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2002 - XAPP427

Abstract: FGG256 FSG48 Lead Free reflow soldering profile BGA BFG95 FFG896 FFG1152 reflow profile 245 SOG20 reflow soldering profile BGA
Text: XAPP427 (v2.2) January 30, 2006 Summary Recent legislative directives and corporate driven , warranties of merchantability or fitness for a particular purpose. XAPP427 (v2.2) January 30, 2006 , www.xilinx.com XAPP427 (v2.2) January 30, 2006 R Reflow Soldering Considerations Table 1 and Figure 1 , XAPP427 (v2.2) January 30, 2006 www.xilinx.com 3 R Reflow Soldering Considerations Table 2 , XAPP427 (v2.2) January 30, 2006 R Reflow Oven Table 2: Peak Package Reflow Body Temperature for


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PDF XAPP427 XAPP427 FGG256 FSG48 Lead Free reflow soldering profile BGA BFG95 FFG896 FFG1152 reflow profile 245 SOG20 reflow soldering profile BGA
2002 - Lead Free reflow soldering profile BGA

Abstract: BGA reflow guide XAPP427 FFG668 TQG144 BFG95 VOG48 BGA PROFILING PQG208 IPC-A610D
Text: Application Note: Packaging R XAPP427 (v2.4) February 12, 2009 Summary Implementation and , respective owners. XAPP427 (v2.4) February 12, 2009 www.xilinx.com 1 R Reflow Soldering , for profiling Pb-free solder reflow. XAPP427 (v2.4) February 12, 2009 www.xilinx.com 2 R , PDG8 250°C 1 PQG100 PQG160 PQG208 PQG240 245°C 3 PQFP XAPP427 (v2.4) February , FTG256 FGG256 FGG320 Chip Scale XAPP427 (v2.4) February 12, 2009 BGG225, BGG256 BGG575


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PDF XAPP427 Lead Free reflow soldering profile BGA BGA reflow guide XAPP427 FFG668 TQG144 BFG95 VOG48 BGA PROFILING PQG208 IPC-A610D
2002 - CSG484

Abstract: BGA reflow guide XAPP427 FFG676 Lead Free reflow soldering profile BGA CPG196 PQG240 ipc 610D pcb warpage in ipc standard IPC-A-610D
Text: Application Note: Packaging R XAPP427 (v2.5) February 4, 2010 Summary Implementation and , respective owners. XAPP427 (v2.5) February 4, 2010 www.xilinx.com 1 R Reflow Soldering , for profiling Pb-free solder reflow. XAPP427 (v2.5) February 4, 2010 www.xilinx.com 2 R , PDG8 250°C 1 PQG100 PQG160 PQG208 PQG240 245°C 3 PQFP XAPP427 (v2.5) February 4 , FGG320 Chip Scale XAPP427 (v2.5) February 4, 2010 BGG225, BGG256 BGG575 FGG324 FGG400


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PDF XAPP427 CSG484 BGA reflow guide XAPP427 FFG676 Lead Free reflow soldering profile BGA CPG196 PQG240 ipc 610D pcb warpage in ipc standard IPC-A-610D
2004 - XAPP427

Abstract: XCF00S XCF00P BLVDS-25
Text: packaging, see XAPP427 : Xilinx Lead Free Packages. Example: XA3S50 -4 PQ G 208 Q Device Type Speed Grade


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PDF DS314-1 DS099-1, DS099-2, DS099-3, DS099-4, XAPP427 XCF00S XCF00P BLVDS-25
2004 - FGG676

Abstract: AEC-Q100 ISO-TS-16949 FGG456
Text: Pb-Free Packaging For additional information on Pb-free packaging, see XAPP427 : Implementation and Solder


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PDF DS314-1 AEC-Q100 XA3S1500, TQG144, FGG676, TQG144 PQG208. XA3S1000 DS099, FGG676 AEC-Q100 ISO-TS-16949 FGG456
2005 - SPARTAN-3 XC3S400 PQ208

Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 XC3S4000FG676 SPARTAN-3 XC3S400 architecture SPARTAN-3 XC3S400 pin XILINX SPARTAN VQG100
Text: Packaging For additional information on Pb-free packaging, see XAPP427 : "Implementation and Solder Reflow


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PDF DS099-1 XC3S50CP132, XC3S2000FG456, XC3S4000FG676 DS099-1, DS099-2, DS099-3, DS099-4, DS313, DS314-1, SPARTAN-3 XC3S400 PQ208 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 architecture SPARTAN-3 XC3S400 pin XILINX SPARTAN VQG100
2004 - FGG456

