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ablebond 84-3J

Abstract: CRM-1151 SUMITOMO g600f sumitomo EME G600 ablebond 8006ns SUMITOMO CRM-1151 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm
Text: Sumitomo EME 6600CGL 252 mils x 252 mils Q14939 Ablebond 84-3J Slug 205 mils x 290 mils Gold 1.20 mils Cu w , Sumitomo G600 225 mils x 310 mils NA Ablestik 8006NS Exposed Pad 205 mils x 290 mils Gold 1.20 mils Cu w/Ag


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PDF MIL-STD-1553 PCN1201 20L-SOIC ablebond 84-3J CRM-1151 SUMITOMO g600f sumitomo EME G600 ablebond 8006ns SUMITOMO CRM-1151 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm
Ablebond

Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Text: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND ® 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND ® 2815A die attach adhesive offers high thermal conductivity to minimize thermal , moisture absorption Typical Uncured Properties Filler Type ABLEBOND 2815A Test Method Silver , viscosity @ RT ATM-0087 1 year ATM-0068 ABLEBOND 2815A 6.8% Test Description 10 x 10 mm Si , ABLEBOND 2815A < 10 ppm < 10 ppm < 10 ppm Test Description Test Method Teflon flask, 5 gm


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Ablebond 84-1*SR4

Abstract: Ablebond 84-1LMISR4 ablebond 8290 84-1lmisr4 Ablebond SUMITOMO g600 Sumitomo 6730B SP491ECN-L sp26lv431 SP3232EEN-L
Text: Sumitomo G600 DIE ATTACH MATERIAL From To Ablebond 84-1LMISR4 Ablebond 8290 Ablebond 84-1LMISR4 Ablebond 8290 Ablebond 84-1LMISR4 Ablebond 8290 There is no change to Form, Fit, or Function as stated


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PDF SOICN-14 SOICN-16 6730B-L 84-1LMISR4 Abl691AEN-L/TR SP26LV432CN-L SP26LV432CN-L/TR SP26LV431CN-L SP26LV431CN-L/TR Ablebond 84-1*SR4 Ablebond 84-1LMISR4 ablebond 8290 84-1lmisr4 Ablebond SUMITOMO g600 Sumitomo 6730B SP491ECN-L sp26lv431 SP3232EEN-L
Not Available

Abstract: No abstract text available
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1818, JESD78,
Sumitomo EME-G600 material

Abstract: Ablestik 8290 Ablecube EME-G600 thermal conductivity ablebond 8290 ablestik 8390 Ablebond 84-1*SR4 EME-G600 Ablebond 8390 Ablebond 84-1LMISR4
Text: . Page 4 of 9 ABLEBOND ® 8290 MEDIUM STRESS DIE ATTACH ADHESIVE DESCRIPTION Ablebond ® 8290 , Specification. 12/01 Ablebond 8290 PHYSIOCHEMICAL PROPERTIES POST CURE Ionics Chloride Sodium , . ABLEBOND ® 8290 MEDIUM STRESS DIE ATTACH ADHESIVE THAWING Allow the container to reach room temperature , Ablebond 8290 adhesive can be cured in conventional box ovens per the recommended cure condition. Refer to , . 50 AVAILABILITY Ablebond adhesives are packaged in syringes or jars per customer specification


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G700K

Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0412 to 0413 , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0209 to 0209 ELECTRICAL CHARACTERIZATION , MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au , Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0216 to 0216 OPERATING LIFE DESCRIPTION , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0141 to 0141 ELECTRICAL CHARACTERIZATION


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PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Ablebond 84-1 LMISR4

Abstract: No abstract text available
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1812, JESD78, Ablebond 84-1 LMISR4
mark a7 sot23

Abstract: No abstract text available
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1815, JESD78, mark a7 sot23
mark a7 sot23

Abstract: J-STD-20A atec 6710S CDA194 mp8000
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1816, JESD78, mark a7 sot23 J-STD-20A atec 6710S CDA194 mp8000
LMISR4

Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: Silverfilled Ablebond Au / 1.3 mil UL 94-V0 0249 to 0249 ELECTRICAL CHARACTERIZATION DESCRIPTION , 4.4x0.9 Shinetsu 184 Stamped copper SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil , Ablebond Au / 1.0 mil 85 18 UL 94-V0 Level 1 9926 to 9926 OPERATING LIFE DESCRIPTION DATE , Ablebond Au / 1.0 mil 82 15 UL 94-V0 Level 1 9626 to 9626 OPERATING LIFE DESCRIPTION DATE , Silverfilled Ablebond Au / 1.0 mil 82 15 UL 94-V0 Level 1 9723 to 9841 MOISTURE SENSITIVITY LEVEL 1


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PDF DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Tsi148-133IL

Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy 8355F A1001-01 G770J A1001 seal sumitomo
Text: converting to a new mold compound, Sumitomo G770J and die attach epoxy, Ablebond 2100A as a result of the , new mold compound, Sumitomo G770J and die attach epoxy, Ablebond 2100A as a result of the existing , Die Attach Epoxy Ablebond 8355F Ablebond 2100A Product Top Mark Ink Mark Laser Mark


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PDF A1001-01 TSI148-133CL TSI148-133IL Tsi148-133IL G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy 8355F A1001-01 G770J A1001 seal sumitomo
CDA194

Abstract: mark a7 sot23
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1810, JESD78, CDA194 mark a7 sot23
Not Available

Abstract: No abstract text available
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1813, JESD78,
sumitomo G700

