The Datasheet Archive

Top Results (6)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
SCT2H12NY SCT2H12NY ECAD Model ROHM Semiconductor 1700V, 4A, SMD, Silicon-carbide (SiC) MOSFET
SCT2750NY SCT2750NY ECAD Model ROHM Semiconductor 1700V, 6A, SMD, Silicon-carbide (SiC) MOSFET
SCT3105KW7 SCT3105KW7 ECAD Model ROHM Semiconductor 1200V 23A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT3080AW7 SCT3080AW7 ECAD Model ROHM Semiconductor 650V 29A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT3120AW7 SCT3120AW7 ECAD Model ROHM Semiconductor 650V 21A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT3040KW7 SCT3040KW7 ECAD Model ROHM Semiconductor 1200V 56A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET

UM-1-SMD datasheet (1)

Part ECAD Model Manufacturer Description Type PDF
UM-1-SMD UM-1-SMD ECAD Model Raltron Electronics High Accuracy Surface Mount Crystals Original PDF

UM-1-SMD Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2002 - IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Text: INTRODUCTION TO MICRO SMD Micro SMD is a wafer level CSP (WLCSP) with the following features: 1 . Package , -46 FIGURE 1 . Micro SMD 4-20 Bump PACKAGE CONSTRUCTION Figure 1 shows typical micro SMD products. They , , 1 . Non-solder mask defined (NSMD) 2. Solder mask defined ( SMD ). · Solder reflow and cleaning , -481-1) AN100926-5 FIGURE 2. NSMD and SMD Pad Definition 1 . NSMD configuration is preferred due to its , compared to SMD configuration. 2. A copper layer thickness of less than 1 oz is recommended to achieve


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PDF AN-1112 IPC-SM-785 GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
2003 - IPC-SM-785

Abstract: stencil tension AN-1112
Text: . Package Construction Figure 1 shows typical micro SMD products. They have solder bumps located on the , 1 . Micro SMD 4-20 Bump Micro SMD Package Data Package Arrays Bump Count Array Outline 4 , packages, 1 . 2. Non-solder mask defined (NSMD) Solder mask defined ( SMD ). 10092605 FIGURE 2. NSMD and SMD Pad Definition 1 . NSMD configuration is preferred due to its tighter control on , . Either of the following methods can be used for recognition and positioning. 1 . Micro SMD is


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2001 - stencil tension

Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Text: Scale Package AN100926-46 FIGURE 1 . Micro SMD 4-20 Bump PACKAGE CONSTRUCTION Figure 1 shows , micro SMD rework are listed below. 1 . Rework procedure used is identical to the one used for most , more expensive). Other features of micro SMD placement are, 1 . It is preferable to use IC placement , /32 0/32 0/32 -40 to 125° C, 1 cycle/hr, 25 min dwell, 5 min transfer Micro SMD Assembly , Type 1 6 Micro SMD Wafer Level Chip Scale Package Notes LIFE SUPPORT POLICY NATIONAL


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PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
2005 - ALIVH

Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
Text: Micro SMD is a wafer level CSP (WLCSP) with the following features: 1 . 2. Package size equal to , Construction Figure 1 shows typical micro SMD products. They have solder bumps located on the active side of , packages, 1 . 2. Non-solder mask defined (NSMD) Solder mask defined ( SMD ). 10092605 FIGURE 2. NSMD and SMD Pad Definition 1 . NSMD configuration is preferred due to its tighter control on , nature of solder bumps. 3. Though micro SMD can withstand a placement force of up to 1 kg for 0.5


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PDF CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
2002 - AN-1112

Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
Text: using standard surface mount assembly techniques (SMT). 10092646 FIGURE 1 . Micro SMD 4-20 Bump , The key features for the micro SMD rework are listed below. 1 . Rework procedure used is identical , more expensive). Other features of micro SMD placement are, Qualification 1 . It is preferable , . Though micro SMD can withstand a placement force of up to 1 kg for 0.5 seconds, little or no force needs , MICRO SMD


