CABGA |
|
Amkor Technology
|
ChipArray Packages |
|
Original |
PDF
|
CBGA |
|
Amkor Technology
|
From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. |
|
Original |
PDF
|
CDIP |
|
Amkor Technology
|
Ceramic Dual-Inline Package |
|
Original |
PDF
|
CERDIP |
|
Amkor Technology
|
Ceramic Dual-Inline Package |
|
Original |
PDF
|
CERPAK |
|
Amkor Technology
|
Ceramic Pack |
|
Original |
PDF
|
CLGA |
|
Amkor Technology
|
Ceramic Land Grid Array Package |
|
Original |
PDF
|
CMCM |
|
Amkor Technology
|
Ceramic Multi-Chip Module Package |
|
Original |
PDF
|
CPGA |
|
Amkor Technology
|
Ceramic Pin Grid Array Package |
|
Original |
PDF
|
CQFP |
|
Amkor Technology
|
Ceramic Quad Flat Pack Package |
|
Original |
PDF
|
CSOIC |
|
Amkor Technology
|
Ceramic Small Outline Integrated Circuit Package |
|
Original |
PDF
|
CSPNL |
|
Amkor Technology
|
Wafer Level Packaging |
|
Original |
PDF
|
CSSOP |
|
Amkor Technology
|
Ceramic Shrink Small Outline Package |
|
Original |
PDF
|
CTBGA |
|
Amkor Technology
|
ChipArray Packages |
|
Original |
PDF
|
CVBGA |
|
Amkor Technology
|
ChipArray Packages |
|
Original |
PDF
|
|
ETCSP |
|
Amkor Technology
|
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. |
|
Original |
PDF
|
FCCSP |
|
Amkor Technology
|
a flip chip solution in a CSP package format. |
|
Original |
PDF
|
FLATPACK |
|
Amkor Technology
|
Ceramic Flat Pack Package |
|
Original |
PDF
|
LCC |
|
Amkor Technology
|
Leadless Chip Carrier Package |
|
Original |
PDF
|
LQFP |
|
Amkor Technology
|
Low Profile Quad Flat Pack (LQFP) Packages |
|
Original |
PDF
|
LQFPPOWERQUAD2 |
|
Amkor Technology
|
LQFP PowerQuad 2 Packages |
|
Original |
PDF
|