The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

bga Shipping Trays Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - strapack s-669

Abstract: strapack d-52 Sivaron S 669 strapack MIL-I-8835A CAMTEX camtex trays s-669 strapping machine PQFP 176 J-Lead PEAK TRAY bga
Text: devices without carriers between trays Dry-packing J-lead, QFP, and BGA devices Shipping J-lead, QFP , tray is required as a cover. Shipping J-Lead, QFP & BGA Devices in Boxes When shipping trays , or BGA devices without carriers, see " Trays for QFP & BGA Devices without Carriers" on page 7 and , Stopper Black Foam Trays for QFP & BGA Devices without Carriers To hold QFP devices without carriers or BGA devices, use only Alteraapproved trays-full-sized Peak Plastic Corporation trays and 1/3


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2011 - daewon tray

Abstract: Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Text: BGA trays no higher than seven trays ï€ (for example, six trays containing devices and one cover tray). ■Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA , without carriers, QFP devices that have been extracted from carriers, and BGA devices only in trays , directly into trays . f For more information about handling QFP or BGA devices without carriers, refer to , , Foam, and Devices in a Tube Stopper Stopper Black Foam Trays for QFP, BGA , FBGA, and Lidless


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PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping


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PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
56mm carrier tape

Abstract: 28 pin ic TM 1628
Text: Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel , Packing Methods and Labels INTRODUCTION The world of shipping and handling is a hostile one in which , product for shipment and what labels are applied to the shipping boxes. All AMD packing methods are , tubes · Tray boxes for trays · Reel boxes for tape-and-reel carriers, including surftape Q-PACK boxes , have successfully passed all international shipping stress tests, thus, product is often shipped in a


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PDF 3027b 56mm carrier tape 28 pin ic TM 1628
1999 - Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC tray tsop 1220 BGA package tray 64 BGA and QFP Package 68 pin plcc socket view bottom gate count
Text: 10.43 10.43 16.07 23.3 84 1.980 2.170 2.670 x x x x Shipping Media: Trays , . Footprint (Inches) 1.780 UV Erasable Shipping Media: x Trays Comments / Footnotes Through , Max. Footprint (Inches) 0.640 Shipping Media Tubes x Tape & Reel x Trays x , Weight (gm) 1.15 Max. Footprint (Inches) 0.642 Shipping Media: Tape & Reel x Trays , copper signal traces in the package. In BGA & PGA packages, copper has been applied to provide a


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1998 - JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC TRAY PGA MATERIALS 100L PGA JEDEC tray JEDEC tray standard tsop
Text: 0.487 Section A-A [Dimensions in Inches] 240822-3 10.1.3 A5786-01 Trays Shipping trays , of plastic shipping trays , employs several handicapped agencies and reduces environmental waste , remaining shelf life. 10.5.2 Shipping Boxes and Cartons Intel products are placed in tubes or trays , Transport Media and Packing 10.1 Transport Media 10.1.1 10 Tubes Plastic shipping and , Environmental provides all shipping arrangements at no charge to the customer. Phone: 0500 34 10 40 Fax


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1997 - MIL-STD-81705

Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays tray bga INTEL PLCC 68 dimensions JEDEC TRAY DIMENSIONS AZ 2535 PLCC JEDEC tray PLCC 44 intel package dimensions
Text: TRANSPORT MEDIA AND PACKING 10.1.3. Trays Shipping trays are built in compliance with JEDEC thick and , of plastic shipping trays , employs several handicapped agencies and reduces environmental waste , remaining shelf life. 10.5.2. Shipping Boxes and Cartons Intel products are placed in tubes or trays , or , . Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an , CONFIDENTIAL (until publication date) 2 TRANSPORT MEDIA AND PACKING Table 10-1. PLCC Shipping Tube