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1998 - a32000

Abstract: smd 148
Text: DRAWINGS A-SMD TYPE: HC-49/U-SMD mm Scale none Dimension in inch 3.0 .118 2.8 .110 C-SMD TYPE: UM-1-SMD , 3OT 5OT 7OT 9OT MODE FUNDAMENTAL THIRD OVERTONE FIFTH OVERTONE SEVENTH OVERTONE NINTH OVERTONE EXT SMD EXTENDED TEMPERATURE SURFACE MOUNT A C HC-49/U-SMD UM-1-SMD 10 TO 32pF FOR PARALLEL S FOR SERIES EXAMPLE: A-32.000-20-3OT- SMD C-100.00-S-5OT- SMD Raltron Electronics Corporation 10651 NW 19th St. Miami , A-SMD: HC-49/U-SMD C-SMD: UM- 1 SMD 1.00 MHz TO 360.00 MHz 1.00 MHz TO 360.00 MHz 10.00 MHz TO 300.00 MHz


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PDF HC-49/U-SMD HC-49/U-SM8 000-20-3OT-SMD C-100 00-S-5OT-SMD a32000 smd 148
1998 - smd 356 AT

Abstract: smd 356 431 smd
Text: DRAWINGS A-SMD TYPE: HC-49/U-SMD mm Scale none Dimension in inch C-SMD TYPE: UM-1-SMD 3.56 3.18 , OVERTONE EXT SMD EXTENDED TEMPERATURE SURFACE MOUNT A C HC-49/U-SMD UM-1-SMD 10 TO 32pF FOR PARALLEL S FOR SERIES EXAMPLE: A-32.000-20-3OT- SMD C-100.00-S-5OT- SMD Raltron Electronics Corporation , A-SMD: HC-49/U-SMD C-SMD: UM- 1 SMD 1.00 MHz TO 360.00 MHz 1.00 MHz TO 360.00 MHz 10.00 MHz TO 300.00 MHz


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PDF HC-49/U-SMD HC-49/U-SM012 000-20-3OT-SMD C-100 00-S-5OT-SMD smd 356 AT smd 356 431 smd
1998 - transistor 431 smd

Abstract: smd 431 smd 356 AT smd transistor 431 smd transistor 142 HC-49 SMD U-SMD 431 smd 431 SMD transistor transistor smd 49
Text: C-SMD TYPE: UM-1-SMD mm Scale none Dimension in inch 3.56 .140 1.40 ± .25 .055 ± .01 3.20 , PART NUMBERING SYSTEM HOLDER TYPE A C HC-49/U-SMD UM-1-SMD FREQUENCY - LOAD CAPACITANCE , RANGE 1.00 MHz TO 360.00 MHz A-SMD: HC-49/U-SMD 1.00 MHz TO 360.00 MHz C-SMD: UM- 1 SMD , SURFACE MOUNT EXT SMD - EXAMPLE: A-32.000-20-3OT- SMD C-100.00-S-5OT- SMD Raltron


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PDF HC-49/U-SMD 000-20-3OT-SMD C-100 00-S-5OT-SMD transistor 431 smd smd 431 smd 356 AT smd transistor 431 smd transistor 142 HC-49 SMD U-SMD 431 smd 431 SMD transistor transistor smd 49
2000 - Not Available

Abstract: No abstract text available
Text: — 1 Summary â , -38・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 25 ● Fundamental Mode-suppressing Crystal Resonators UM- 1 , UM-5, HC-49/T, HC-49/U・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 27 ● ● SMD Type Monolithic Crystal Filters [Jacket Type] ● Monolithic , ½¥ ・・・・ ・ ・ ・ ・ ・ 60 ・ ・ ・ ・ ・・・・・・ Crystal Resonators UM- 1 , UM-4, UM-5, HC-49/T, HC-49/U, HC-50/T, HC-50/U・・・・・・・・・ 26 SMD Type Monolithic


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PDF DOC-49S DSV531SVï DVO-212E, DVO-222E DVO-213A2 DVO-211A2, DVO-221A2, DVO-2460Aï
dil08

