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1623721-1 TE Connectivity Ltd SUPPORT PILLARS
BCV-FEC TE Connectivity Ltd SUPPORT PILLARS
BCV-FEC (1623721-1) TE Connectivity (1623721-1) SUPPORT PILLARS

cu pillar Datasheets Context Search

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cu pillar

Abstract:
Text: bumping or area array bumping, with either solder or Cu pillar bump technology. The fcCSP is based on , · Cu Pillar flip chip interconnect for finer bond pad pitches ·Available in 0.4 mm - 1.0 mm BGA ball , / Eutectic, Cu Pillar Encapsulant Epoxy mold compound Solder balls Eutectic, Pb-Free Test Services


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2013 - E700G

Abstract:
Text: , with either solder or Cu pillar bump technology. The fcCSP is based on Amkor's proprietary ChipArray , information. • Cu pillar flip chip interconnect for fine bond pitches down to 30 µm/60 µm staggered , ) – In-line: 80 µm – Array: 130 µm • Bump pitch ( Cu Pillar ) – In-line: 30/60 µm , €“ ELC4785GSB, ELC4785THB, ELC4785THG • Bump: Pb-Free, Eutectic, Cu Pillar • Encapsulant: Epoxy mold


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PDF DS577G E700G
HL832N

Abstract:
Text: area array bumping, with either solder or Cu pillar bump technology. The fcCSP is based on Amkor , peripheral, 150 µm min. for area array · Cu Pillar flip chip interconnect for finer bond pad pitches , substrate HL832N, ELC4785, DS7409, e679, GT Bump Pb-Free / Eutectic, Cu Pillar Encapsulant Epoxy mold


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amkor flip

Abstract:
Text: material sets TSV Based Package Architectures Si Interposer TSVs Pb Free FC Bumps Cu Pillar , Advanced wafer finishing technology capabilities: 200-300 mm wafer support system (WSS) Copper Pillar


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IPC-9701

Abstract:
Text: , ultra low alpha Eutectic, Lead Free, Cu Pillar Eutectic, Lead Free Please contact the Test Product


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PDF MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate "IPC-9701" amkor flip
HL832N

Abstract:
Text: Encapsulant Transfer molded epoxy Underfill Dispensed Bumps (F/C die) Pb-free, Eutectic, Cu Pillar


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2013 - DS7409HGB

Abstract:
Text: – Top die Non-conductive epoxy, film • Wire type Au, Cu or Ag • Encapsulant Transfer molded epoxy • Underfill Dispensed • Bumps (F/C die) Pb-free, Eutectic, Cu Pillar • Solder


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PDF DS820C DS7409HGB DS7409HG DS-7409HG FCCSP E700G HL832 HL832 nx-a
2009 - copper pillar solder

Abstract:
Text: using TriQuint’s proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for reduced , +0.18 V Typical Technology: 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 2.24 x 1.27 , levels. 3/ For this flip-chip die, the baseplate is a plane between the Cu /Sn pillars and the test , Chip edge to pillar dimensions are shown to center of pillar Pillar #4,12,18-25 DC Ground 0.075 Ø Pillar #5 Vg4 0.075 Ø Pillar #1, 3, 9, 11 RF CPW Ground 0.075 Ø Pillar


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PDF TGA4705-FC TGA4705-FC 2009E copper pillar solder
2008 - 77GHz Radar

Abstract:
Text: TriQuint's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for simplified assembly , um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 1.86 x 1.37 x 0.38 mm Measured Performance , maintained at the lowest possible levels. For this flip-chip die, the baseplate is a plane between the Cu /Sn , /- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar # 1 Pillar # 9 Pillar # 4 Pillar # 5 Pillar # 6 Pillar # 11 Pillar # 12 Pillar # 13 Pillar # 2, 8, 10, 15 Pillar # 3, 7, 14


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PDF TGA4706-FC 77GHz TGA4706-FC 77GHz Radar AT77 E-band mmic
2009 - cu pillar

Abstract:
Text: 's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for reduced source inductance , Typical Technology: 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 2.24 x 1.27 x 0.38 mm , the Cu /Sn pillars and the test board. For the TGA4705-FC, the critical pillars for thermal power , size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #4,12,18-25 DC Ground 0.075 Ø Pillar #5 Vg4 0.075 Ø Pillar #1, 3, 9, 11 RF CPW Ground


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PDF TGA4705-FC TGA4705-FC cu pillar automotive radar schematic diagram
2008 - Not Available

