|
10077239-116LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail |
|
|
|
93239-111LF
|
|
Amphenol Communications Solutions
|
Metral® Power Connectors, Backplane Power Connectors, 4 Row Power Receptacle, Straight, Solder-to-Board, LF. |
|
|
|
10077239-118LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header ,Press Fit ,Double row , 18 Positions ,2.54mm (0.100in) Pitch. |
|
|
|
10078239-11101LF
|
|
Amphenol Communications Solutions
|
DDR3 Memory Module Sockets, Storage and Server System, Very low profile (VLP) Through Hole, 240 Position Memory Socket. |
|
|
|
93239-112LF
|
|
Amphenol Communications Solutions
|
Metral® Power Connectors,Backplane Power Connectors, 4 Row Power Receptacle, Straight, Solder-to-Board |
|
|
|
10077239-110LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail |
|
|
