The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT6300CGN#TRPBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT6300CGN#PBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT6300IGN#TR Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300IGN#PBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300IGN#TRPBF Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C
LT6300IGN Linear Technology LT6300 - 500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C

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2002 - composite to rgb

Abstract: CCIR 601 matrix PGA-120 Video Filters composite input to rgb output polar modulator RGB mixer CCIR601 ML6417CHX ML6426CS5X
Text: -44 Tray TMC2242AR2C Digital Half-Band Interpolating/Decimating Filter 12-bit In/ 16 -bit Out 60MHz , /Decimating Filter 12-bit In/ 16 -bit Out 60MHz 12 16 55 40 Yes Yes MQFP-44 Tray , 12-bit In/ 16 -bit Out 60MHz 12 16 55 60 Yes Yes MQFP-44 Tray TMC2242AR2C2 , -bit In/ 16 -bit Out 60MHz 12 16 55 30 Yes Yes MQFP-44 Tray TMC2242BR2C , -bit In/ 16 -bit Out 60MHz 12 16 55 40 Yes Yes MQFP-44 Tray TMC2242BR2C1 Digital


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PDF ML6415CS ML6415CSX ML6416CS ML6416CSX ML6417CHX* LQFP32 ML6426CS1 ML6426CS1X ML6415DEMO ML6415 composite to rgb CCIR 601 matrix PGA-120 Video Filters composite input to rgb output polar modulator RGB mixer CCIR601 ML6417CHX ML6426CS5X
1997 - 1895 ic

Abstract: tfp 370 TFP-32D 2620D 40DA IC 404
Text: be (1) corrugated cardboard packing box (2) inside box (3) magazine (or tray or tape). The magazine, tray , or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 1. Cardboard packing box Tape (blue) PP band 2. Inside box Tray Cardboard Magazine Corrugated , Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown


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PDF TTP-48D CP-32D CP-32DB CP-40D CP-40DA CP-42D CP-44D TTP-28/24D TTP-28D TTP-28DA 1895 ic tfp 370 TFP-32D 2620D 40DA IC 404
2002 - POWER INVERTER ON KA7500B

Abstract: KA3525 SMPS KA3525A SENSORS LM358N KA7500B KA7500B application note KA7632 KA3525A 8 dip smps ic KA741 OP-AMP
Text: Consumption Package Packing Tray mW FMS9874AKGC100* 8 3 108 0.5 0.8 ­ 3.3 , Consumption Package Packing Tray mW FMS3110KRC 10 3 100 0.3 0.3 5 655 , Voltage Gain (Typ) V/mV Output Output Slew Gain Package Voltage Voltage Rate BW Swing (low , 700 2.3 200 14 0.5 SIP-9 KA224 Quad 16 |32 -25 85 -65 150 5 30 150 0.7 100 5 28 DIP-14 KA224A Quad 16 |32 -25 85 -65 150


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PDF Power247TM, POWER INVERTER ON KA7500B KA3525 SMPS KA3525A SENSORS LM358N KA7500B KA7500B application note KA7632 KA3525A 8 dip smps ic KA741 OP-AMP
tray matrix bga

Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
Text: Profile Quad Flat Package (LQFP) All leadcounts Standard: Tray (5 trays) \W or none required , Publication Revision A (3/1/03) 1-6 u Chapter 1 Codes and Carrier Options AMD's IC Package Codes , Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A , Chapter 2 Package Design A 3/1/03 Chapter 3 Board Assembly A 3/1/03 Chapter 4 Package Materials A 3/1/03 Chapter 5 Package Characterization A 3/1/03 Chapter 6 Summary of


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TSOP II 44 REEL

Abstract: CP-20DA
Text: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown , tray , or tape, with the IC being housed inside. In the unsealed mode, the order o f operations should be (1 ) corrugated cardboard packing box - » ( 2 ) inside box - » (3 ) magazine (o r tray or tape). The magazine, tray , or tape is designed so that the p a c k a g e is n o t s u b je c te d to d a m a g e d u rin g transport. W hen the seal is opened, the package should be handled with great care so


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PDF CP-32D CP-40D CP-44 CP-52 CP-68 CP-84 TFP-20DA TFP-20DAR TFP-32D TFP-32DR TSOP II 44 REEL CP-20DA
IC 404

