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BQ24314CEVM-245 Texas Instruments BQ24314CEVM-245 Evaluation Module
CF9603-000 TE Connectivity (CF9603-000) MWTM-245/80-1400/U(C84)
CR2695-000 TE Connectivity (CR2695-000) RRA-18G-FFG-245
EF9874-000 TE Connectivity (EF9874-000) MWTM-245/80-1000/U(C100)

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UM245R FTDI Chip Newark element14 9 $15.04 $15.04
UM245R FTDI Chip Allied Electronics & Automation 1 $20.00 $18.05
UM245R FTDI Chip Future Electronics 0 $20.00 $16.50
UM245R FTDI Chip RS Components 51 £15.50 £13.43
UM245R FTDI Chip element14 Asia-Pacific 52 $25.14 $25.07
UM245R FTDI Chip Farnell element14 34 £15.06 £13.70
XHP70B-00-0000-0D0UM245G Cree, Inc. Avnet 0 $7.19 $6.59

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UM-245 datasheet (4)

Part Manufacturer Description Type PDF
UM245 Universal Microelectronics 1.5 Watt DC/DC Converters Scan PDF
UM245M Universal Microelectronics 1.5 Watt DC/DC Converters Scan PDF
UM245R FTDI Evaluation and Demonstration Boards and Kits, Programmers, Development Systems, MOD USB PARALLEL FIFO DEV FT245R Original PDF
UM245R Future Technology Devices USB-Parallel FIFO Development Module Incorporating FTDIChip-ID Security Dongle Original PDF

UM-245 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2005 - R37PM02

Abstract:
Text: diameter Coating diameter EDF 80 80 dB/m 1000 nm 0.29 4.9 µm 125 µm 245 µm EDF 150 150 db/m 925 nm 0.29 4.9 µm 125 µm 245 µm Order by Part Number EDF 80 EDF 150 Other Doped , diameter R37PM01 18 dB/m <25 dB/km 0.29 4.5 µm 1 · 10-4 3 · 10-4 125 µm 245 µm R37PM02 9 dB/m <15 dB/km 0.25 4.9 µm 1.5 · 10-4 3 · 10-4 125 µm 245 µm Order by Part Number 1 R37PM01 R37PM02 , Cladding diameter Coating diameter R37501 Er 20 dB/m @ 1530 nm 890 nm 0.23 5.5 µm @ 1550 nm 125 µm 245


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PDF R37PM01, R37PM02, R37501 R38501 R39501 R37003, R37003 R37004, R37103, R37102 R37PM02 DSA00256064 R37PM01 R37005
Semiconductor Laser International

Abstract:
Text: ball lens Multi mode ball lens Single Mode Fiber Size 6/125/ 245 6/125/ 245 6/125/ 245 6/125/ 245 6/125/ 245 Connectors Type Sharp Conical Semi-Conical Ball Lens 45°Angle Double Wedge SC


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PDF 1-877-Go4-SLIC Semiconductor Laser International single mode optical fiber cable corning Sharp Semiconductor Lasers Semiconductor Laser International Corporation ball lens corning fiber optic cables
2005 - f9920

Abstract:
Text: 970 nm 6.6 ± 1.0 µm 2.5 dB/km 2.8 mm -30 dB -38 dB 0.13 CL TRUEPHASE 980 245 980 nm 970 nm 6.6 ± 1.0 µm 2.5 dB/km 2.8 mm -30 dB -38 dB 0.13 CL TRUEPHASE 980 400, and 980 245 FIBERS Product , correctly, TruePhase fibers exhibit low loss and high extinction ratios. reduced buffer 245 µm sizes , Dual UV Acrylate 0.5 µm 2.0% 4.8 µm 125 ± 1.0 µm 245 ± 15 µm Dual UV Acrylate 0.5 µm 2.0% Related , different wavelengths in full-size 400 or 245 µm cladding constructions. · Can be manufactured to a higher


