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Part Manufacturer Description Datasheet Download Buy Part
LT1528CQ Linear Technology LT1528 - 3A Low Dropout Regulator for Microprocessor Applications; Package: DD PAK; Pins: 5; Temperature Range: 0°C to 70°C
LT1528CQ#TR Linear Technology LT1528 - 3A Low Dropout Regulator for Microprocessor Applications; Package: DD PAK; Pins: 5; Temperature Range: 0°C to 70°C
LT1528CQ#PBF Linear Technology LT1528 - 3A Low Dropout Regulator for Microprocessor Applications; Package: DD PAK; Pins: 5; Temperature Range: 0°C to 70°C
LT1528CT#PBF Linear Technology LT1528 - 3A Low Dropout Regulator for Microprocessor Applications; Package: TO-220; Pins: 5; Temperature Range: 0°C to 70°C
LT1528CT Linear Technology LT1528 - 3A Low Dropout Regulator for Microprocessor Applications; Package: TO-220; Pins: 5; Temperature Range: 0°C to 70°C
LT1528CQ#TRPBF Linear Technology LT1528 - 3A Low Dropout Regulator for Microprocessor Applications; Package: DD PAK; Pins: 5; Temperature Range: 0°C to 70°C

WINBOND APPLICATION NOTE Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - WINBOND APPLICATION NOTE

Abstract: WINBOND Serial flash cross reference S25FL080A mxic spi flash MXIC serial Flash AT25F4096 MXIC Lot Code Identification MXIC SPI Flash MX25L8005
Text: 4M-8M SPI Cross Reference Spansion®, STM®, SST®, MXIC, Atmel® & Winbond ® Application Note By , memory manufactures). This application note should be used as a guide when migrating to Spansion SPI , Winbond . Spansion SPI devices are for the most part compatible with SPI Flash from each of these , MX25L400/800, ATMEL AT25F4096 and Winbond W25p40/80. 2. OPN Comparison Table 2.1 shows detailed cross , MX25L4005A MX25L8005 ATMEL AT25F4096 - W25P40 W25P80 WINBOND 3. Feature Comparison


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PDF M25P40/80, SST25VF040B/080B, MX25L400/800, AT25F4096 W25p40/80. WINBOND APPLICATION NOTE WINBOND Serial flash cross reference S25FL080A mxic spi flash MXIC serial Flash MXIC Lot Code Identification MXIC SPI Flash MX25L8005
2013 - Not Available

Abstract: No abstract text available
Text: -mil/208mil. – 8-pad WSON 6x5-mm – 8-pin PDIP 300-mil – Contact Winbond for KGD and other options Note 1. Some package types are special orders, please contact Winbond for ordering information. - , protection * * Note : This feature is available upon special order. Please contact Winbond for details , Register instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up , permanently protected and can not be written to. Note : 1. When SRP1, SRP0 = (1, 0), a power-down


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PDF W25Q80DV 150-MIL/208-MIL:
Not Available

Abstract: No abstract text available
Text: 150-mil – 8-pad WSON 6x5-mm – 8-pin PDIP 300-mil – Contact Winbond for KGD and other options Note 1. Some package types are special orders, please contact Winbond for ordering information. - , Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q80DV will maintain a reset , , Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track


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PDF W25Q80DV 150-MIL/208-MIL 150-mil:
W25Q80DL

Abstract: No abstract text available
Text: -pad WSON 6x5-mm, USON 2x3-mm – 8-pin PDIP 300-mil – Contact Winbond for KGD and other options Note 1. Some package types are special orders, please contact Winbond for ordering information. - 5 - ,  One Time Program (OTP) write protection* * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q80DV will maintain , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS


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PDF W25Q80DV 150-MIL/208-mil 150-mil: W25Q80DL
2012 - 25Q40BV

Abstract: W25Q40BVSNIG W25Q40b W25Q 25Q40B 25Q40BVIG W25Q40 winbond 25Q40bvnig
Text: -mm, USON 2x3-mm ­ Contact Winbond for KGD and other options Publication Release Date: May 04, 2012 Revision , Time Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q40BV will maintain a reset condition , Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC , order. Please contact Winbond for details. 7.1.8 Erase/Program Suspend Status (SUS) The Suspend