Abstract: No abstract text available
Text: be (1) corrugated cardboard packing box -» ( 2 ) inside box - > (3) magazine (or tray or tape). The magazine, tray , or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 1 , Emboss tape: Tape width 16 to 24 mm Tape withdraw direction Package SOP TSOP 1 Package Code FP , Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown


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PDF TFP-32D TFP-32DR TTP-32D TTP-32DR TTP-32DB TTP-50/44DC TTP-50D TTP-50DA TTP-28/24D TTP-28D IC 404
1995 - corrugated carton

Abstract: FP-32D package IC Packing and Labelling Specification
Text: ) magazine (or tray or tape). The magazine, tray , or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care , Packing Specifications Contents 1. Forms of Package Packing 2. Moistureproof Packing 3. Taping for IC 4. Taping for IC Memorys Packing Specifications 1. Forms of Package Packing The forms of , box in which there is a magazine, a tray , or tape, with the IC being housed inside. In the unsealed


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PDF TTP-28/24D TTP-28DR TTP-28DA TTP-44/40DA TTP-44/40DAR TTP-44D TTP-44DB TTP-44DBR TTP-44DE TTP-32D corrugated carton FP-32D package IC Packing and Labelling Specification
T0220FP-5-V5

Abstract: No abstract text available
Text: reel Package S 0 P 8 ,14, 16 ,18,20,22,24 SS0 P-A 1 6 ,A 2 0 ,A 24 ,A 3 2 ,P3 2 H SO P2 5 ,2 8 « Quantity 2,000 2,000 2,000 Unit pcs ·E m b o s sed tape and reel Package SM P5 SO P8 SO P 14 SO P 16 , Packaging Specifications Monolithic 1C ^ Package DIP/SDIP SIP/HSIP/ZIP/SZIP Monolithic ICs , reference of packaging specifications SO P/SSO P/HSO P Paper tape on reel Em bossed tape on reel Tray , Tray (dry pack) Em bossed tape on reel VP T0220FP R P M / SM P 5 Polyethylene bag Tube


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PDF T0220FP T0220FP-5-V5
Not Available

Abstract: No abstract text available
Text: be (1) corrugated cardboard packing box - » (2) inside box - » (3) magazine (or tray or tape). The magazine, tray , or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 1. Cardboard packing box Tape (blue) 2. Inside box Corrugated cardboard 3. Magazine, tray or , Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown


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tfp 370

Abstract: No abstract text available
Text: be (1 ) corrugated cardboard packing box -» (2 ) inside box -» (3 ) magazine (or tray or tape). The magazine, tray , or tape is designed so that the package is not subjected to damage during transport. When the seal is opened, the package should be handled with great care so that it is not damaged. 2 , width 16 to 24 mm Package SOP TSOP 1 Package Code FP-28D FP-28DA TFP-28DA TFP-28DAR TFP-28DB TFP , Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown


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PDF TFP-32D TFP-32DR TTP-32D TTP-32DR TTP-32DB TTP-50/44DC TTP-50D TTP-50DA TTP-28/24D TTP-28D tfp 370
2007 - csp defects

Abstract: handling damage Samsung MCP MANUAL PCB LGA socket FBGA 8 x 14 package tray fbga Substrate design guidelines HCFC141B pcb substrate CRACK
Text: escape from package tray . · Becare of tray handling (Move it on tray bended) Revision 4 (FEB, 2007 , preventing excessive down pressure of nozzle Pick-up nozzle Tray or Reel & Tape pocket H1 Package , USER'S MANUAL (Chip Scale Package ) · To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package 's characteristics and manuals to maintain high , Handling, No Manual Handling process - Page 1 - Main contents It says understanding of CSP package


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PDF 150um) 20mils x20mil csp defects handling damage Samsung MCP MANUAL PCB LGA socket FBGA 8 x 14 package tray fbga Substrate design guidelines HCFC141B pcb substrate CRACK
cxa1372aq

Abstract: CXA1571M CXA1372Q CXA1372 KSL 2101 SPC500 ISS149 CXA1571M/N cxa1571 b1013
Text: 15 16 · When playing is stopped or the tray is open, the pitch control becomes off. ­ 21 ­ , selected, performs tray loading function. (ii) With portable type selected, displays detection of weak , 17 16 15 SL+ SL0 SL­ FSET ISET 24 23 22 21 20 R3 R4 14 13 12 11 10 , FDFCT FE FZC ATSC TDFCT 1 GND GND GND GND 19 18 17 16 15 14 13 12 GND 25 26 27 28 , NC EO EI TE FE BIAS 11 12 13 14 15 16 RFO FE 17 RFI 19