Abstract:
Text: designed using TriQuint's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for , with front-side Cu /Sn pillars Chip Dimensions: 3.38 x 1.37 x 0.38 mm Primary Applications · · , baseplate is a plane between the Cu /Sn pillars and the test board. For the TGC4704-FC, the critical pillars , Thickness: 0.380 Die x, y size tolerance +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #22 Pillar #10 Pillar #13 Pillar #9, 11, 12, 14, 21, 23 Pillar #20 Pillar #18 Pillar #17


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PDF TGC4704-FC 38ored TGC4704-FC
2009 - TGC4703-FC

Abstract:
Text: Cu / Sn pillar technology for simplified assembly and low interconnect inductance. Die reliability , front-side Cu /Sn pillars Chip Dimensions: 1.16 x 2.85 x 0.38 mm The TriQuint TGC4703-FC is a flip-chip , flip-chip die, the baseplate is a plane between the Cu /Sn pillars and the test board. For the TGC4703-FC , Units: millimeters Thickness: 0.380 Die x,y size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #22 RF In 0.075 Ø Pillar #7 Vd1 0.075 Ø


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PDF TGC4703-FC TGC4703-FC
2009 - 76-77GHz

Abstract:
Text: : 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 1.86 x 1.37 x 0.38 mm · · , band. The TGA4706FC is designed using TriQuint's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for simplified assembly and low interconnect inductance. Die reliability is enhanced , tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar # 1 RF IN 0.075 Ø Pillar # 9 RF OUT 0.075 Ø Pillar # 4 Vd1 0.075 Ø Pillar # 5 Vd2 0.075


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PDF TGA4706-FC TGA4706-FC TGA4706FC 76-77GHz cu pillar E-band mmic
2009 - cu pillar

Abstract:
Text: µm pHEMT process and front-side Cu / Sn pillar technology for reduced source inductance and superior , Technology: 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 2.24 x 1.27 x 0.38 mm Measured , maintained at the lowest possible levels. For this flip-chip die, the baseplate is a plane between the Cu /Sn , Units: millimeters Thickness: 0.380 Die x,y size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #4,12,18-25 Pillar #1, 3, 9, 11 Pillar #2 Pillar #10 Pillar #8 Pillar


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PDF TGA4705-FC TGA4705-FC cu pillar pillar
2009 - Not Available

Abstract:
Text: designed using TriQuint's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for reduced , Technology: 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 2.24 x 1.27 x 0.38 mm Measured , possible levels. For this flip-chip die, the baseplate is a plane between the Cu /Sn pillars and the test , : 0.380 Die x,y size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #4,12,18-25 Pillar #1, 3, 9, 11 Pillar #2 Pillar #10 Pillar #8 Pillar #7 Pillar #6 DC Ground RF


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PDF TGA4705-FC TGA4705-FC
2009 - Not Available

Abstract:
Text: designed using TriQuint’s proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for , Typical Technology: 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 3.38 x 1.37 x 0.38 mm , possible levels. 3/ For this flip-chip die, the baseplate is a plane between the Cu /Sn pillars and , pillar dimensions are shown to center of pillar Pillar #22 RF In 0.075 Ø Pillar #10 RF Out1 (Main) 0.075 Ø Pillar #13 RF Out2 (Coupled) RF CPW Ground Pillar #9, 11, 12, 14, 21


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PDF TGC4704-FC
2008 - pillar

Abstract:
Text: process and front-side Cu / Sn pillar technology for simplified assembly and low interconnect inductance , front-side Cu /Sn pillars Chip Dimensions: 1.16 x 2.85 x 0.38 mm Measured Performance Bias conditions: Vd , between the Cu /Sn pillars and the test board. For the TGC4703-FC, the critical pillars for thermal power , size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø 0.075 Ø Pillar #22 Pillar #11 Pillar #10, 12


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PDF TGC4703-FC TGC4703-FC pillar
2009 - Not Available

Abstract:
Text: µm pHEMT process and front-side Cu / Sn pillar technology for simplified assembly and low , um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 1.16 x 2.85 x 0.38 mm The TriQuint , the Cu /Sn pillars and the test board. For the TGC4703-FC, the critical pillars for thermal power , 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #22 RF In 0.075 Ø Pillar #7 Vd1 0.075 Ø Pillar #11 RF Out 0.075 Ø Pillar #3 Vd2a 0.075 Ã


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PDF TGC4703-FC
2009 - cu pillar

Abstract:
Text: µm pHEMT process and front-side Cu / Sn pillar technology for simplified assembly and low , with front-side Cu /Sn pillars Chip Dimensions: 3.38 x 1.37 x 0.38 mm The TriQuint TGC4704-FC is a , plane between the Cu /Sn pillars and the test board. For the TGC4704-FC, the critical pillars for , Thickness: 0.380 Die x, y size tolerance +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #22 RF In 0.075 Ø Pillar #10 RF Out1 (Main) 0.075 Ø Pillar #13 RF