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PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays tray bga INTEL PLCC 68 dimensions JEDEC TRAY DIMENSIONS AZ 2535 PLCC JEDEC tray PLCC 44 intel package dimensions
Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray drawing JEDEC Kostat DAEWON tray 48 daewon CERAMIC PIN GRID ARRAY CPGA AMD D-12G-56LD-A13
Text: . Figure 7.1 Trays protect product during shipping and handling and are suitable for product presentation , Chapter 7 Trays Tray Suppliers per Package Type (Continued) Package Plastic Ball Grid Array ( BGA , u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray , Revision A (3/1/03) 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to , . Trays are also suitable for product presentation to board assembly equipment. As standard practice


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PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray drawing JEDEC Kostat DAEWON tray 48 daewon CERAMIC PIN GRID ARRAY CPGA AMD D-12G-56LD-A13
2001 - EIA and EIAJ standards 783

Abstract: EIA standards 783 eia783 EIA 783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B ti packing label JEDEC tray standard
Text: isolation during shipping , handling, or processing. Trays are stacked and bound together to form standard , requires the following materials: · Stick magazines ( shipping tubes), trays , tape and reel · , shipment to end users. The methods employed are linked to the device level for shipping configuration keys , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine ( Shipping Tube) ­ Primary Component Container . . . . . . . . . . .


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PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 eia783 EIA 783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B ti packing label JEDEC tray standard
1999 - CBG064-052A

Abstract: csp process flow diagram CBG064 reballing 28F160C18 intel 845 MOTHERBOARD pcb CIRCUIT diagram BGA Solder Ball 0.35mm collapse intel MOTHERBOARD pcb design in micron tsop 48 PIN tray 28F3202C3
Text: reel or JEDEC trays with appropriate shipping material and shipped. 2.3 The Easy BGA and Intel , 1.60 Shipping Media Desiccant Pack 1 All products available in Tape & reel or Trays Refer to , types of shipping media, tape and reel (T/R) and JEDEC trays . 4.2 Shipping Media Shipping media is , Orientation JEDEC Trays 16 4.2.4 CSP Shipping Media Orientation CSP shipping media orientation is , . 2.3 The Easy BGA and Intel® Stacked-CSP Process Flow


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1998 - MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 peak tray MIL-STD-81705 D 2498 tray datasheet bga bga Shipping Trays transport media and packing transistor databook
Text: 0.487 Section A-A [Dimensions in Inches] 240822-3 10.1.3 A5786-01 Trays Shipping trays , program offer a nominal cash reimbursement but it lowers the cost of plastic shipping trays , employs , Transport Media and Packing 10.1 Transport Media 10.1.1 10 Tubes Plastic shipping and , Environmental provides all shipping arrangements at no charge to the customer. Phone: 0500 34 10 40 Fax , Shipping Tube Dimensions (In Inches) Lead Type Cross Section (W x H) Outside Dimensions Wall


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1999 - BGA PACKAGE TOP MARK intel

Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document , Molded Thin JEDEC Tray Parameters for Easy BGA Packages . 5 Shipping Media and Socket , are in millimeters 5 Easy BGA Mechanical Specification 3.4 Shipping Media and Socket Ordering Information for Easy BGA Package 3.4.1 Ordering Information Shipping media and off-board , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and


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PDF 28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
2000 - EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension EIA standards 783 EIA-481-x abstract for water level indicator JEDEC Matrix Tray outlines EIA 783 QFP Shipping Trays EIA-783 EIA 481 TSSOP
Text: . Single-Stick-Magazine Shipping Tube · Trays ­ The IC shipping tray contains the components during , require component lead isolation during shipping , handling, or processing. Trays are stacked and bound , shipment to end users. The methods employed are linked to the device level for shipping configuration keys , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine ( Shipping Tubes) ­ Primary Component Container . . . . . . . . . . .