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PDF CXP1021Q CXP1021Q SPC500 CDL-40 80PIN QFP080-P-1420-A QFP-80P-L01 cxa1372aq CXA1571M CXA1372Q CXA1372 KSL 2101 ISS149 CXA1571M/N cxa1571 b1013
2002 - FAN8035L

Abstract: FAN8035
Text: VREF FOCUS TRACKING INPUT INPUT [SERVO PRE AMP] 16 SLED INPUT SPINDLE INPUT TRAY , drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray motor of the CDP , Disk Player Digital Video Disk Player 48-QFPH-1414 Ordering Information Device Package , REV 16 FWD 15 CTL 14 OUT5 IN5- 13 MUTE12 25 DO6+ FAN8035 Pin , OUT5 O CH5 Op-amp Output 15 CTL I CH6 Motor Speed Control 16 FWD I CH6


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PDF FAN8035 FAN8035 FAN8035L
1996 - DAEWON tray tsop 48LD

Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon TRAY TSOP 56LD GRAINGER TRAY DAEWON TSOP daewon venturi meter
Text: failures. 5.2.4 Inspect each package to ensure pin-1 dimple marks are correctly oriented to tray , . Using Non-Precision Vacuum Wand 5.3.3 When removing package from tray , carefully raise device in , lower package towards output tray pocket with correct orientation [based on tray cutout (chamfer) and , . (for package guides) 1(800) 879-4683 (Mt. Prospect, IL) Tray /Tape-In-Tube Packaging Information , Programming Procedures Tray Unstrap Incoming Visual Inspection Tray-to-Programmer Transfer


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2004 - tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Text: quantities are specified below. Table II. Tray Quantities by Package Type Device Package Type Number , 420 450 420 300 200 135 120 ­3­ a Table II. Tray Quantities by Package Type (continued , Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride , resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type Device Package , Units 300 mil PDIP 8 14 16 18 20 24 28 50 25 25 20 18 15 13 20 20 20 20 20


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PDF E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray
1996 - CXA1372AQ

Abstract: CXA1571M CXA1372Q KSL 2101 CXA1571 transistor B1013 CXA1372 b1013 ISS149 NEC custom code 42
Text: 15 16 · When playing is stopped or the tray is open, the pitch control becomes off. ­ 21 ­ , pins. (i) With deck type selected, performs tray loading function. (ii) With portable type selected , 22 21 20 19 18 17 16 15 SL+ SL0 SL­ FSET ISET 24 23 22 21 20 R3 , TZC DVCC RF0 RF1 CP CB FDFCT FE FZC ATSC TDFCT 1 GND GND GND GND 19 18 17 16 , FE VDD 20 18 LD ON NC EO EI TE FE BIAS 11 12 13 14 15 16


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PDF CXP1021Q CXP1021Q SPC500 CDL-40 80PIN QFP080-P-1420-A QFP-80P-L01 CXA1372AQ CXA1571M CXA1372Q KSL 2101 CXA1571 transistor B1013 CXA1372 b1013 ISS149 NEC custom code 42
k908

Abstract: 8753D TR09
Text: Minimum Package Quantity (see note): 3, 4.5, 5, 12, and 24 VDC G6K-2F-RF (-S) 300 units/ tray , Minimum Package Quantity (see note): 3, 4.5, 5, 12, and 24 VDC G6K-2F-RF (-S) 300 units/ tray , in tray packing. Relays per reel: 300 for "-TR03" 900 for "-TR09" This specification, however , in tray packing. Relays per reel: 300 for "-TR03" 900 for "-TR09" This specification, however , G6K-2F-RF-S 8.8 Orientation mark 7.6 G6K-2F-RF-S 7.8 8.6 VDC JAPAN 1.2 1.6


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PDF K908-E2-01-X k908 8753D TR09
vqfp100 package