Abstract: LVDSEXT-25 FGG676
Text: Pb-free packaging, see XAPP427 : Implementation and Solder Reflow Guidelines for Pb-Free Packages


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PDF DS314-1 AEC-Q100 XA3S1500, TQG144, FGG676, DS099, FGG456 LVDSEXT-25 FGG676
2004 - TQG144

Abstract: FGG456 XA3S50
Text: Packaging For additional information on Pb-free packaging, see XAPP427 : Implementation and Solder Reflow


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PDF DS314-1 AEC-Q100 XA3S1500, TQG144, FGG676, TQG144 PQG208. DS099, FGG456 XA3S50
2004 - airbag control unit

Abstract: AEC-Q100 LVDSEXT-25
Text: Pb-Free Packaging For additional information on Pb-free packaging, see XAPP427 : Implementation and Solder


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PDF DS314-1 AEC-Q100 XA3S1500, TQG144, FGG676, TQG144 PQG208. XA3S1000 XA3S1500 DS099, airbag control unit AEC-Q100 LVDSEXT-25
2004 - SPARTAN-3 XC3S400 PQ208

Abstract: XC3S400 PQG208 SPARTAN-3 XC3S400 xc3s200 XC3S400 XC3S50 XC3S400 PQ208 cost XC3S1500 SPARTAN-3 BOARD XC3S400 TQ144 xilinx XC3S200
Text: Pb-free packaging, see XAPP427 : Xilinx Lead Free Packages. Example: XC3S50 -4 PQ G 208 C Device Type


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PDF DS099-1 XC3S50. FG320 DS099-1, DS099-2, DS099-3, DS099-4, SPARTAN-3 XC3S400 PQ208 XC3S400 PQG208 SPARTAN-3 XC3S400 xc3s200 XC3S400 XC3S50 XC3S400 PQ208 cost XC3S1500 SPARTAN-3 BOARD XC3S400 TQ144 xilinx XC3S200
2004 - XCF00S

Abstract: automotive ecu automotive ecu circuit LVDSEXT-25 AEC-Q100 TS16949 VQG100 LVDSEXT25 BLVDS-25
Text: Pb-free packaging, see XAPP427 : Xilinx Lead Free Packages. Example: XA3S50 -4 PQ G 208 Q Device Type


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PDF DS314-1 AEC-Q100 DS099-1, DS099-2, DS099-3, DS099-4, XCF00S automotive ecu automotive ecu circuit LVDSEXT-25 TS16949 VQG100 LVDSEXT25 BLVDS-25
2005 - Not Available

Abstract: No abstract text available
Text: additional information on Pb-free packaging, see XAPP427 : Implementation and Solder Reflow Guidelines for


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PDF ds313 DS313 SSTL18
2007 - XA9572XL

Abstract: XA9572XL-15VQG44Q XA9572XL-15VQG64I XA9572XL-15TQG100I TQG100 XA9500XL XA9572XL-15VQG64Q XA9572XL-15TQG100Q XC9500XL XAPP427
Text: Packaging information on the Xilinx website. For Pb-free packages, see XAPP427. Recommended Operation


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PDF XA9572XL DS599 54V18 XA9500XL XC9500XL XAPP111, XAPP784, XA9572XL-15VQG44Q XA9572XL-15VQG64I XA9572XL-15TQG100I TQG100 XA9572XL-15VQG64Q XA9572XL-15TQG100Q XAPP427
2002 - WS609

Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING Alpha WS609 solder XAPP426 Alpha WS609 XAPP427 reballing bga
Text: guidelines on Pb-free packages, refer to XAPP427 , http://www.xilinx.com/bvdocs/appnotes/ xapp427.pdf.


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PDF XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING Alpha WS609 solder XAPP426 Alpha WS609 XAPP427 reballing bga
2004 - XCF00S

Abstract: spartan 3a FGG900 DS099 XCN07010
Text: For additional information on Pb-free packaging, see XAPP427 : Implementation and Solder Reflow


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PDF ds313 DS313 XCN07010, SSTL18 XCF00S spartan 3a FGG900 DS099 XCN07010
2007 - Not Available

Abstract: No abstract text available
Text: , see the Device Packaging information on the Xilinx website. For Pb-free packages, see XAPP427.


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PDF XA9572XL DS599 AEC-Q100 44-pin 64-pin 100-pin XC9500XL XAPP111, XAPP784,
2005 - xc9572xl pin configuration

Abstract: XC9572XL TQG100 XC9572XL-10VQG44I xc9572xl xc9572xl pin XC9572XL-10-TQ100 XC9572XL-10TQG100C XC9572XL-10TQG100I XC9572XL-7VQG64I XC9572XL-10CS48C
Text: considerations, see the Device Packaging information on the Xilinx website. For Pb-free packages, see XAPP427.