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PDF W25Q40BV 150-mil, 208-mil 25Q40BV W25Q40BVSNIG W25Q40b W25Q 25Q40B 25Q40BVIG W25Q40 winbond 25Q40bvnig
2012 - W25Q40

Abstract: winbond w25q 4-64KB 25Q40B
Text: Winbond for KGD and other options Publication Release Date: May 04, 2012 Revision D -5- W25Q40BL 3 , Time Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q40BL will maintain a reset condition , Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC , order. Please contact Winbond for details. 7.1.8 Erase/Program Suspend Status (SUS) The Suspend


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PDF W25Q40BL 150-mil, 208-mil W25Q40 winbond w25q 4-64KB 25Q40B
Not Available

Abstract: No abstract text available
Text: Note : 1 IO0 and IO1 are used for Standard SPI and Dual I/O instructions 2 IO0 – IO3 are used for ,  One Time Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q40CL will , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS , permanently protected and can not be written to. Note : 1. When SRP1, SRP0 = (1, 0), a power-down


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PDF W25Q40CL 150-MIL, 173-MIL 150-MIL
2013 - Not Available

Abstract: No abstract text available
Text: Output 0) (1) (2) Serial Clock Input Hold Input (Data Input Output 3) (2) Power Supply Note : 1 IO0 , Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q40CL will maintain a reset , , Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track , not be written to. Note : 1. When SRP1, SRP0 = (1, 0), a power-down, power-up cycle will change


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PDF W25Q40CL 150-MIL, 173-MIL 150-MIL
2012 - 25Q80BVAIG

Abstract: 25Q80BVA WINBOND 25Q80BVSIG winbond 25Q80BVAIG W25Q80BV 25Q80BVNIG 25q80bv land pattern for Uson 2x3 USON-8 25Q80BVSIG
Text: -mm (6x4/5x5 ball array) ­ Contact Winbond for KGD and other options Note 1. More than 100,000 Block , W25Q80BV 2. Some package types are special orders, please contact Winbond for ordering information. 3 , Lock Down write protection until next power-up One Time Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at , Program, Sector Erase, Block Erase, Chip Erase and the Write Status Register instructions. Note that the


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PDF W25Q80BV 208-mil 25Q80BVAIG 25Q80BVA WINBOND 25Q80BVSIG winbond 25Q80BVAIG W25Q80BV 25Q80BVNIG 25q80bv land pattern for Uson 2x3 USON-8 25Q80BVSIG
25Q80BVA

Abstract: 25q80bv 25q80 25Q80bvs 25q80bvaig 25q80bvsig land pattern for vsop 8 pins w25q80bv W25Q80b winbond* W25Q
Text: -mm (6x4/5x5 ball array) ­ Contact Winbond for KGD and other options (2) Note 1. More than 100,000 , contact Winbond for ordering information. -5- Publication Release Date: Augest 01, 2012 Revision G , Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q80BV will maintain a reset condition while , Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC supply level


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PDF W25Q80BV 208-mil 25Q80BVA 25q80bv 25q80 25Q80bvs 25q80bvaig 25q80bvsig land pattern for vsop 8 pins w25q80bv W25Q80b winbond* W25Q
2012 - W25Q32BV

Abstract: WINBOND 25Q32BVSIG WINBOND 25Q32BVAIG WINBOND W25Q32BVSSIG 25q32bvsig W25Q32BV application note land pattern for vsop 8 pins 032KB W25Q32BVSSIG 25Q32BVAIG
Text: -mm (6x4/5x5 ball array) ­ Contact Winbond for KGD and other options Note 1. More than 100,000 Block , Winbond for ordering information. -5- Publication Release Date: March 26, 2012 Revision H , Time Program (OTP) write protection * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q32BV will maintain a reset , Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC


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PDF W25Q32BV 32M-BIT 208-mil W25Q32BV WINBOND 25Q32BVSIG WINBOND 25Q32BVAIG WINBOND W25Q32BVSSIG 25q32bvsig W25Q32BV application note land pattern for vsop 8 pins 032KB W25Q32BVSSIG 25Q32BVAIG
Not Available