Abstract: DIL-08 CM200S 4mhz smd crystal SMD0705 CM309S CRYSTAL SMD 4MHZ SMD 07-05 SMD crystal unit smd 0705
Text: SMD Type SMD0705, SMD0603 FEATURES SMD -0705, 0603 SMD -0705 SMD -0603 This chip , automatically. It is well welded, so it is thinner and smaller. SPECIFICATIONS DIMENSIONS SMD Type CM200S FEATURES CM200S Being of the ultra-miniature SMD type, and thus featuring , (UNIT = mm) SMD Type CM250S FEATURES CM250S Being of the ultra-miniature SMD type, and , TEMPERATURE vs. FREQUENCY CURVE RECOMMENDABLE PATTERNING (UNIT = mm) SMD Type CM309S FEATURES


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PDF SMD0705, SMD0603 SMD-0705, SMD-0705 SMD-0603 CM200S CM200S HC-49/T, 20KHz, dil08 DIL-08 4mhz smd crystal SMD0705 CM309S CRYSTAL SMD 4MHZ SMD 07-05 SMD crystal unit smd 0705
TGS Crystals

Abstract: 22400 54160 ot 3000 TGS 200 Transistors smd mark code UM-5SMD smd code Cb 8867.238
Text: Specify Equivalent Series Resistance (ESR): See Table 1 Drive Level: Specify 1000 uW Max. Shunt Capacitance (C 0): 5ppm Max. CAM: UM-1-SMD H=8.0 Max. CB M: UM-5- SMD H=6.0 Max. 0.35 , ordering PART NUMBER GUIDE A 10M0 TGS C AM Mark Quartz AM: UM-1-SMD H=8.0mm Freq. Oscillation , SMD QUARTZ CRYSTALS TGS SERIES NO. : CAM & CBM FEATURES Wide Frequency Range Resistance Weld SMD With Metal Jacket Tight Tolerance and Stability over Temperature S 5 TG .94 20


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PDF 10ppm 20ppm 30ppm 50ppm 1000pcs/Reel, 10M0A50-20-50-10-50T 10M0A20T TGS Crystals 22400 54160 ot 3000 TGS 200 Transistors smd mark code UM-5SMD smd code Cb 8867.238
1998 - transistor 431 smd

Abstract: smd 431 smd transistor 431 smd 356 AT
Text: C-SMD TYPE: UM-1-SMD mm Scale none Dimension in inch 3.56 .140 1.40 ± .25 .055 ± .01 3.20 , PART NUMBERING SYSTEM HOLDER TYPE A C HC-49/U-SMD UM-1-SMD FREQUENCY - LOAD CAPACITANCE , RANGE 1.00 MHz TO 360.00 MHz A-SMD: HC-49/U-SMD 1.00 MHz TO 360.00 MHz C-SMD: UM- 1 SMD , SURFACE MOUNT EXT SMD - EXAMPLE: A-32.000-20-3OT- SMD C-100.00-S-5OT- SMD Raltron


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PDF HC-49/U-SMD 000-20-3OT-SMD C-100 00-S-5OT-SMD transistor 431 smd smd 431 smd transistor 431 smd 356 AT
90041-AS

Abstract: ATI Lead Free reflow soldering profile BGA 90023-AS 90022-AS LCD 90026 540-99-044-24-000 540-99-084-24-000-1 111-93-308-41-001 41013 mounting clip dimensions IP0002
Text: -xxx-40-002 SMD receptacle: single row, low profile, parallel mount Availability from: 1 to 50 contacts , characteristics* ­ Gauge diameter (mm): 0.43 800 0.76 ( 1 mm) 1.2 0.6 0.46 ­ Insertion force (N): 1.2 1 1.8 ­ Withdrawal force (N): 0.6 0.5 1 ­ Mechanical life: min. 500 cycles * (measured , distances (mm): ­ Capacitance (pF): 1 3 3 100 VRMS / 150 VDC 1 20 10 10 000 M min. 1000 VRMS min. 10 10 0.4/0.5 1 0.85/0.7 0.7 1 0.8 Environmental data ­ Operating temperature