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PDF XC9572XL DS057 44-pin 48-pin 64-pin 100-pin 220oC. xc9572xl pin configuration XC9572XL TQG100 XC9572XL-10VQG44I xc9572xl pin XC9572XL-10-TQ100 XC9572XL-10TQG100C XC9572XL-10TQG100I XC9572XL-7VQG64I XC9572XL-10CS48C
2003 - XC95144XL-10TQ144I

Abstract: XC95144XL-5-TQ100 XC95144XL-10TQ100I TQG144 TQG10 TQFP 144 PACKAGE footprint XC95144 XC9500XL XAPP427 XAPP114
Text: , see XAPP427. Recommended Operation Conditions Symbol VCCINT Parameter Commercial TA = to


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PDF XC95144XL DS056 XC9500XL CS144 220oC. XC95144XL-10TQ144I XC95144XL-5-TQ100 XC95144XL-10TQ100I TQG144 TQG10 TQFP 144 PACKAGE footprint XC95144 XAPP427 XAPP114
2003 - xc9572xl pin configuration

Abstract: XC9572XL 44 VQFP package XAPP427 XC9572XL-7TQG100C XC9572XL-5VQG44C XC9572XL-7CSG48C XC9572XL-7VQ44I XILINX XC9572XL-10CS48C XAPP114
Text: considerations, see the Device Packaging information on the Xilinx website. For Pb-free packages, see XAPP427.


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PDF XC9572XL DS057 XC9500XL 220oC. xc9572xl pin configuration 44 VQFP package XAPP427 XC9572XL-7TQG100C XC9572XL-5VQG44C XC9572XL-7CSG48C XC9572XL-7VQ44I XILINX XC9572XL-10CS48C XAPP114
2006 - V18 marking

Abstract: XC9536XL-5VQ44C VQG44
Text: . For Pb-free packages, see XAPP427. Recommended Operation Conditions Symbol VCCINT VCCIO VIL VIH VO


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PDF XC9536XL DS058 44-pin 48-pin 64-pin CONN2/06 220oC. V18 marking XC9536XL-5VQ44C VQG44
2003 - Not Available

Abstract: No abstract text available
Text: the Xilinx website. For Pb-free packages, see XAPP427. Recommended Operation Conditions Symbol


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PDF XC9572XL DS057 XC9500XL 220oC.
2005 - XC9536XL

Abstract: XAPP114 VQG44 XC9536XL-10VQ64C XC9536XL VQFP Pb-Free Marking Codes XC9536 XC9500XL XAPP427 XC9536XL-10VQ44
Text: . For Pb-free packages, see XAPP427. Recommended Operation Conditions Symbol VCCIO Min Max


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PDF XC9536XL DS058 XC9500XL 220oC. XAPP114 VQG44 XC9536XL-10VQ64C XC9536XL VQFP Pb-Free Marking Codes XC9536 XAPP427 XC9536XL-10VQ44
2007 - XAPP114

Abstract: No abstract text available
Text: Xilinx website. For Pb-free packages, see XAPP427. Recommended Operation Conditions Symbol TA


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PDF XA9536XL DS598 AEC-Q100 44-pin XC9500XL XAPP111, XAPP784, XAPP114
2007 - DS600

Abstract: XA95144XL AEC-Q100 XA9500XL XAPP114 XAPP427 XC9500XL Xa9500 2N6210
Text: the Xilinx website. For Pb-free packages, see XAPP427. Recommended Operation Conditions Symbol


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PDF XA95144XL DS600 AEC-Q100 144-CSP XC9500XL XAPP111, XAPP784, DS600 XA9500XL XAPP114 XAPP427 Xa9500 2N6210
2006 - xc9572xl

Abstract: XC9572XL-10VQG44I XC9572XL-7PC44 XC9572XL-5VQG44C DS058 TQFP 144 PACKAGE footprint XC9572XL-5PCG44C xc9572xl pin configuration xc9572xl pin XC9572XL TQG100
Text: the Xilinx website. For Pb-free packages, see XAPP427. Recommended Operation Conditions Symbol


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PDF XC9572XL DS057 44-pin 48-pin 64-pin 100-pin 220oC. XC9572XL-10VQG44I XC9572XL-7PC44 XC9572XL-5VQG44C DS058 TQFP 144 PACKAGE footprint XC9572XL-5PCG44C xc9572xl pin configuration xc9572xl pin XC9572XL TQG100
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