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Ardent Concepts (35)

Electronic Interface Products

Ardent Concepts was founded in 2003 by Gordon Vinther & Steve Cleveland to meet the challenges and demands presented by engineers seeking to create the world’s fastest, highest performing electronic systems. Ardent’s Intellectual Property has enabled the creation of high-performance electronic interface products that provide exceptional signal integrity and design flexibility in a cost-effective package

Showing 1 to 35 of 35 entries
Datasheet PDF or ZIP
TR-AppNote-v4 - Application Note TR-AppNote-v4 : Application Note (PDF)
FXBM-28X4-2.54-24KM-1-SMD-REV-1-4 - Technical Drawing  - TR Blind Mate Test Head Interface FXBM-28X4-2.54-24KM-1-SMD-REV-1-4 : Technical Drawing  (PDF)
CA-Series-Datasheet01242017 - Brochure - Board to Board Specificiations CA-Series-Datasheet01242017 : Brochure (PDF)
WMED low power IO tutorial - Bryan Casper - Read about an industry leader and their view of Ardent’s high performing LGA Connectors - Chip to Chip Connectors WMED low power IO tutorial - Bryan Casper : Read about an industry leader and their view of Ardent’s high performing LGA Connectors (PDF)
IPAMP16X2-REV-A - IC Footprint Probe Drawing - IC Footprint Probe 4×2 IPAMP16X2-REV-A : IC Footprint Probe Drawing (PDF)
FPAMP16X2-REV-A - IC Footprint Probe Footprint - IC Footprint Probe 4×2 FPAMP16X2-REV-A : IC Footprint Probe Footprint (PDF)
IPAMP16X2-REV-A - IC Footprint Probe Drawing - IC Footprint Probe 2×2 IPAMP16X2-REV-A : IC Footprint Probe Drawing (PDF)
FPAMP16X2-REV-A - IC Footprint Probe Footprint - IC Footprint Probe 2×2 FPAMP16X2-REV-A : IC Footprint Probe Footprint (PDF)
TR16X2-2.54-XXXX-1-REV-A - Connector Drawing - TR70 16×2 TR16X2-2.54-XXXX-1-REV-A : Connector Drawing (PDF)
FP16X2-2.54-SL-1-REV-C - Stripline Footprint Drawing - TR70 16×2 FP16X2-2.54-SL-1-REV-C : Stripline Footprint Drawing (PDF)
FP16X2-2.54-MS-1-REV-C - Microstrip Footprint Drawing - TR70 16×2 FP16X2-2.54-MS-1-REV-C : Microstrip Footprint Drawing (PDF)
TRT-8X1-1.27-06-1-REV-A - Connector Drawing - TR for Superconducting Applications TRT-8X1-1.27-06-1-REV-A : Connector Drawing (PDF)
RC05-01-Sales+Model+Drawing - View Drawing - SP – Spring Probe interface RC05-01-Sales+Model+Drawing : View Drawing (PDF)
RCSpringProbe3 - Brochure - SP – Spring Probe interface RCSpringProbe3 : Brochure (PDF)
RC04-01-sample-connector - Drawing - SP – Spring Probe interface RC04-01-sample-connector : Drawing (PDF)
RC04-01-Sales-Model-Drawing - Drawing - SP – Spring Probe interface RC04-01-Sales-Model-Drawing : Drawing (PDF)
RC05-01-sample-connector - Drawing - SP – Spring Probe interface RC05-01-sample-connector : Drawing (PDF)
RC05-01-Sales-Model-Drawing - Drawing - SP – Spring Probe interface RC05-01-Sales-Model-Drawing : Drawing (PDF)
RC08-02-Sample-connector - Drawing - SP – Spring Probe interface RC08-02-Sample-connector : Drawing (PDF)
RC08-02-Sales-Model-Drawing - Drawing - SP – Spring Probe interface RC08-02-Sales-Model-Drawing : Drawing (PDF)
RC10-05-Sample-Connector-w-CE - Drawing - SP – Spring Probe interface RC10-05-Sample-Connector-w-CE : Drawing (PDF)
CROSS-SECTION - Drawing - SP – Spring Probe interface CROSS-SECTION : Drawing (PDF)
RC12-06-X-Section-Specification - Drawing - SP – Spring Probe interface RC12-06-X-Section-Specification : Drawing (PDF)
Intel-Top-Side-Interconnect-Formatted-Case-Study-FINAL1 - Semiconductor Industry Case Study – Top Side Interconnect Solution - Semiconductors Intel-Top-Side-Interconnect-Formatted-Case-Study-FINAL1 : Semiconductor Industry Case Study – Top Side Interconnect Solution (PDF)
ACI SC WP - ATE Test sockets - Semiconductors ACI SC WP : ATE Test sockets (PDF)
ConnectR-Brochure - Brochure ConnectR-Brochure : Brochure (PDF)
RCSpringProbe1 - Brochure RCSpringProbe1 : Brochure (PDF)
RCScrub R - Brochure RCScrub R : Brochure (PDF)
Board-to-board-connector Drawing - View Drawing - Board to Board Specificiations Board-to-board-connector Drawing : View Drawing (PDF)
Space-drawing - View Drawing - RC Space Transformer Interposer Space-drawing : View Drawing (PDF)
Intel-Top-Side-Interconnect-Formatted-Case-Study-FINAL - Chip to Chip Connector Case Study – Topside Interconnect - Chip to Chip Connectors Intel-Top-Side-Interconnect-Formatted-Case-Study-FINAL : Chip to Chip Connector Case Study – Topside Interconnect (PDF)
Ardent-Case-Study-BGA-test-socket-bc - Replacing Pogo Pins for a High Performance BGA Test Socket Solution. - Test Sockets – BGA/LGA Ardent-Case-Study-BGA-test-socket-bc : Replacing Pogo Pins for a High Performance BGA Test Socket Solution. (PDF)
Ardent-Case-Study-BGA-test-socket-Alt - High Performance fPGA Characterization Sockets. - Test Sockets – BGA/LGA Ardent-Case-Study-BGA-test-socket-Alt : High Performance fPGA Characterization Sockets. (PDF)
ScrubR WP - Ardent’s white paper - Test Sockets – QFN/QFP ScrubR WP : Ardent’s white paper (PDF)
Flex To Board Drawing - View Drawing - Test Sockets – High Speed Flex Devices Flex To Board Drawing : View Drawing (PDF)

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