDEC TRAY PEAK TRAY TMS320C44 JEDEC tray standard 13
Text: Trays Into Tray Bundles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing the Tray Bundles Into the Inner Box . . . . . . . . . . . . . . . . . . . . . . . . . . 10 , The devices are first packed in trays. A tray bundle is then formed and is placed in a dry pack bag. The tray bundle (inside of a dry pack bag) is then placed inside an inner (JEDEC) box (this practice , devices into the JEDEC tray . Equipment - Grounded workstation Worktable with grounded conductive


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PDF TMS320C44 SPRZ114 JEDEC tray standard dimension strapex daewon DAEWON JEDEC TRAY PEAK TRAY JEDEC tray standard 13
hp6652a

Abstract: daewon DC100N TCXO dip 14 HP53131A HP665 MAS9270
Text: location. Supplier & Manufacturer : Daewon Precision Co. Ltd. 619-4, Hyosung-Dong, Keyang-Ku, Inchon , Software updates Total $96,300 Supplier & Manufacturer : Daewon Precision Co. Ltd. 619-4 , : www.daewoncrystal.com Page 8 of 8 Daewon Precision


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PDF DC100N: MAS9270Cxxx 64pcs) 000/ea 14pin 256pcs hp6652a daewon DC100N TCXO dip 14 HP53131A HP665 MAS9270
1996 - DAEWON tray tsop 48LD

Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon TRAY TSOP 56LD GRAINGER TRAY DAEWON TSOP daewon venturi meter
Text: tray only Thin tray only Thin tray only 3M 3M Daewon 3M 21002387145 21002386145 1220314 , Programming Procedures Tray Unstrap Incoming Visual Inspection Tray-to-Programmer Transfer , Process-Related Equipment Equipment Recommendation Table 3 Tray and Tape-In-Tube Packaging Material , table top coverings, etc. 5.1 Tray Unstrap 5.1.1 5.2 Use a razor blade type cutting tool , tray . Hold tray at 45 angle to optimize viewing for coplainarity ° (figure 1). Start at top row and


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1997 - IPC-J-STD-001

Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide JEDEC tray standard tsop R08-01-FOGO venturi meter optical Pick-Up head
Text: tray only Thin tray only 3M 3M Daewon 3M 21002387145 21002386145 1220314 21002385145 10 , Programming Process Procedures Tray Unstrap Incoming Visual Inspection Tray-to-Programmer Transfer , Recommendation Table 2 Miscellaneous Process-Related Equipment Equipment Recommendation Table 3 Tray and , wrist ground straps, smocks, ESD footwear, use ESD-protected table top coverings, etc. 5.1 Tray , adequate lighting. 5.2.1 Inspect packages while still in tray . Hold tray at 45° angle to optimize viewing


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2000 - S80C196NU

Abstract: S80C196NP25 SHINKO GXXXX S83C196KB16 S80C196KB16 daewon SB80C196KC20 S80C196NP S80C196KB
Text: . The changes are as follows: We will be adding Daewon as an additional supplier of the trays for the


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PDF mayB16 S80C196KB S83C196KB S83C196KB16 S87C196KB16 S80L196NP S80C196NP25 S80C196NU S80C196NP25 SHINKO GXXXX S80C196KB16 daewon SB80C196KC20 S80C196NP S80C196KB
Syntek Semiconductor 1261

Abstract: Nam Tai Electronics Es325 syntek Dynatek 110
Text: ;41-1-751-8061 TURKEY ITALY O DAEWON EUROPA S.R.L. Via Leonardo da vinci, 146 20090 Trezzano Sul Naviglio


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PDF SF-33720 Syntek Semiconductor 1261 Nam Tai Electronics Es325 syntek Dynatek 110
5461 AB

Abstract: srl 3040 pt
Text: DAEWON EUROPA S.R.L. Via Leonardo da vinci, 146 20090 Trezzano Sul Naviglio (Milano), Italy Tel .


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PDF SF-33720 5461 AB srl 3040 pt
75017

Abstract: No abstract text available
Text: 00520, Helsinki Finland Tel : 0-3515100 Fax :0-3515355 ITALY O DAEWON EUROPA S.R.L. Via Leonardo da


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PDF SF-33720 75017
1997 - CM16C550P

Abstract: sad1 diode smd 4.7 uf/50v smd capacitor NPN CD100 transistor SPER 1A1 C4 DIALCO 0.1 uf/50v smd capacitor C01100 clock 7 segment intel packaging handbook 240800
Text: 1.14.1 Tape and Reel . . . . . . . . . . . . 1.14.2 Thin Matrix Tray . . . . . . . . . . . 1.14.3 Moisture Sensitivity . . . . . . . . 1.14.3.1 Reel Rebaking . . . . . . . . . 1.14.3.2 Tray Rebaking . . , APPENDIX A: SCHEMATICS APPENDIX B: 80960Rx INTELLIGENT I/O BOARD BILL OF MATERIAL APPENDIX C: DAEWON SHIPPING TRAY APPENDIX D: COMPONENT SHIPPING REEL v CONTENTS FIGURES Figure 1-1. Figure 1-2 , includes schematics, Bill of Material, shipping tray and reel dimensions. See section 1.31, "References"


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PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P sad1 diode smd 4.7 uf/50v smd capacitor NPN CD100 transistor SPER 1A1 C4 DIALCO 0.1 uf/50v smd capacitor C01100 clock 7 segment intel packaging handbook 240800
2005 - intel 80219

Abstract: XScale 80219
Text: 41 3.3.3 Shipping Tray Vendor , Shipping Tray Vendor


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PDF 64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 intel 80219 XScale 80219
2003 - intel 80219

Abstract: 80219 XScale 80219 daewon tray daewon REQ64 PC200 PAR64 BGA 6x6 tray CC2538
Text: 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor


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PDF 64-bit/66 --64-bit/133 32-bit 64-bit --PC200 VCC33 intel 80219 80219 XScale 80219 daewon tray daewon REQ64 PC200 PAR64 BGA 6x6 tray CC2538
Supplyframe Tracking Pixel