Abstract: No abstract text available
Text: -pin PDIP 300-mil – Contact Winbond for KGD and other options  Low Power, Wide Temperature Range – Single 2.5 to 3.6V supply Note 1. Some package types are special orders, please contact Winbond for , protection * * Note : This feature is available upon special order. Please contact Winbond for details , Register instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up , contact Winbond for details. 6.1.8 Erase/Program Suspend Status (SUS) The Suspend Status bit is a


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PDF W25Q80BV 208-mil
2012 - winbond 25q128fvsg

Abstract: 25Q128fv 25q128fvsg 25Q128 25Q128F 25Q128FVFG 25Q128FVSQ W25Q128F W25Q128FV IO320
Text: /RESET pin) ­ 24-ball TFBGA 8x6-mm ­ Contact Winbond for KGD and other options -5- W25Q128FV 3 , , regardless the status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : While a faster /RESET , for array and Security Registers using Status Register * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q128FV will , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS


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PDF W25Q128FV 128M-BIT 208-mil winbond 25q128fvsg 25Q128fv 25q128fvsg 25Q128 25Q128F 25Q128FVFG 25Q128FVSQ W25Q128F W25Q128FV IO320
2012 - w25q128

Abstract: winbond 25q128fvsg 25Q128FVFG 25q128fvsg 25Q128fv 25Q128F 25Q128 W25Q128F 25Q128FVSQ w25q128fv
Text: * Note : This feature is available upon special order. Please contact Winbond for details. Upon , /RESET pin) ­ 24-ball TFBGA 8x6-mm ­ Contact Winbond for KGD and other options -5- W25Q128FV 3 , /or /HOLD). Note : While a faster /RESET pulse (as short as a few hundred nanoseconds) will often reset , instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up until the VCC-min , (0, 0) state. 2. This feature is available upon special order. Please contact Winbond for details


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PDF W25Q128FV 128M-BIT 208-mil w25q128 winbond 25q128fvsg 25Q128FVFG 25q128fvsg 25Q128fv 25Q128F 25Q128 W25Q128F 25Q128FVSQ w25q128fv
2013 - Not Available

Abstract: No abstract text available
Text: -ball TFBGA 8x6-mm (6x4/5x5 ball array) – Contact Winbond for KGD and other options -5- W25Q32FV 3 , operations, regardless the status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : 1.While a , for array and Security Registers using Status Register * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q32FV will maintain , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS


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PDF W25Q32FV 32M-BIT 208-mil,
2012 - W25Q128BV

Abstract: 25Q128BVFG JESD216 w25q128 25Q128 25q12 25Q128BVEG marking m7 A-1512 FF00FFH
Text: -mm ­ Contact Winbond for KGD and other options · Low Power, Wide Temperature Range ­ Single 2.7 to 3.6V supply Note 1. More than 100k Block Erase/Program cycles for Industrial and Automotive temperature; more , until next power-up One Time Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q128BV will , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS


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PDF W25Q128BV 128M-BIT W25Q128BV 25Q128BVFG JESD216 w25q128 25Q128 25q12 25Q128BVEG marking m7 A-1512 FF00FFH
2013 - W25Q32FV

Abstract: 25Q32FV 25q32fvsig WINBOND 25Q32FVSIG 25Q32F W25Q32FVSSIG W25Q32FV application note W25Q32F W25Q32 25Q32fvsiq
Text: 300-mil ­ 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) ­ Contact Winbond for KGD and other options -5- , of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : 1. While a faster /RESET pulse (as , Security Registers using Status Register* * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q32FV will maintain a reset , and the Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC


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PDF W25Q32FV 32M-BIT 208-mil 208-mil W25Q32FV 25Q32FV 25q32fvsig WINBOND 25Q32FVSIG 25Q32F W25Q32FVSSIG W25Q32FV application note W25Q32F W25Q32 25Q32fvsiq
2013 - Not Available

Abstract: No abstract text available
Text: -ball TFBGA 8x6-mm – Contact Winbond for KGD and other options -5- W25Q128FV 3. PACKAGE TYPES AND , signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : 1. While a faster /RESET pulse (as short as a few , and Security Registers using Status Register* * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q128FV will maintain a , , Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS) must track