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PDF nm/100 DK-2605 f9920
aramid yarn

Abstract:
Text: (nm) 0.11 3.4 ± 1 125 ± 2 245 ± 15 30.0 460 ± 40 630 Step 0.11 4.3 ± 1 125 ± 2 245 ± 15 12.0 580 ± 40 780 Step 0.11 5.4 ± 1 125 ± 2 245 ± 15 4.0 730 ± 40 F-SF/F-SF-C 820 Step 0.11 5.7 ± 1 125 ± 2 245 ± 15 4.0 750 ± 50 F-SC/F-SC-C 980 Step 0.11 6.9 ± 1 125 ± 2 245 ± 15 3.0 930 ± 40 F-SY/F-SY-C 1060 Step 0.11 7.7 125 ± 2 245 ± 15 2.0 970 ± 60 F-SS/F-SS-C


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PDF Jacke550 aramid yarn F-SS-C
2005 - SMC-A0630B

Abstract:
Text: SPECIALTY SINGLE-MODE FIBER Specification Sheet Single-Mode ClearLite Short Wavelength Photonic Fibers CL 630 11, CL 780 11, and CL 820 16 Product Description OFS Short Wavelength Photonic Fibers are differentiated by operating wavelength. Offered in a standard size 125 µm core with 245 µm , concentricity 3.9 µm 125 ± 2 µm 245 ± 15 µm 2.0% 1.0 µm 4.9 µm 125 ± 2 µm 245 ± 15 µm 2.0% 1.0 µm 3.7 µm 125 ± 2 µm 245 ± 15 µm 2.0% 1.0 µm Coating/Buffer Descriptions Coating material Operating temperature


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PDF SMC-A0630B SMT-A0780B SMB-D0820B CF04247-02 CF04247-03 CF04246 Hytrel pont de diodes
murata mlcc

Abstract:
Text: temperature of 260ºC and the other with a peak temperature of 245 °C. Irrespective of the peak reflow , , Sn grain 260 96.5Sn/3.0Ag/0.5Cu 2 4 1 size 2 ­ 8µm MLCC, Sn grain 245 96.5Sn/3.0Ag/0.5Cu 2 4 1 size 2 ­ 8µm MLCC, Sn grain 245 63Sn/37Pb 2 4 1 size 2 ­ 8µm MLCC, Sn grain 215 63Sn , peak temperatures employed during Pb-free solder reflow is 260°C and 245 °C. Pure tin melts at 232 , peak temperatures of 245 °C and 215°C ± 5°C were then examined after 500 thermal cycles. SEM


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2013 - on semiconductor marking code P008

Abstract:
Text: • RF BOM and area reduction Top view 3 Applications 1 2 • 2.45 GHz impedance , Figure 5. Return loss on SE port (Tamb = 25 °C) 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 , -20.0 -13 -22.5 -14 F (GHz) F (GHz) -25.0 -15 2.40 2.41 2.42 2.43 2.44 2.45 , 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 8. Phase imbalance (Tamb = 25 °C , ) -7.5 F (GHz) 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.40 2.41 2.42


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PDF BAL-NRF02D3 nRF51822-CEAA nRF51422-CEAA DocID024794 on semiconductor marking code P008
2005 - BF06832

Abstract:
Text: 1.0 µm 1.2 dB/km 4.2 mm -30 dB -35 dB CL TRUEPHASE 14XX 245 1400 to 1490 nm 1390 nm 9.8 ± 1.0 µm 1.2 dB/km 4.2 mm -30 dB -35 dB CL TRUEPHASE 14XX 400, and 14XX 245 FIBERS Product Description OFS , 400 ± 15 µm Dual UV Acrylate 0.5 µm 2.0% 125 ± 1 µm 245 ± 15 µm Dual UV Acrylate 0.5 µm 2.0 , at different wavelengths in full-size 400 or 245 µm cladding constructions. · Can be manufactured to


