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2010 - tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD TS3332LD tanaka epoxy remix capacitors Die Attach epoxy stamping tanaka free circuit diagram of rf id Broadband Amplifiers Application Notes, appendix 3 Thermal Epoxy
Text: TS3332LD epoxy for the die attach. Figure 2: Picture of assembled 10W HPA Die Evaluation Module , negligible thermal resistance 0.004" GaAs Chip 0.002" Tanaka TS3332LD 0.2" Cu Housing Figure 4: 10W , Au/Sn eutectic solder and Tanaka TS3332LD epoxy for die attach. Although normally operated under , =-20dBm Vd=7V, Id=2.6A 3.06 °C/W RFin=-20dBm Vd=8V, Id=2.65A Tanaka TS3332LD 2.87 °C/W 2.93 °C , (A): Assembly Information, Tanaka TS3332LD Assembly Process (1) Assembly Process (2) · Stock


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2008 - XP1055-BD

Abstract: tanaka TS3332LD epoxy
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1055-BD MIL-STD-883 parD-000V XP1055-BD-EV1 XP1055-BD tanaka TS3332LD epoxy
2008 - XP1071-BD-000V

Abstract: tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 28-Sep-08 P1071-BD MIL-STD-883 surfaD-000V XP1071-BD-EV1 XP1071-BD XP1071-BD-000V tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
2008 - tanaka gold wire

Abstract: tanaka au wire DM6030HK tanaka TS3332LD
Text: and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 16-Oct-08 P1070-BD MIL-STD-883 chipD-000V XP1070-BD-EV1 XP1070-BD tanaka gold wire tanaka au wire DM6030HK tanaka TS3332LD
2007 - tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD tanaka epoxy dm6030hk TS3332LD tanaka gold wire data sheet tanaka gold wire CMM-2-BD CMM-2-BD-000X DM6030HK-Pt
Text: clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 06-Aug-07 CMM-2-BD-000X tanaka TS3332LD epoxy tanaka TS3332LD tanaka epoxy dm6030hk TS3332LD tanaka gold wire data sheet tanaka gold wire CMM-2-BD CMM-2-BD-000X DM6030HK-Pt
2008 - tanaka wire

Abstract: dm6030hk tanaka epoxy
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1058-BD MIL-STD-883 passivatiD-000V XP1058-BD-EV1 XP1058-BD tanaka wire dm6030hk tanaka epoxy
2008 - tanaka gold wire

Abstract: tanaka TS3332LD epoxy XP1056-BD XP1056-BD-EV1 XP1056-BD-000V tanaka TS3332LD
Text: TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule


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PDF 12-May-08 P1056-BD MIL-STD-883 bD-000V XP1056-BD-EV1 XP1056-BD tanaka gold wire tanaka TS3332LD epoxy XP1056-BD-EV1 XP1056-BD-000V tanaka TS3332LD
2008 - tanaka TS3332LD

Abstract: XP1032-BD-EV1 tanaka TS3332LD epoxy DM6030HK XP1032-BD
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1032-BD MIL-STD-883 parD-000V XP1032-BD-EV1 XP1032-BD tanaka TS3332LD XP1032-BD-EV1 tanaka TS3332LD epoxy DM6030HK
2008 - tanaka TS3332LD

Abstract: tanaka TS3332LD epoxy DM6030HK-Pt tanaka gold wire tanaka aluminum wire DM6030HK TS3332LD
Text: and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 28-Sep-08 P1070-BD MIL-STD-883 chD-000V XP1070-BD-EV1 XP1070-BD tanaka TS3332LD tanaka TS3332LD epoxy DM6030HK-Pt tanaka gold wire tanaka aluminum wire DM6030HK TS3332LD
2008 - tanaka TS3332LD

Abstract: TS3332LD
Text: and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 16-Oct-08 P1057-BD MIL-STD-883 sD-000V XP1057-BD-EV1 XP1057-BD tanaka TS3332LD TS3332LD
2008 - tanaka TS3332LD

Abstract: tanaka TS3332LD epoxy XP1059-BD-000V XP1059 XP1059-BD-EV1 TS3332LD tanaka gold wire DM6030HK-Pt tanaka wire tanaka gold wire current
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1059-BD MIL-STD-883 passivatiD-000V XP1059-BD-EV1 XP1059-BD tanaka TS3332LD tanaka TS3332LD epoxy XP1059-BD-000V XP1059 XP1059-BD-EV1 TS3332LD tanaka gold wire DM6030HK-Pt tanaka wire tanaka gold wire current
2008 - Not Available

Abstract: No abstract text available
Text: and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 28-May-08 P1057-BD MIL-STD-883 surfaD-000V XP1057-BD-EV1 XP1057-BD
2007 - 6OSC0460

Abstract: DM6030HK TS3332LD XQ1000-BD XQ1000-BD-000V XQ1000-BD-EV1
Text: Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure


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PDF 17-Apr-07 Q1000-BD 100KHz MIL-STD-883 XQ1000-BD XQ1000-BD-000V XQ1000-BD-EV1 XQ1000 6OSC0460 DM6030HK TS3332LD XQ1000-BD XQ1000-BD-000V XQ1000-BD-EV1
2007 - XX1007-BD