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PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension EIA standards 783 EIA-481-x abstract for water level indicator JEDEC Matrix Tray outlines EIA 783 QFP Shipping Trays EIA-783 EIA 481 TSSOP
A7647

Abstract: A7647-01 A7190-01 socket s1 REFLOW socket 615-PIN BGA PACKAGE TOP MARK intel A7646-01 PERFORMANCE CHARACTERISTICS OF IC PACKAGES A719-0 outline of the heat sink for Theta JC
Text: X Weight (grams) Max. Footprint (mm) nominal Shipping Media Trays Desiccant Comments , Package Shipping Media PPGA shipping trays are compliant to JEDEC standards. All external dimensions of , Package 13.5.2.1 FC-PGA package shipping media FCPGA shipping trays are of JEDEC style and may be , shipping trays , the seating plane has been adjusted to accommodate these packages within the top and , material. Shipping trays are no longer color coded by particular product. Color standardization by process


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2005 - JEDEC Matrix Tray outlines

Abstract: ti packing label dck3 EIA-468 label location QFP Shipping Trays tray bga 64 dbv4 EIA standards 783 EIA-481-x EIA-783
Text: require component lead isolation during shipping , handling, or processing. Trays are stacked and bound , requires the following materials: · Stick magazines ( shipping tubes), trays , tape and reel · , shipment to end users. The methods employed are linked to the device level for shipping configuration keys , shipping configurations. This application report documents TI's three main shipping methods and typical , . . . . . . . 5 Stick Magazine ( Shipping Tube) - Primary Component Container . . . . . . . . . . .


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PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 EIA-468 label location QFP Shipping Trays tray bga 64 dbv4 EIA standards 783 EIA-481-x EIA-783
1998 - intel 04195

Abstract: BGA package tray 40 x 40 uBGA device MARKing intel T1234567 F800B3 04195 28F160B3 JEDEC tray standard 13 INTEL LOT NUMBER code label Shipping Trays
Text: Diagram 4.4.2 Shipping Labels The µBGA package is packed into T/R and trays , then sealed in , 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media , : 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel (T/R , high volume method for shipping the µBGA package from Intel to customers. Shipping Media Selection As the industry moves into smaller packages with more features, the shipping media is constantly


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PDF paC/85 intel 04195 BGA package tray 40 x 40 uBGA device MARKing intel T1234567 F800B3 04195 28F160B3 JEDEC tray standard 13 INTEL LOT NUMBER code label Shipping Trays
Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764 Intel reflow soldering profile BGA LEAD FREE
Text: . For tray dimensions please refer to Chapter 10 of this data book. The JEDEC style shipping trays are , different types of shipping trays . Intel will pay all shipping costs associated with the return. 14.6.2 , the user of Intel BGA products obtain a product data sheet that shows the tape and reel shipping , Ball Grid Array ( BGA ) Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has , mount. Normally, because of the larger ball pitch (typically 1.27 mm) of a BGA over a QFP or PQFP, the


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1995 - PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Text: stacks of 2 to 7 trays for storage. Follow these guidelines when you strap trays together for shipping , . Shipping J-Lead & QFP Devices in Boxes When shipping trays or tubes of devices, use only boxes that have , prevent trays or tubes from shifting position during shipping . Boxes should contain enough filler material , devices Shipping J-lead and QFP devices in boxes Handling J-Lead Devices To protect device leads and , transferred. Storing & Shipping J-Lead Devices Store and ship J-lead devices in tubes sealed with stoppers


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1995 - camtex trays

Abstract: MIL-I-8835A QFP Shipping Trays TQFP Shipping Trays exposed QFP 144 ND07071 CAMTEX ND-1414-1 Drypacked Devices MIL-B-81705C
Text: storage. Follow these guidelines when you strap trays together for shipping : s s s s s Use , J-Lead & QFP Devices in Boxes When shipping trays or tubes of devices, use only boxes that have , contents and prevent trays or tubes from shifting position during shipping . Boxes should contain enough , QFP devices Dry-packing J-lead and QFP devices Shipping J-lead and QFP devices in boxes To , stored, shipped, and transferred. Storing & Shipping J-Lead Devices Store and ship J-lead devices in