Abstract: sumitomo epoxy 1076 0038 tsop Sumitomo 1076 8361J ablebond Die Attach epoxy stamping Compound c7025 sumitomo g700 type g700 mold compound
Text: Ablebond Au / 1.0 mil UL 94-V0 Level 3 0223 to 0303 OPERATING LIFE DESCRIPTION DATE CODE , Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0038 to 0303 MOISTURE SENSITIVITY LEVEL 3 , 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 9921 to 9924 QTY FAILS 45 , Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 9913 to 0106 MOISTURE , LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0432 to 0432 PACKAGE TESTS


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CDA194

Abstract: mark a7 sot23 mold compound
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1817, JESD78, CDA194 mark a7 sot23 mold compound
Sumitomo G700K

Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0412 to 0413 OPERATING LIFE DESCRIPTION , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0209 to , Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 221 39 UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94 , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94


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PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Nitto MP8000

Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0412 to 0413 , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0209 to 0209 ELECTRICAL CHARACTERIZATION , MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au , Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0216 to 0216 OPERATING LIFE DESCRIPTION , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0141 to 0141 ELECTRICAL CHARACTERIZATION


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PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
LMISR4

Abstract: No abstract text available
Text: Stamped Alloy 42 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 , Ablebond Au / 1.0 mil UL 94-V0 Level 1 9616 to 9616 MOISTURE SENSITIVITY LEVEL 1 DESCRIPTION , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level , Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 9937 to 9937


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PDF DS1811, JESD78, LMISR4
Sumitomo G700K

Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K ablebond ablestik 8290 epoxy 8290 SUMITOMO-G600 SUMITOMO g600 UL
Text: LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0412 to 0413 , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0209 to 0209 ELECTRICAL CHARACTERIZATION , MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au , Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0216 to 0216 OPERATING LIFE DESCRIPTION , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0141 to 0141 ELECTRICAL CHARACTERIZATION


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PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K ablebond ablestik 8290 epoxy 8290 SUMITOMO-G600 SUMITOMO g600 UL
ABLEBOND

Abstract: No abstract text available
Text: LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0412 to 0413 , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0209 to 0209 ELECTRICAL CHARACTERIZATION , MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au , Silverfilled Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0216 to 0216 OPERATING LIFE DESCRIPTION , Ablebond Au / 1.0 mil 170 40 UL 94-V0 Level 4 0141 to 0141 ELECTRICAL CHARACTERIZATION


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PDF DS1086L, JESD78, ABLEBOND
JEDEC JESD22-B116 free

Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Text: Parkside Building, 5-8 Higashi-Shinagawa, 2-Chome Shinagawa-ku, Tokyo 140, Japan ABLEBOND ® 3230 LOW STRESS CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND ® 3230 low stress, electrically conductive , Release Specification. 07/01 ABLEBOND 3230 PHYSIOCHEMICAL PROPERTIES POST CURE Ionics Chloride , need to write a specification, please request our Standard Release Specification. ABLEBOND ® 3230 , pattern. ABLEBOND 3230 Contact Ablestik Technical Service Department for detailed recommendation on


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PDF SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Ablecube

Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ablebond ablestik ATM-0089 ablestik ablebond
Text: PILOT TECHNICAL DATASHEET ABLEBOND ® 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND ® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC performance on QFN type packages. ABLEBOND 8200C adhesive is a new version of the RP , recommended box oven cure temperature for this adhesive is 175°C. AVAILABILITY ABLEBOND ® adhesives are


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PDF 8200C 8200C RP-751 Ablecube ATM-0018 Ablestik ATM-0087 ablebond ablebond technical ablebond ablestik ATM-0089 ablestik ablebond
2013 - EME-G700A

Abstract: No abstract text available
Text: Epoxy Substrate Lead Finish PQFP Sumitomo EME-G770J Ablebond 2288A - 100% Sn BGA Sumitomo EME-G770J Ablebond 2100A BT Resin Sn-4%Ag-0.5%Cu LOGIC Devices , Cd Ablebond 2100A Cr+6 Hg Pb PBB PBDE Soluble Lead (Pb) Soluble Antimony (Sb) Soluble Arsenic , Component Mold Compound Cd EME-G700A Cr+6 Hg Pb PBB PBDE Epoxy Cd Ablebond 2288A Cr+6 Hg Pb PBB


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Not Available

Abstract: No abstract text available
Text: Copper C7025 SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0010 to , LMISR4 Epoxy Silverfilled Ablebond Au / 1.3 mil UL 94-V0 0040 to 0351 OPERATING LIFE , Silverfilled Ablebond Au / 1.0 mil UL 94-V0 0230 to 0230 OPERATING LIFE DESCRIPTION DATE CODE , PDIP 600 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond , SnPb Plate 8361J Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 3 0405 to 0405


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PDF DS80C310, JESD78,
JESD78

Abstract: Sumitomo 6730B Compound c7025 RH-1750
Text: Sumitomo 6730B Stamped Copper C7025 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.0 mil UL , 84-1 LMISR4 Epoxy Silverfilled Ablebond Au / 1.3 mil UL 94-V0 Level 1 0149 to 0208 ELECTRICAL , LMISR4 Epoxy Silverfilled Ablebond Au / 1.3 mil UL 94-V0 Level 1 0214 to 0214 OPERATING LIFE , Epoxy Silverfilled Ablebond Au / 1.0 mil UL 94-V0 Level 1 0340 to 0340 CONSTRUCTION ANALYSIS


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PDF DS2770, reliabilit50C JESD78 Sumitomo 6730B Compound c7025 RH-1750
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