Abstract: tanaka TS3332LD DM6030HK TS3332LD XX1007-BD-000V XX1007-BD-EV1 tanaka epoxy
Text: using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured


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PDF X1007-BD 29-Aug-07 MIL-STD-883 XX1007-BD XX1007-BD XX1007-BD-000V XX1007-BD-EV1 XX1007 tanaka TS3332LD DM6030HK TS3332LD XX1007-BD-000V XX1007-BD-EV1 tanaka epoxy
2008 - XP1054-BD

Abstract: XP1054-BD-000V XP1054-BD-EV1 DM6030HK tanaka TS3332LD
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 12-May-08 P1054-BD MIL-STD-883 parD-000V XP1054-BD-EV1 XP1054-BD XP1054-BD-000V XP1054-BD-EV1 DM6030HK tanaka TS3332LD
2008 - tanaka gold wire

Abstract: tanaka wire XP1057-BD DM6030HK tanaka TS3332LD tanaka TS3332LD epoxy
Text: and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 12-May-08 P1057-BD MIL-STD-883 surfaD-000V XP1057-BD-EV1 XP1057-BD tanaka gold wire tanaka wire DM6030HK tanaka TS3332LD tanaka TS3332LD epoxy
2007 - IC 7486

Abstract: Ic chip 7486 7486 ic diagram DIAGRAM OF IC 7486 Q1004-BD XQ1004 XQ1004-BD-000V XQ1004-BD-EV1 Application OF IC 7486 DM6030HK
Text: . If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt


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PDF 17-Apr-07 Q1004-BD 100KHz MIL-STD-883 XQ1004-BD XQ1004-BD-000V XQ1004-BD-EV1 XQ1004 IC 7486 Ic chip 7486 7486 ic diagram DIAGRAM OF IC 7486 Q1004-BD XQ1004-BD-000V XQ1004-BD-EV1 Application OF IC 7486 DM6030HK
2007 - tanaka bonding wire

Abstract: No abstract text available
Text: . If using conductive epoxy, recommended epoxy is Tanaka TS3332LD cured in a nitrogen atmosphere per


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PDF 15-Jan-07 39x40 CMM-5-BD-000X tanaka bonding wire
2007 - IC 7486

Abstract: DIAGRAM OF IC 7486 specifications of IC 7486 varactor diode application application of ic number 7486 XQ1004
Text: Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure


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PDF 17-Apr-07 Q1004-BD 100KHz MIL-STD-883 XQ1004-BD XQ1004-BD-000V XQ1004-BD-EV1 XQ1004 IC 7486 DIAGRAM OF IC 7486 specifications of IC 7486 varactor diode application application of ic number 7486
2007 - tanaka TS3332LD

Abstract: No abstract text available
Text: , recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per


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PDF 17-Apr-07 Q1001-BD 100KHz MIL-STD-883 XQ1001-BD XQ1001-BD-000V XQ1001-BD-EV1 XQ1001 tanaka TS3332LD
2007 - varactor diode application

Abstract: No abstract text available
Text: should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat


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PDF 17-Apr-07 Q1003-BD 100KHz MIL-STD-883 XQ1003-BD XQ1003-BD-000V XQ1003-BD-EV1 XQ1003 varactor diode application
2007 - Not Available

Abstract: No abstract text available
Text: Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure


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PDF 17-Apr-07 Q1006-BD 100KHz 110mA MIL-STD-883 XQ1006-BD XQ1006-BD-000V XQ1006-BD-EV1 XQ1006
2007 - ts333

Abstract: tanaka gold wire tanaka gold wire current DM6030HK tanaka TS3332LD DM6030HK-Pt XE1000-BD-EV1 XE1000-BD-000V XE1000-BD TS3332LD
Text: Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure


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PDF 17-Apr-07 E1000-BD MIL-STD-883 XE1000-BD XE1000-BD-000V XE1000-BD-EV1 XE1000 ts333 tanaka gold wire tanaka gold wire current DM6030HK tanaka TS3332LD DM6030HK-Pt XE1000-BD-EV1 XE1000-BD-000V XE1000-BD TS3332LD
2007 - 7OSC0463

Abstract: DM6030HK TS3332LD XQ1003 XQ1003-BD XQ1003-BD-000V XQ1003-BD-EV1
Text: Tanaka TS3332LD , Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure


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PDF 17-Apr-07 Q1003-BD 100KHz MIL-STD-883 XQ1003-BD XQ1003-BD-000V XQ1003-BD-EV1 XQ1003 7OSC0463 DM6030HK TS3332LD XQ1003-BD XQ1003-BD-000V XQ1003-BD-EV1
2007 - Q1005-BD

Abstract: 14OSC0501 DM6030HK TS3332LD XQ1005-BD XQ1005-BD-000V XQ1005-BD-EV1
Text: clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD , Die Mat DM6030HK or


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PDF 17-Apr-07 Q1005-BD 100KHz 110mA MIL-STD-883 XQ1005-BD XQ1005-BD-000V XQ1005-BD-EV1 XQ1005 Q1005-BD 14OSC0501 DM6030HK TS3332LD XQ1005-BD XQ1005-BD-000V XQ1005-BD-EV1
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