Abstract: VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
Text: condition DIP/SDIP Package DIP 8 DIP 14, 16 Tube SDIP 18,22,24 DIP 18 DIP 28 SCHP30,32 D f>20 ,22 Tube SK -D , x 3 x 460 12.9 x > .3 x 4 6 0 12.9 x > 3 x 4 6 0 SOP/SSOP/HSOP Package SOP8 SOP14, 16 Tube , Case (pcs) 200 0 200 500 Tray package Case dimensions 47 , 0. 5+ 0. I O' 15" |[o's±o. 1 O' ~ I 5 ' DIP 16 DIP 18 19 . 4 ± 0. 3 l?6_ o ' , ) 1.27 0 .4 ± 0 . SOP 14 SOP 16 HRHHHHH HTHTBTH .27 0 .4 ± 0 . I SOP 18 SOP2Q


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PDF DIP20 DIP22 DIP24 DIP28 SQFP56 VQFP80 FP-A64 FP-T80 SQFP-T80 SQFP100 vqfp100 package VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
2000 - FAN8037

Abstract: KA3037 KSB772 DC Motor Drive
Text: which drives the tracking actuator, focus actuator, sled motor, tray motor, changer motor, panel motor , · · · · Compact disk player ( Tray , Changer) Video compact disk player ( Tray , Changer) Car compact disk player ( Tray , Changer) Mixing with compact disk player and mini disk player ( Tray , Changer , DO6- REV1 12 25 DO7+ 13 2 14 15 16 17 18 19 20 21 22 , FWD2 I CH6 forward input 15 REV2 I CH6 reverse input 16 SGND - Signal


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PDF FAN8037 KA3037) FAN8037 48-QFPH-1414 KA3037 KSB772 DC Motor Drive
ELCO Edge Connectors

Abstract: 1.27mm 10 pin box header connector right angle 14 pin pcb connector 2mm pitch SD Card Package tray DIN41612 Battery angle Connector, Pitch 2.5mm, 4 pin 38 PIN ELCO Connector AVX label DETAIL SD Card Package JEDEC tray
Text: . . . . . . . . . . . . . . . 44 H=5.6mm, Tray Package . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . 29 72P Right Angle SMT H=5.5mm, Tray Package . . . . . . . . . . , QUANTITY: 20/ TRAY 200/BOX TRAY / PACKAGE 45 S.O. DIMM Connectors Series 6401 72P Right Angle SMT , =0mm (Assembly) . . . . . . . . . . . . . . . . . 16 Header/Ejector H=2.2mm (Connector, Ejector) . . . . . . . . , Connector (Single Side, Straddle Tail) . . . . . . . 32 Receptacle Connector Package (Tape & Reel Package


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PDF S-MCC0M907-C ELCO Edge Connectors 1.27mm 10 pin box header connector right angle 14 pin pcb connector 2mm pitch SD Card Package tray DIN41612 Battery angle Connector, Pitch 2.5mm, 4 pin 38 PIN ELCO Connector AVX label DETAIL SD Card Package JEDEC tray
2002 - Not Available

Abstract: No abstract text available
Text: INPUT INPUT [SERVO PRE AMP] 16 SLED INPUT SPINDLE INPUT TRAY TRAY CONTROL INPUT , driver which drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray motor of , Device Package Operating Temperature FAN8035 48-QFPH-1414 -35°C ~ +85°C FAN8035L 48 , PVCC2 DO6− (GND) FIN MUTE34 18 SGND 17 REV 16 FWD 15 CTL 14 OUT5 IN5â , Motor Speed Control 16 FWD I CH6 Forward Input 17 REV I CH6 Reverse Input 18


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PDF FAN8035 FAN8035
2008 - 600V igbt dc to dc buck converter

Abstract: TRANSISTOR SMD CODE PACKAGE SOT89 bts 2140 1b data sheet TRANSISTOR SMD CODE PACKAGE SOT23 PSB 6970 HL V1.3 PEF 24628 E V1.2-G infineon psb 6970 HT 1200-4 PEF 4265 T V2.1 SLB 9635
Text: -channel for TDM applications, tray SOCRATESTM (SDC-16i): 2nd generation symmetrical DSL controller for 16 , DUSLICTM-SP: Dual channel subscriber line interface circuit in a single package , 0° C to 70° C, tray DUSLICTM-SP1: Single channel subscriber line interface circuit in a single package , 0° C to 70° C, tray SMD , Package Description C165U: 16 -bit microcontroller with HDLC and IOMTM-2, large packing unit 60 pcs, tray C165U: 16 -bit microcontroller with HDLC and IOMTM-2, large packing unit 360 pcs, tray C165H: 16


