The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
SN74HCT273ANSR Texas Instruments Octal D-Type Flip-Flops With Clear 20-SO
SN74HCT273ANSRG4 Texas Instruments Octal D-Type Flip-Flops With Clear 20-SO
SN74HCT273ANSRE4 Texas Instruments Octal D-Type Flip-Flops With Clear 20-SO
CD40175BW Texas Instruments CMOS Quad D-Type Flip-Flop 0-WAFERSALE
HCS109HMSR Intersil Corporation HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED J-KBAR FLIP-FLOP, COMPLEMENTARY OUTPUT, UUC16, DIE-16
HCTS74KMSR Intersil Corporation HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP14, CERAMIC, DFP-14

amkor flip Datasheets Context Search

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amkor flip

Abstract: 3D-IC 3D IC TSV 3D IC cu pillar 50um silicon die attach amkor Cu pillar FCCSP
Text: µBumps Courtesy of Xilinx, TSMC, Amkor Flip Chip Stack of Micro-Bumped Die to TSV Based Silicon , & Flip Chip Stacking Through silicon via (TSV) interconnects are emerging to serve a wide range of , dicing · Thinned die flip chip bonding · Thinned die flip chip stacking · Green, low stress , with TSVs & µBumps www.amkor.com visit amkor technology online for locations and to view the most current product information. TS 107A 06'11 Amkor is focused on developing technology


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IPC-9701

Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Text: -034 compliant, 0.8 and 1.0mm BGA pitch Thermal Performance Flip Chip Molded Ball Grid Array (FCMBGA) Packages: Amkor 's flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal , per IPC9701 · 3500 cycles 0 to 100C, 1.5 cycles/hour visit amkor technology online for locations , document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or


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PDF MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate amkor flip "IPC-9701"
BGA 64 PACKAGE thermal resistance

Abstract: CABGA 6x6 FCCSP bga 9x9 Shipping Trays CABGA 8X8 fcBGA PACKAGE thermal resistance amkor flip flip chip bga 0,8 mm BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP (fcCSP) package - a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wirebond interconnect. The advantages of flip chip , die bumps and the elimination of wirebond loops. Current wafer bump technology and flip chip


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PDF 63Sn/37Pb) BGA 64 PACKAGE thermal resistance CABGA 6x6 FCCSP bga 9x9 Shipping Trays CABGA 8X8 fcBGA PACKAGE thermal resistance amkor flip flip chip bga 0,8 mm BGA 256 PACKAGE thermal resistance BGA45
1292 BGA

Abstract: amkor flip flip chip bga 0,8 mm FOOTPRINTS USE BY AMKOR Flip Chip Substrate X3941 amkor
Text: LAMINATE data sheet Super FC® Features: Super FC® Packages: Amkor 's SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a , technologies. Implementing process technology licensed from industry leader LSI logic, Amkor 's SuperFC package uses solder bump flip chip interconnect and can route over 1000 signal traces from a single die , ultrafine line/space metallization, SuperFC has the highest routing density available. Using flip chip


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cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP chiparray amkor CABGA 48 7x7 amkor cabga thermal resistance ELC4785 flip chip bga 0,8 mm
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP (fcCSP) package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wirebond interconnect. The advantages of flip chip interconnect , loops. Current wafer bump technology and flip chip assembly process allows for peripheral flip chip


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HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound CABGA 6x6 amkor cabga thermal resistance cu pillar flip chip bga 0,8 mm amkor Cu pillar bga 9x9 Shipping Trays
Text: data sheet fcCSP Features: LAMINATE fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP (fcCSP) package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wirebond interconnect. The advantages of flip chip interconnect , . Current wafer bump technology and flip chip assembly process allows for peripheral flip chip bumping or


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JEDEC Jc-11 free

Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip mold cap 0.65mm pitch BGA Amkor Wafer level mold compound Amkor mold compound
Text: : After three years of development in package stacking technology and infrastructure, Amkor launched the , , PSvfBGA had become the fastest growing new package platform in Amkor 's four decade history, reflecting the strong industry adoption of PoP and Amkor 's technology leadership. PSvfBGA supports single die, stacked die using wirebond or hybrid (FC + wirebond) stacks and has been applied for flip chip (FC , a transition from wirebond to flip chip die designs. Flip chip enables the use of an exposed die


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PDF wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip mold cap 0.65mm pitch BGA Amkor Wafer level mold compound Amkor mold compound
2013 - E700G

Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wirebond interconnect. The advantages of flip chip interconnect are multiple: it , technology and flip chip assembly process allows for peripheral flip chip bumping or area array bumping


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PDF DS577G E700G
2013 - DS7409HGB

Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Text: utilizes Amkor 's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor 's fcCSP technology. This broad high volume infrastructure enables the rapid , attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount package. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. As a result, Amkor has established industry leadership


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PDF DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
joint filler board