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PDF nm/100 DK-2605 BF06832 darling
2003 - FDC-CP1P-06-3C

Abstract:
Text: -3556 Connector Module FDM08P08-3C-3RH000 | Drawing ZA-3557 SPECIFICATION SHEET EVO- 245 -EN | PAGE 1 , -072 and CMH-024 7.5-in panel fits FDC-CMH-096 SPECIFICATION SHEET EVO- 245 -EN | PAGE 2 FDC® Unit , _ K_ L_ = = = = = = = = = = = 10 11 12 13 14 15 16 17 18 19 20 SPECIFICATION SHEET EVO- 245 , USA. EVO- 245 -EN / February 2010 Corning Cable Systems LLC · PO Box 489 · Hickory, NC 28603-0489 USA , SPECIFICATION SHEET EVO- 245 -EN | PAGE 4 Corning Cable Systems


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PDF FDC-CM1258 ZA-3556 FDM12P12-3C-3RH000 FDM08P08-3C-3RH000 ZA-3557 EVO-245-EN EVO-245-EN FDC-CP1P-06-3C FDM12P12-3C-3RH000 G7 mic mic connector
FFC CONNECTOR

Abstract:
Text: 23.07 FH12S-50S-0.5SH 586-0642-5 50 24.5 28.1 29.1 25.57 FH12S , 12.0 12.5 13.5 14.0 14.5 15.5 16.0 16.5 17.5 19.5 20.5 22.0 24.5 26.0 13.0 13.5 14.5 , 14.5 15.5 16.0 16.5 17.5 19.5 20.5 22.0 24.5 26.0 17.6 18.1 19.1 19.6 20.1 21.1 21.6 , 16.0 16.5 17.5 19.5 22.0 24.0 24.5 29.5 13.5 15.5 16.5 17.0 17.5 18.5 20.5 23.0 25.0 , 15.5 16.0 16.5 17.5 19.5 22.0 24.0 24.5 29.5 17 BPackaging Specification Embossed


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2005 - SMB-D0980B

Abstract:
Text: Choice of NAs: 0.16 and 0.20 · Choice of MFDs (at 980 nm): 5.0 and 4.0 µm · 125 µm cladding and 245 µm , diameter Clad non-circularity Core/clad offset 4.4 µm 125 ± 2 µm 245 ± 15 µm 2.0% 0.3 µm 3.6 µm 125 ± 2 µm 245 ± 15 µm 2.0% 0.3 µm Coating/Buffer Descriptions Coating material Operating temperature Dual UV


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PDF lo984 DK-2605 SMB-D0980B BF05635-02
Not Available

Abstract:
Text: conditions T a b le 3 . Iron Soldering Iron Tem perature M etal case < 245 °C < 245 °C 245 to 350°C Plastic case 23 A 3 D IN 4I869 (SO T 23) < 245 °C < 245 °C < 250°C Soldering D istance from the Case 1.5 to , 5 s 10 s 5 s 3s 5 s 10s 245 to 300°C < 245 °C 245 to 300°C < 250°C > 5 mm > 2 mm > 5 mm - Soldering T em perature < 245 °C Soldering D istance from the Case > 1.5 mm M ax. A llow able S ol


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stiffener

Abstract:
Text: -50S-0.5SV 586-0568-4 50 28.4 26.9 24.5 26.5 28.2 8 FH12-60S-0.5SV 586-0735-4 60 33.4 , 12.0 12.5 13.5 14.0 14.5 15.5 16.0 16.5 17.5 19.5 20.5 22.0 24.5 26.0 13.0 13.5 14.5 , 14.5 15.5 16.0 16.5 17.5 19.5 20.5 22.0 24.5 26.0 17.6 18.1 19.1 19.6 20.1 21.1 21.6 , 16.0 16.5 17.5 19.5 22.0 24.0 24.5 29.5 13.5 15.5 16.5 17.0 17.5 18.5 20.5 23.0 25.0 , 15.5 16.0 16.5 17.5 19.5 22.0 24.0 24.5 29.5 17 Vertical Mounting Type (Common to 0.5mm


