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    AMKOR Search Results

    AMKOR Datasheets (30)

    Part ECAD Model Manufacturer Description Curated Type PDF
    CABGA Amkor Technology ChipArray Packages Original PDF
    CBGA Amkor Technology From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. Original PDF
    CDIP Amkor Technology Ceramic Dual-Inline Package Original PDF
    CERDIP Amkor Technology Ceramic Dual-Inline Package Original PDF
    CERPAK Amkor Technology Ceramic Pack Original PDF
    CLGA Amkor Technology Ceramic Land Grid Array Package Original PDF
    CMCM Amkor Technology Ceramic Multi-Chip Module Package Original PDF
    CPGA Amkor Technology Ceramic Pin Grid Array Package Original PDF
    CQFP Amkor Technology Ceramic Quad Flat Pack Package Original PDF
    CSOIC Amkor Technology Ceramic Small Outline Integrated Circuit Package Original PDF
    CSPNL Amkor Technology Wafer Level Packaging Original PDF
    CSSOP Amkor Technology Ceramic Shrink Small Outline Package Original PDF
    CTBGA Amkor Technology ChipArray Packages Original PDF
    CVBGA Amkor Technology ChipArray Packages Original PDF
    ETCSP Amkor Technology the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. Original PDF
    FCCSP Amkor Technology a flip chip solution in a CSP package format. Original PDF
    FLATPACK Amkor Technology Ceramic Flat Pack Package Original PDF
    LCC Amkor Technology Leadless Chip Carrier Package Original PDF
    LQFP Amkor Technology Low Profile Quad Flat Pack (LQFP) Packages Original PDF
    LQFPPOWERQUAD2 Amkor Technology LQFP PowerQuad 2 Packages Original PDF