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PDF TGC4704-FC cu pillar TGC4704-FC
2009 - HBT3 triquint

Abstract:
Text: 's proven HBT3 process and front-side Cu / Sn pillar technology for simplified assembly and low , size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #4, 7, 10, 12-15 Pillar #1, 3 DC Ground 0.075 Pillar #6 Prescaler Out (F/8+) 0.075 RF CPW Ground 0.075 Pillar #8 Vtune 0.075 Pillar #2 RF Out 0.075 Pillar #9 Vbb (Not Used) 0.075 Pillar #5 Prescaler Out (F/8-) 0.075 Pillar #11 Vcc 0.075


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PDF TGV2204-FC TGV2204-FC HBT3 triquint cu pillar HBT3 pillar
2009 - Not Available

Abstract:
Text: Technology: 0.13 um pHEMT with front-side Cu /Sn pillars Chip Dimensions: 1.86 x 1.37 x 0.38 mm • â , band. The TGA4706FC is designed using TriQuint’s proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for simplified assembly and low interconnect inductance. Die reliability is , tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar # 1 RF IN 0.075 Ø Pillar # 9 RF OUT 0.075 Ø Pillar # 4 Vd1 0.075 Ø Pillar # 5 Vd2


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PDF TGA4706-FC TGA4706-FC TGA4706FC
2009 - Not Available

Abstract:
Text: TriQuint’s proven HBT3 process and front-side Cu / Sn pillar technology for simplified assembly and low , : millimeters Thickness: 0.38 Die x,y size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #4, 7, 10, 12-15 Pillar #1, 3 DC Ground 0.075 Pillar #6 Prescaler Out (F/8+) 0.075 RF CPW Ground 0.075 Pillar #8 Vtune 0.075 Pillar #2 RF Out 0.075 Pillar #9 Vbb (Not Used) 0.075 Pillar #5 Prescaler Out (F/8-) 0.075 Pillar


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PDF TGV2204-FC TGV2204-FC
2009 - 77GHz Radar

Abstract:
Text: @ 77GHz RF-LO Isolation: 18 dB @ 77 GHz Bias: Vb = 1.1 V Technology: HBT with front-side Cu /Sn , band of DC ­ 100 MHz. The TGC4702FC is designed using TriQuint's proven HBT process and front-side Cu / Sn pillar technology for simplified assembly and low interconnect inductance. Die reliability is , size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #1,3,6,8,10, 11,13,16,18 RF CPW Ground 0.075 Ø Pillar #2 IF Out (I) 0.075 Ø Pillar #4


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PDF TGC4702-FC 77GHz TGC4702-FC 77GHz Radar 77GH PlO11
2009 - copper pillar solder

Abstract:
Text: size tolerance: +/- 0.050 (0.002) Chip edge to pillar dimensions are shown to center of pillar Pillar # 1 RF IN 0.075 Pillar # 5 RF OUT 1 0.075 Pillar # 9 RF OUT 2 0.075 Pillar # 12 RF OUT 3 0.075 Pillar # 16 RF OUT 4 0.075 Pillar # 3 Vd1 0.075 Pillar # 7 Vd2 0.075 Pillar # 14 Vd3 0.075 Pillar # 18 Vd4 0.075 Pillar # 20, 21 DC Ground 0.075 Pillar # 2, 4, 6, 8, 10, 11, 13, 15, 17, 19 RF CPW Ground


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PDF TGS4306-FC TGS4306-FC TGS4306FC TGS4306-FC, TGA4306-FC copper pillar solder E-band mmic RF substrate
2009 - Not Available

Abstract:
Text: (0.015). Die x, y size tolerance: +/- 0.050 (0.002) Chip edge to pillar dimensions are shown to center of pillar Pillar # 1 RF IN 0.075 1 Pillar # 5 RF OUT 1 0.075 1 Pillar # 9 RF OUT 2 0.075 1 Pillar # 12 RF OUT 3 0.075 1 Pillar # 16 RF OUT 4 0.075 1 Pillar # 3 Vd1 0.075 1 Pillar # 7 Vd2 0.075 1 Pillar # 14 Vd3 0.075 1 Pillar # 18 Vd4 0.075 1 Pillar # 20, 21 DC Ground 0.075 1 Pillar # 2, 4, 6, 8, 10, 11, 13


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PDF TGS4306-FC TGS4306-FC TGS4306FC TGS4306-FC, TGA4306-FC
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