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PDF W25Q128FV 128M-BIT 208-mil
2013 - Winbond 25Q16dVSIG

Abstract: No abstract text available
Text: -mil – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – Contact Winbond for KGD and other options Note 1. Some package types are special orders, please contact Winbond for ordering information. -5- , Down write protection until next power-up One Time Program (OTP) write protection* * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at , Program, Sector Erase, Block Erase, Chip Erase and the Write Status Register instructions. Note that the


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PDF W25Q16DV 16M-BIT Winbond 25Q16dVSIG
2012 - w25q256

Abstract: W25Q256FV 25Q256 W25Q256FVE W25Q256F 25q256fvfg W25Q256FVEI W25Q256FVEIG 25q256fv W25Q256FVFIG
Text: -mil (additional /RESET pin) ­ 24-ball TFBGA 8x6-mm ­ Contact Winbond for KGD and other options -5- , operations, regardless the status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : While a , protection for array and Security Registers using Status Register * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q256FV will , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS


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PDF W25Q256FV 256M-BIT w25q256 W25Q256FV 25Q256 W25Q256FVE W25Q256F 25q256fvfg W25Q256FVEI W25Q256FVEIG 25q256fv W25Q256FVFIG
2013 - W25Q64FV

Abstract: WINBOND 25Q64FVSIG winbond w25q64fv
Text: using Status Register* * Note : This feature is available upon special order. Please contact Winbond for , Winbond for KGD and other options Publication Release Date: October 07, 2013 Revision L W25Q64FV 3 , Write Status Register instructions. Note that the chip select pin (/CS) must track the VCC supply level , protected and can not be written to. Note : 1. When SRP1, SRP0 = (1, 0), a power-down, power-up cycle , contact Winbond for details. 6.1.8 Erase/Program Suspend Status (SUS) The Suspend Status bit is a


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PDF W25Q64FV 64M-BIT 208-mil W25Q64FV WINBOND 25Q64FVSIG winbond w25q64fv
2013 - Not Available

Abstract: No abstract text available
Text: -pin PDIP 300-mil – Contact Winbond for KGD and other options  Low Power, Wide Temperature Range – Single 2.5 to 3.6V supply Note 1. Some package types are special orders, please contact Winbond for , power-up  One Time Program (OTP) write protection * * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q80BV will , , Block Erase, Chip Erase and the Write Status Register instructions. Note that the chip select pin (/CS


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PDF W25Q80BV 208-mil
W25Q128FV

Abstract: No abstract text available
Text: * * Note : This feature is available upon special order. Please contact Winbond for details. Upon , -mm / 8x6-mm – 16-pin SOIC 300-mil (additional /RESET pin) – 24-ball TFBGA 8x6-mm – Contact Winbond , , regardless the status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : 1. While a faster , instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up until the , contact Winbond for details. - 16 - Publication Release Date: February 17, 2014 Revision G


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PDF W25Q128FW 128M-BIT 208-mil, W25Q128FV
2013 - W25Q128FV

Abstract: w25q128
Text: * * Note : This feature is available upon special order. Please contact Winbond for details. Upon , -mm / 8x6-mm – 16-pin SOIC 300-mil (additional /RESET pin) – 24-ball TFBGA 8x6-mm – Contact Winbond , , regardless the status of other SPI signals (/CS, CLK, IOs, /WP and/or /HOLD). Note : 1. While a faster , instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up until the , upon special order. Please contact Winbond for details. - 16 - Publication Release Date: December


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PDF W25Q128FW 128M-BIT 208-mil, W25Q128FV w25q128
2013 - WINBOND 25Q64CVSIG

Abstract: No abstract text available
Text: -mil – 8-pin PDIP 300-mil – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – Contact Winbond for KGD and other options  Efficient “Continuous Read Mode” – Single 2.7 to 3.6V supply Note 1. Some package types are special orders, please contact Winbond for ordering information. -5- , next power-up One Time Program (OTP) write protection* * Note : This feature is available upon special order. Please contact Winbond for details. Upon power-up or at power-down, the W25Q64CV will maintain


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PDF W25Q64CV 64M-BIT 300-mil. WINBOND 25Q64CVSIG
Supplyframe Tracking Pixel