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2013 - Highly integrated CMOS RF SPDT switch with ESD and unit cell optimisation in MCM

Abstract:
Text: , achieves an insertion loss of 0.52/0.78 dB at 0.9/ 2.45 GHz, respectively. TX-to-RX isolation of > 29 dB , and IIP3 of 38.3/37.4 dBm are accomplished at 0.9/ 2.45 GHz, respectively. Finally, the switch , ˆ¼ 0.1 dB in simulation at 0.9 and 2.45 GHz, respectively. The core switch area is only 0.02 mm2 while , (Fig. 5a). The measured IL at 25 °C is 0.52 and 0.78 dB at 0.9 and 2.45 GHz, respectively. Under the worst-case temperature (85 °C), the measured IL (Fig. 5b) is 0.59 and 0.89 dB at 0.9 and 2.45 GHz


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2013 - Not Available

Abstract:
Text: ) -1.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 5. Phase imbalance (Tamb = 25 °C) Figure 6. Amplitude imbalance (Tamb = 25 °C) -30.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 , -5 0.3 -10 0.2 F (GHz) -15 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 0.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 7. Transmission: 2nd harmonic


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PDF BALF-2690-02D3 STLC2690, BALF-2690-02D3 STLC2690 Hz-2500 DocID025234
Not Available

Abstract:
Text: 245 °C < 245 °C :£ 245 to 350°C < 245 °C < 245 °C Soldering D istance from the C ase 1.5 to 5 mm > 5 mm , < 245 °C D ip o r R o w Soldering Soldering D istance from the Case > 1.5 mm > 5 mm > 2 mm > 5 mm M ax. A llow able Soldering Tim e 5 s 3s 3s 3s < 245 to 300°C < 245 °C < 245 to 300°C 2.2 Heat


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2013 - CW1250

Abstract:
Text: 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.41 2.40 2.50 Figure 4. Differential return loss -24 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 5 , 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.41 2.40 Figure 6. Phase imbalance 2.62 F (GHz) -0.29 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 , 2.44 2.45 2.46 2.47 2.48 2.49 F (GHz) -21.0 2.46 2.50 2.40 2.41 Doc


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PDF BAL-CW1250D3 BAL-CW1250D3 BAL-CW1250D3, CW1250, CW1150, CW1260 ID024678 CW1250 CW1260
2012 - nrf51822

Abstract:
Text: DIFF GND 2.45 GHz impedance matched balun filter Optimized for Nordic's chip set nRF24LE1/AP2 and , 7 8 F (GHz) -15 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 4. dB , -30 -35 -40 0.5 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 F (GHz) -45 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 -0.4 F (GHz) -0.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 , ) -10 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Doc ID 023215 Rev 2 3/9


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PDF BAL-NRF01D3 nRF24LE1 QFN32, nRF24AP2-1CH nRF24AP2-8CH nRF51422 nRF51822 nRF24LE1/AP2 nRF51 nRF2723 BAL-NRF01D3 nRF24AP2 "Marking SC" nRF24LE1 application note BAL-NRF0
2003 - BF05476

Abstract:
Text: / 10.5 0.11 0.11 125/ 245 125/155 BF05476 BF05476-01 How do you choose which ClearLite , Features and Benefits · 0.11 NA · 125 µm cladding/ 245 µm Acrylate coating or 155 µm PYROCOAT coating · , µm Cladding diameter 125 ± 2 µm 125 ± 2 µm Coating diameter 245 ± 15 µm 155 ± 15 µm


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PDF 1310-11D 1310-11P BF05476 BF05476-01 SM-SS006-001-0403 D-82140 BF05476 BF05476-01
2013 - 12CrNi177