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PDF IP0000 8PM-SS-0006-01-913 CH-2800 90041-AS ATI Lead Free reflow soldering profile BGA 90023-AS 90022-AS LCD 90026 540-99-044-24-000 540-99-084-24-000-1 111-93-308-41-001 41013 mounting clip dimensions IP0002
1998 - crystals

Abstract: 5,9904 19.6608 HC 57143
Text: TYPE: HC-49/U-SMD C-SMD TYPE: UM-1-SMD mm Scale none Dimension in inch 3.56 .140 1.40 ± , MAX 19.40 MAX .764 MAX PART NUMBERING SYSTEM HOLDER TYPE A C HC-49/U-SMD UM-1-SMD , RANGE 1.00 MHz TO 360.00 MHz A-SMD: HC-49/U-SMD 1.00 MHz TO 360.00 MHz C-SMD: UM- 1 SMD , SMD EXAMPLE: A-32.000-20-3OT- SMD C-100.00-S-5OT- SMD Raltron Electronics Corporation 10651 NW , TYPE HC-49/U "A" UM- 1 "C" A A A A A A A A A A A A A A A A A A A A A A A A A


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PDF HC-49/U-SMD 10PPM HC-49/U crystals 5,9904 19.6608 HC 57143
2006 - s9a crystal

Abstract: smd UM 08 SMD CRYSTAL Ceramic CCL-S13
Text: -9. UM-5 CCL-10. UM- 1 CCL-11. Tuning Fork CCL-SM1 . Plastic SMD CCL-SM2 . Ceramic SMD CCL-S2A. Ceramic SMD CCL-SM3 . HC-49/s SMD CCL-SM4 . Plastic SMD CCL-SM5 . Plastic SMD CCL-SM7 . Ceramic SMD CCL-SM8 . Plastic SMD CCL-SM9 . Ceramic SMD (see S9A) CCL-S9A . Ceramic SMD CCL-S10 . 2.0mm Metal SMD CCL-S12 . Ceramic SMD CCL-S13 . Metal SMD -6 Leaded CCL-S14 . Plastic SMD CCL-S15 . Ultra Miniature , Part Numbering Guide CRYSTAL HOLDER STYLES CCL- 1 . HC-48/u CCL-2. HC-7 /u CCL


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PDF HC-48/u HC-51/u HC-49/u HC-50/u HC-50/s CCL-10. CCL-11. s9a crystal smd UM 08 SMD CRYSTAL Ceramic CCL-S13
2004 - Preci-Dip Durtal SA

Abstract: CH-2800 C17200 SMD 2.54 90 Header Durtal 94vo fr4 CuSn4Pb4Zn4 pga 132 packaging 510-91-168-17 514-PP-NNNMXX-XXX148
Text: , 1.27 mm grid Socket SMD , 1 mm grid Adapter, 1.27 mm grid Interconnect, solder pin, 1.27 mm grid Adapter, 1 mm grid Interconnect SMD , 1 mm grid Interconnect SMD , 1.27 mm grid 136 139 136 137 139 , Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 , MIL-DTL-83734, pt 4.6.4.2 - Contact retention: - Resistance to corrosion: 1 ) Salt spray test IEC , Push-out 3rd cycle: 20 N min. (at max. hole dia.) - PCB hole specifications: Table 1 / 2.54 mm grid PGA


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PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 SMD 2.54 90 Header Durtal 94vo fr4 CuSn4Pb4Zn4 pga 132 packaging 510-91-168-17 514-PP-NNNMXX-XXX148
Not Available

Abstract: No abstract text available
Text: DRAWINGS A-SMD TYPE: HC-49/U-SMD C-SMD TYPE: UM-1-SMD mm Scale none Dimension in inch 3.56 .140 , MAX .500 MAX 19.40 MAX .764 MAX PART NUMBERING SYSTEM HOLDER TYPE A C HC-49/U-SMD UM-1-SMD , RANGE 1.00 MHz TO 360.00 MHz A-SMD: HC-49/U-SMD 1.00 MHz TO 360.00 MHz C-SMD: UM- 1 SMD , SMD EXAMPLE: A-32.000-20-3OT- SMD C-100.00-S-5OT- SMD Raltron Electronics Corporation 10651 NW , TYPE HC-49/U "A" UM- 1 "C" A A A A A A A A A A A A A A A A A A A A A A A A A