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PDF B192-H6780-G11-X-7600 SP000008186 VDSL6100i-E 600V igbt dc to dc buck converter TRANSISTOR SMD CODE PACKAGE SOT89 bts 2140 1b data sheet TRANSISTOR SMD CODE PACKAGE SOT23 PSB 6970 HL V1.3 PEF 24628 E V1.2-G infineon psb 6970 HT 1200-4 PEF 4265 T V2.1 SLB 9635
PEAK tray drawing

Abstract: PEAK TRAY
Text: €”315.0— 6-NO HOLES VACUUM PICKUP CELL 4.85 REE -3.0 ID O UO -a XP AMPER INDICATES PACKAGE PIN , X.XX=±0.1 3 DNLESS OTHERWISE SPECIFIED. ESD - SURRACE RESISTIVITY - 105 TO 1011 OHMS/SO. 5. HOR PACKAGE , TP E TRAY BOTTOM 3 4 ^PEAK PEAK PLASTIC & METAL PRODUCTS INT'L LTD. P-01 071 P-00987 P—00944 P — 00821 P — 006 81 » OB II FILL THE L ADD CH / 5 TO R : TRAY AT FC S AT THE TEM PER 10« OF H TM OF TH F TRAY _FRAME _NGE TEMPERATURE CHANGE SURFACE RESISTIVITY CHANGE POSITION TOL 21


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PDF 31GAGIW3S BG2727 P-00987 CSA02793 PEAK tray drawing PEAK TRAY
4-1734073-2

Abstract: corrugated box spec SPEC. 114 Tyco w335 2-1734073-2 EZ31 1-1734073-2 KE code tyco Qualification Test Report electronica DDR
Text: -1734073-6 TAPE REEL à a-1734073-4 TAPE REEL 2-1734073-2 HARD TRAY 1-1734073-2 WITH 2.5 18.45 1.5 1.8 TAPE REEL 4-1734073-2 HARD TRAY 3-1734073-2 LATCH TAB VOLTAGE D5 D4 D3 PACKAGE TYPE PART NUMBER nm , : 3.1 PRIMARY PACKING: 16 PCS/ TRAY 3.2 SECONDARY PACKING: 20 TRAY /BOX(320PCS) 4. WEIGHT: 4.1 NET WEIGHT , REVISIONS 1.6 m ^ LATCH TAB 5-2J 2.17±0.2 1.62±0.2 _£ß Í 0.05±0.1 io in m 0.7 REVERSE TYPE THIS , QUALIFICATION TEST REPORT NOTES : 1. MATERIAL: 1.1 TRAY : ABS, BLACK COLOR 1.2 SHIPPING BOX: CORRUGATED


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PDF UL94V-0 76/im 38/im 05/im 27iim 501ii' 03/im 27/im 31MAR2000 150PCS/REEL 4-1734073-2 corrugated box spec SPEC. 114 Tyco w335 2-1734073-2 EZ31 1-1734073-2 KE code tyco Qualification Test Report electronica DDR
Memory Card Connectors

Abstract: 1.27mm 10 pin box header connector MO-160 Battery angle Connector, Pitch 2.5mm, 4 pin 5612
Text: . . . . . . . . . . . . . . . 44 H=5.6mm, Tray Package . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . 29 72P Right Angle SMT H=5.5mm, Tray Package . . . . . . . . . . , QUANTITY: 20/ TRAY 200/BOX TRAY / PACKAGE 45 S.O. DIMM Connectors Series 6401 72P Right Angle SMT , =0mm (Assembly) . . . . . . . . . . . . . . . . . 16 Header/Ejector H=2.2mm (Connector, Ejector) . . . . . . . . , Connector (Single Side, Straddle Tail) . . . . . . . 32 Receptacle Connector Package (Tape & Reel Package


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PDF S-MCC0M907-C Memory Card Connectors 1.27mm 10 pin box header connector MO-160 Battery angle Connector, Pitch 2.5mm, 4 pin 5612
Supplyframe Tracking Pixel