Abstract: thick bga die size Amkor mold compound MS-034 amkor flip with or without underfill
Text: LAMINATE data sheet FCMBGA Thermal Performance: Flip Chip Molded Ball Grid Array , . FCMBGA has been qualified to MRT L3 245 °C and has completed Amkor 's internal Level B qualification. · , completed BLR testing* · 3500 cycles 0 to 100 °C, 1.5 cycles/hour IN A Reliability: IM Amkor 's FCMBGA is the evolution of the SuperFC® high performance flip chip solution. Capillary underfill (CUF , real estate use, by allowing closer spacing between passives and the flip chip die, better warpage


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HL832N

Abstract: ELC4785 E679 DS7409 MO-298 amkor flip DS820B MO-195 MO-192 HL832
Text: FlipStack® CSP family utilizes Amkor 's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor 's fcCSP technology. This broad high volume infrastructure enables the , , advanced wafer thinning, die attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount package. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. As a result, Amkor has


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amkor flip

Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: / WSCSP / WLP) Wafer Level Packaging Amkor 's wafer level packaging service meets the industry's growing , acquisition of Unitive®, Amkor has adopted the CSPnl as its standard wafer level package offering. CSPnl , reliability. Amkor 's CSPnl has been widely adopted as the industry standard for cost effective, reliable , Unitive®, Amkor is able to offer a full turnkey solution for wafer level products. The CSPnl Bump on , array packages. CSPnl is also available in Bump on Redistribution option. Amkor 's wafer bumping and


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amkor RDL

Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: ) Wafer Level Packaging Amkor 's wafer level packaging service meets the industry's growing demand for , acquisition of Unitive®, Amkor has adopted the CSPnl as its standard wafer level package offering. CSPnl , reliability. Amkor 's CSPnl has been widely adopted as the industry standard for cost effective, reliable , Unitive®, Amkor is able to offer a full turnkey solution for wafer level products. CSPnl is a true wafer , cost benefits associated with other JEDEC standard area array packages. Amkor 's wafer bumping and


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CSPNL

Abstract: amkor RDL wafer map format amkor amkor flip amkor polyimide amkor Sip FCCSP wafer map
Text: performance packaging options, such as Flip Chip CSP (fcCSP) and System in Package (SiP). Amkor truly , Redistribution (RDL) (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor 's wafer level packaging , Scale Package) products. Through the acquisition of Unitive®, Amkor has adopted the CSPnl as its , as demonstrated by its proven benchmark reliability. Amkor 's CSPnl has been widely adopted as the , die processing technologies developed by Unitive®, Amkor is able to offer a full turnkey solution for


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95Pb

Abstract: FCCSP amkor RDL
Text: high performance packaging options, such as Flip Chip CSP (fcCSP) and System in Package (SiP). Amkor , CSPnlTM Amkor 's wafer level packaging service meets the industry's growing demand for full turnkey , , Amkor has adopted the CSPnlTM as its standard wafer level package offering. CSPnlTM represents the next level in wafer level chip scale packaging as demonstrated by its proven benchmark reliability. Amkor , processing and testing services as well as new die processing technologies developed by Unitive, Amkor is


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maxim CODE TOP MARKING

Abstract: Pb95Sn5 maxim TOP MARKING ANALOG DEVICES ASSEMBLY DATE CODE garrou wafer-level packaging has arrived Maxim ic date code philip IC marking dALLAS MARKING CODE Maxim date code DS2431 maxim assembly of code
Text: Maxim > App Notes > 1-Wire® Devices General Engineering Topics Keywords: flip , chip, scale , using or abandoning a device in a new design. This article first defines the terms " flip chip" and , flip chip/UCSP by its marking; the reliability of wafer-level packaged parts; and finding applicable , . Frequently used descriptive names are: flip chip (STMicroelectronics and Dallas Semiconductor®), CSP , ), bumped die, and MicroCSP (Analog Devices). At Maxim®/Dallas Semiconductor, the terms " flip chip" and


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PDF DS2482-101: DS2502: DS2762: com/an4002 AN4002, APP4002, Appnote4002, maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING ANALOG DEVICES ASSEMBLY DATE CODE garrou wafer-level packaging has arrived Maxim ic date code philip IC marking dALLAS MARKING CODE Maxim date code DS2431 maxim assembly of code
WLCSP flip chip

Abstract: WLCSP smt 0.3mm pitch csp package WLCSP PBO design WLCSP chip mount wlcsp inspection amkor RDL amkor polyimide system in package amkor flip WLCSP underfill
Text: solution. In addition, Amkor is able to integrate its wafer bumping products into high performance packaging options, such as Flip Chip CSP (fcCSP) and System in Package (SiP). Amkor truly provides one-stop , / WSCSP / WLP) Amkor offers Wafer Level Chip Scale Packaging (WLCSP) to form solder bumps on device I/O , industry-standard surface mount assembly and reflow techniques, and does not require underfill. Amkor provides wafer , time-to-market objectives. visit amkor technology online for locations and · 4 - 196 ball count · 0.8 mm ­