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PDF HC-49/U-SMD 10PPM HC-49/U
2007 - pml 003 am

Abstract: ic pml 003 am pml 009 cih smd S1 DIODE pml 603 am smd diode code B2 diode bzw 06 26 smd diode UM-12 QFN28
Text: NPDR TEMPOK CIL MDL Safety-Monitor- Diode SMD + SMD ( 1 ) - VSH RSMD + , Clamp-Spannung hi gg. GND an I() = 1 mA, andere Pins offen, VDD = 0 CIx, MDL, RMDH, RMDM, SMD 0.3 1.6 V , , Signal SMD ( 1 ) 615 680 750 mV 303 dVS VSH - VSL 350 390 430 mV 304 , ts1 Verzögerungszeit: V( SMD ) > VSH zu SMD ( 1 ) lo hi s. Bild 4 220 ns 709 toff Verzögerungszeit: SMD ( 1 ) lo hi bis Abschaltung s. Bild 4 10 ns 710 td Verzögerungszeit: SMD ( 1


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PDF QFN28 QFN28 pml 003 am ic pml 003 am pml 009 cih smd S1 DIODE pml 603 am smd diode code B2 diode bzw 06 26 smd diode UM-12
str 3105

Abstract: CRYSTAL SMD 8MHZ XMP-3200 20MHz Crystal SMD smd diode ED smd diode UM
Text: XMP-3100 / 3200 UM- 1 / UM-1-SMD Specification : Frequency range, Mode of vibration : 1 : 8MHz , : XMP 3 1 0 5 1 A Product Familiy Package 1 = UM- 1 2 = UM-1-SMD 30 pF , / 648-0 Fax. +49 (0) 7263 / 6196 Sheet 1 of 2 XMP-3100 / 3200 UM- 1 / UM-1-SMD Package Drawing , stability Options : -20 / +70°C : -40 / +85°C : 1 : ± 25 ppm 4: ± 25 ppm 2: ± 50ppm 5: ± 50ppm 3 , Tolerance Frequency Typical Part Number : XMP-3105-1A-30pF-20MHz Package = UM- 1 Mode = fund


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PDF XMP-3100 45MHz 26MHz 120MHz 80MHz 160MHz 50ppm 100ppm str 3105 CRYSTAL SMD 8MHZ XMP-3200 20MHz Crystal SMD smd diode ED smd diode UM
2002 - Not Available

Abstract: No abstract text available
Text: -2 UM-5 UM- 1 TUNING FORK HC-42/U HC-43/U Plastic SMD Ceramic SMD Ceramic SMD HC-49/S SMD Plastic SMD Plastic SMD Ceramic SMD Ceramic SMD Plastic SMD Ceramic SMD 2.0mm Metal SMD Ceramic SMD Metal SMD - 6 Lead Plastic SMD LOAD CAPACITANCE S 1 2 3 4 5 6 7 8 P X Series 50pF , HOLDER STYLES CCL- 1 CCL-2 CCL-3 CCL-6 CCL-6S CCL-7 CCL-7S CCL-8 CCL-9 CCL-10 CCL-11 CCL , 10ppm/ 50ppm 10ppm/ 25ppm 10ppm/ 10ppm Customer Specified OPERATING TEMPERATURE RANGE 1 2 3 4


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PDF CCL-10 CCL-11 CCL-13 CCL-14 CCL-S10 CCL-S12 CCL-S13 CCL-S14 HC-48/U HC-51/U
UMC042