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1999 - PBGA 256 reflow profile

Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile BGA OUTLINE DRAWING BGA and QFP Package land pattern BGA 0.75 bga Shipping Trays A5825-01
Text: ) 2.60 17.20 27.20 31.20 Shipping Media: Tape & Reel X Trays X X X X X , Handling: Shipping Media 14.6.1 Mid-temperature Thin Matrix Tray The BGA packages are shipped in , manufacturing. For tray dimensions please refer to Chapter 10 of this data book. The JEDEC style shipping trays , for the different types of shipping trays . Intel will pay all shipping costs associated with the , prevention of "popcorning" of the package body or encapsulation material. BGA components, before shipping


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2000 - smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 BGA reflow guide P6K6 k5m6 Senju metal flux T5 K793 SMD CODE G7
Text: 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper , . Figure 1. Packaging Trends Package trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid , Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare , . The MicroStar BGA family comes in a range of solder ball pitch (0.5 mm, 0.8 mm, and 1.0 mm). , 's MicroStar BGA package. Figure 2. Structure of TI's MicroStar BGA Conforms to JEDEC Outlines: MO-192 and


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PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 BGA reflow guide P6K6 k5m6 Senju metal flux T5 K793 SMD CODE G7
1999 - PCB design for very fine pitch csp package

Abstract: Senju Senju metal solder paste Modified Coffin-Manson Equation Calculations 179GHH B12-246 37K-1 Semicon volume 1 N12114 senju solder bar
Text: September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled , Package trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid array) 1.27 mm ball pitch , chip (flip chip) · PWB/ASSY cost up CSP (chip scale pkg.) solution Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare chip (bump) Pin count , interconnect between the package substrate and the board on which the package is soldered. The MicroStar BGA


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PDF SSYZ015A PCB design for very fine pitch csp package Senju Senju metal solder paste Modified Coffin-Manson Equation Calculations 179GHH B12-246 37K-1 Semicon volume 1 N12114 senju solder bar
2002 - ST FP BGA solder

Abstract: No abstract text available
Text: including PLCC, QFP, BGA , and PGA, can be employed on both the top side (for FPGA) and bottom side (for , information on the design conversion, reliability testing, prototyping procedures, shipping method, and , Actel Extender. If the footprint on the existing board is PGA or BGA , the Extender board will have an , to be assembled on the motherboard the same way a manufacturer would assemble a BGA package. Figure 2 , common footprints for ASICs and FPGAs are PGA, BGA , and QFP. The PGA pin format, with 0.100" pin pitch in


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PDF PQ208 ST FP BGA solder
1998 - CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack 240817 lccs 28 footprint Single Edge Contact (S.E.C.) Cartridge: QFP 64 Cavity package PCB footprint cqfp 132
Text: x 1.980 2.170 2.670 x x x x Shipping Media: Trays Comments / Footnotes , ) Max. Footprint (Inches) UV Erasable x Shipping Media: Carrier x Trays Comments , UV Erasable Shipping Media: x Trays Comments / Footnotes Through Hole Use Only Table 1-8 , x x x x x x x x UV Erasable Shipping Media: Tubes Tape & Reel Trays , ) 0.640 Shipping Media Tubes x Tape & Reel x Trays x Desiccant Pack x Comments


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IPC-9701

Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Text: -034 compliant, 0.8 and 1.0mm BGA pitch Thermal Performance Flip Chip Molded Ball Grid Array (FCMBGA) Packages: Amkor's flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal , that replaces traditional capillary underfill to assemble larger die (20mm) onto BGA substrates , support · Available test/handling technology · Burn-in Shipping Options FCMBGA Cross Section The product is shipped in standard JEDEC trays www.amkor.com With respect to the information in this


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PDF MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate amkor flip "IPC-9701"
Supplyframe Tracking Pixel