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2008 - Not Available

Abstract: No abstract text available
Text: UNISEM UNISEM UNISEM UNISEM UNISEM AMKOR UNISEM UNISEM AMKOR UNISEM UNISEM AMKOR UNISEM AMKOR UNISEM UNISEM UNISEM UNISEM THERMAX AMKOR /UNISEM(R THJC) UNISEM UNISEM UNISEM UNISEM , PRINTED CARSEM AMKOR AMKOR AMKOR AMKOR AMKOR AMKOR UNISEM UNISEM UNISEM UNISEM UNISEM , PACKAGE, ADD θJa INFO OF MLF1212D, TMLF1010Q & TMLF2025Q FLIP CHIP PACKAGES REV. B 5 OF 4


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PDF K8692 K8942 OT223 MLF1212D, TMLF1010Q TMLF2025Q 102607PM01 121008PM01
JEDEC Jc-11 free

Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
Text: infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of , fastest growing new product in Amkor 's history, reflecting the broad industry benefits of PoP and Amkor , . Amkor is committed to maintain strong development and production capabilities to ensure we are forefront in meeting next generation PoP requirements. Amkor has expanded our comprehensive PoP family and , 's miniaturization, higher density and performance enhancement requirements. In 2006 Amkor 's PoP family ramped


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PCN0214

Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
Text: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera® BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change: In order to have multiple sources for Altera's BGA and FineLine BGA products, Altera has introduced Amkor in Korea, Amkor in , EP20K600C 1020-Ball FineLine BGA Feb 2003 April 2003 Note: The StratixTM flip-chip BGA and flip


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PDF PCN0214 packagesK1500E 1020-Ball EP20K600E 672-Ball EP20K400 EP20K400E PCN0214 Altera bga BGA PACKAGE OUTLINE EP1M120 EP20K1000E EPXA10 amkor flip alsic
2013 - TSMC 0.18Um

Abstract: No abstract text available
Text: , Quick Pak SPIL ChipMOS UTAC Fujitsu Amkor Korea CODE A B C D E G J K M PACKAGE TYPE , Free) and Lead Free package with Cu Bond Wires C Flip Chip F NOTE: The following FG’s


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PDF 6815-LA1-GR TW6816-LA1-GR TW6817-LA1-GR TW6818-LA1-GR TW6932-LA1-GR 1-888-INTERSIL TSMC 0.18Um
Not Available

Abstract: No abstract text available
Text: h -sp e e d , m a s te r-s la v e D -type flip -flo p s w ith d iffe re n tia l o u tp u ts, d e s , re use as c lo c k in g c o n tro l fo r th e flip -flo p s . D ata is c lo c k e d into th e flip , TYPOGRAPHICAL ERROR. CONVERT DWG FROM DESIGNER TO AUTOCAD REL, 12, REFERENCE AMKOR DWG, NO, 3 4 8 5 5 REV. 00


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PDF SY10E151 SY100E151 110OMHz MC10E/100E151
Not Available

Abstract: No abstract text available
Text: h e S Y 10 /1 00 E L 51 are d iffe re n tia l c lo c k D flip -flo p s w ith rese t. T h e s e d e , s te r p o rtio n o f the flip -flo p w h e n th e c lo c k is LO W and is tra n s fe rre d to th e , e trig g e re d flip -flo p . T h e d iffe r e n tia l in p u t e m p lo y s c la m p c ir c u itr , NEW OUTLINE DRAWING. CONVERT TO AUTOCAD, REFERENCE AMKOR DWG, NO, 0 0 0 1 9 REV.05. MAKE ( f t SAME


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PDF SY10EL51 SY100EL51 475ps T02ir
Not Available

Abstract: No abstract text available
Text: h -sp e e d , m a s te r-s la v e D -type flip -flo p s w ith d iffe re n tia l o u tp u ts, d e s , re use as c lo c k in g c o n tro l fo r th e flip -flo p s . D ata is c lo c k e d into th e flip , DESIGNER TO AUTOCAD REL< 12, REFERENCE AMKOR DWG, NO» 3 4 8 5 5 REV. 00 , CONVERT DWG TO REL. 13 AND ONE


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PDF SY10E151 SY100E151 110OMHz MC10E/100E151
Not Available

Abstract: No abstract text available
Text: h e S Y 10 /1 00 E L 51 are d iffe re n tia l c lo c k D flip -flo p s w ith rese t. T h e s e d e , s te r p o rtio n o f the flip -flo p w h e n th e c lo c k is LO W and is tra n s fe rre d to th e , e trig g e re d flip -flo p . T h e d iffe r e n tia l in p u t e m p lo y s c la m p c ir c u itr , NEW OUTLINE DRAWING. CONVERT TO AUTOCAD, REFERENCE AMKOR DWG, NO, 0 0 0 1 9 REV.05. MAKE ( f t SAME


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PDF SY10EL51 SY100EL51 475ps T02ir
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