Abstract: ATS-49 32.768Khz LPC3081 LPC3150 HC49SMD CRYSTAL 32.768KHZ cs-306 UMC111 lpc3143 TF38 K D S 11.0592 MHZ
Text: 7.0 - 200.00 Mhz 7.0 - 200.00 Mhz UM Gull wing packages (UM- 1 ,4 & 5 SMD ) 7.0 - 200.00 Mhz , , 10.0x5.3x5.2mm) UM package Through Hole LPC3 Series (LPC-3 package, 10.0x5.0x3.2mm) HC-49/ SMD package , Series Type Surface Mount 3.5 - 85.0 Mhz UM- 1 Series (UM- 1 package, 7.9x3.2x8.1mm) UM-4 Series , 125.0 Mhz US8 series (US-8 package, 5.0x3.2x1.0mm) Ceramic SMD package Surface Mount 8.0 - , , 2.0x6.0mm) TF38 Series (CH-308 package, 3.0x8.0mm) TF306 series ( CS-306 SMD package, 8.0x3.8x2.54mm


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PDF ATS-49/U HC-49/SMD ATS-51/U HC-49/S ATS-25/U HC-49/U TF306327TR TF406327TR UMC042 ATS-49 32.768Khz LPC3081 LPC3150 HC49SMD CRYSTAL 32.768KHZ cs-306 UMC111 lpc3143 TF38 K D S 11.0592 MHZ
2003 - AN1279

Abstract: WLCSP underfill AN-1279 without underfill IPC-SM-785 Solder paste stencil life WLCSP stencil design
Text: are used for surface mount packages, 1 . Non-solder mask defined (NSMD). 2. Solder mask defined ( SMD , , 3 min ramp; Pass: 500cyc 0/48 0/48 1 /48 2/48 24/48 Micro SMD (Control , AN-1279 Introduction Package Construction MicrofilTM is a underfilled micro SMD , a version of wafer level CSP (WLCSP) with the following features: Figure 1 shows a typical Microfil product , epoxy which covers part of the bumps. The Microfil is manufactured similar to existing micro SMD


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Not Available

Abstract: No abstract text available
Text: : 853-91-016-30-001 851-91-xxx-40-001 851-93-xxx-40-001 851-99-xxx-40-001 SMD receptacle: single row, parallel mount 851-91-xxx-30-001 851-93-xxx-30-001 851-99-xxx-30-001 SMD receptacle: single row, perpendicular mount 853-91-xxx-30-001 853-93-xxx-30-001 853-99-xxx-30-001 SMD receptacle: double row, perpendicular mount 853-91-xxx-30-002 853-93-xxx-30-002 853-99-xxx-30-002 SMD receptacle: double row with 2.54 mm distance, perpendicular row to row mount Availability from: 1 to 50 contacts


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PDF 853-91-xxx-30-001 851-91-xxx-40-001 851-93-xxx-40-001 851-99-xxx-40-001 851-91-xxx-30-001 851-93-xxx-30-001 851-99-xxx-30-001
2003 - AN1279

Abstract: AN-1279 WLCSP underfill WLCSP stencil design IPC-SM-785 JESD51-3 underfill without underfill solder joint reliability WLCSP SMT
Text: are used for surface mount packages, 1 . Non-solder mask defined (NSMD). 2. Solder mask defined ( SMD , , 3 min ramp; Pass: 500cyc 0/48 0/48 1 /48 2/48 24/48 Micro SMD (Control , AN-1279 Introduction Package Construction MicrofilTM is a underfilled micro SMD , a version of wafer level CSP (WLCSP) with the following features: Figure 1 shows a typical Microfil product , epoxy which covers part of the bumps. The Microfil is manufactured similar to existing micro SMD


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Not Available

Abstract: No abstract text available
Text: 830-10-xxx-30-001 830-90-xxx-30-001 SMD pin connector: single row, perpendicular mount Availability from: 3 to 50 contacts Standard number of contacts 50 832-10-xxx-30-001 832-90-xxx-30-001 SMD , number of contacts 100 831-91-xxx-30-001 831-93-xxx-30-001 831-99-xxx-30-001 SMD receptacle: single row, perpendicular mount 833-91-xxx-30-001 833-93-xxx-30-001 833-99-xxx-30-001 SMD


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PDF 833-91-xxx-30-001 830-10-xxx-30-001 830-90-xxx-30-001 832-10-xxx-30-001 832-90-xxx-30-001 831-91-xxx-30-001 831-93-xxx-30-001 831-99-xxx-30-001
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