GHz LGA Sockets; IC Size X (mm): 5.3; IC Size Y (mm): 0.1; IC Size Tolerance (mm): 0.5; Top Pitch (mm): 7; IC Array X: 11; IC Array Y: 52; Max Pincount: n/a; IC Ball Height Min (mm): n/a; IC Ball Height Max (mm): 1.52; IC Total Height Max (mm): n/a; IC Ball Coplanarity (mm): 0.3; Pad diameter max (mm): yes; Backing Plate: GHz LGA Socket (ZIF); Part Description: LGA52; Max Package Code: no; Cavity Down: Flat; IC Top Surface: yes; Socket Lid: Swivel; Heat Sink: no