Abstract:
Text: //LSH/LPH LPV/L/LSH LPS//LPV IR-Reflow 245 /5 Silbe max. 48 DC 5 6 [mA] 50 50 50 max. 50 , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245 /5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245 /5 245 /5 245 /5 245 /5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245 /5 [W] 0,12 0,12 0,48 2,40


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2013 - BT 1610

Abstract:
Text: ) 2.40 2.45 2.50 2.55 2.60 2.65 2.70 0 1 2 3 4 5 6 Figure 4. P2-P3 - S23 , (GHz) -35 1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610 -30 F (GHz) -35 2.40 2.45 2.50 2.55 , -11.059 dB F (GHz) 2.65 2.70 2.45 2.50 2.55 2.60 Figure 10. P2 - S22 return loss in f2 , 1.580 1.585 1.590 1.595 1.600 1.605 1.610 -35 2.40 F (GHz) 2.65 2.70 2.45 2.50 2.55 2.60 , -25 -30 F (GHz) -35 2.40 2.45 2.50 2.55 2.60 2.65 2.70 -30 F (GHz) -35 1.570 1.575 1.580 1.585


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PDF DIP1524-01D3 DIP1524-01D3 BT 1610 st 220 f1 GLONASS chip ST marking s11 Tablet PC schematic
2014 - Not Available

Abstract:
Text: µm after reflow • High RF performance • RF BOM and area reduction Applications • 2.45 GHz , . Return loss on DIFF port (Tamb = 25 °C) -20 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 , -30 0.1 0.0 -35 -0.1 -0.2 -40 -0.3 F (GHz) -45 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 F (GHz) -0.4 -0.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 , ) -8 -10 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 DocID023215 Rev 5 3/9


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PDF BAL-NRF01D3 nRF51422-QFAA nRF24LE1 nRF51822-QFAA/AB BAL-NRF01D3 QFN-32 nRF24AP2-1CH nRF24AP2-8CH
2013 - NRF51422

Abstract:
Text: area reduction 1 GND  High RF performance B Applications  2.45 GHz impedance , 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 8 dB Figure 5. Amplitude imbalance (Tamb = , F (GHz) -45 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 F (GHz) -0.4 -0.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 6. Phase imbalance (Tamb = 25 °C) 10 degrees 8 6 4 2 0 -2 -4 -6 F (GHz) -8 -10 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48


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PDF BAL-NRF01D3 nRF24LE1 QFN32, nRF24AP2-1CH nRF24AP2-8CH nRF51422 nRF51822 DocID023215
2011 - zestron

Abstract:
Text: //LSH/LPH LPV/L/LSH LPS//LPV IR-Reflow 245 /5 Silbe max. 48 DC 5 6 [mA] 50 50 50 max. 50 , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245 /5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. <0,15 150 <0,15 150 <0,1 50 JEDEC JEDEC J-STD-020C J-STD-020C 245 /5 245 /5 245 /5 245 /5 J-STD-020C Jedec J-STD-020C Anschlüsse IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 8 Mechanische , Ni -3 +2 µm µm Ni Au +2 µm Au Au IP 40 JEDEC J-STD-020C 245 /5 [W] 0,12 0,12 0,48 2,40


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2012 - BT 1610

Abstract:
Text: insertion loss in f2 band (GPS) S23 (dB) Figure 5. 2.45 2.50 2.55 2.60 2.65 2.70 , Doc ID 022548 Rev 1 2.45 2.50 2.55 2.60 2.65 2.70 3/9 Characteristics , ) -35 2.40 2.45 2.50 2.55 2.60 F (GHz) 2.65 2.70 Figure 11. P3 - S33 return loss , return loss in f2 band -5 S33 (dB) 2.45 2.50 2.55 2.60 2.65 2.70 Figure 13 , m18 m21 m19 -25 -25 -30 -30 F (GHz) -35 2.40 2 2.45 2.50 2.55


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PDF DIP1524-01D3 DIP1524-01D3 BT 1610
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