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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC2272CUJ#TRPBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: 0°C to 70°C
LTC2272IUJ#PBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: -40°C to 85°C
LTC2272CUJ#TR Linear Technology IC 1-CH 16-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC40, 6 X 6 MM, PLASTIC, QFN-40, Analog to Digital Converter
LTC2272IUJ#TRPBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: -40°C to 85°C
LTC2272CUJ#PBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: 0°C to 70°C
LTC2272CUJ Linear Technology IC 1-CH 16-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC40, 6 X 6 MM, PLASTIC, QFN-40, Analog to Digital Converter

TL 2272 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
CIR 2272

Abstract: TL 2272 R integrated circuit TL 2272 TL 2272 XR-2272 TL 2272 M 2272C panaplex XR2272CP XR2272
Text: 7ZT E tA R XR- 2272 High-Voltage 7-Digit Display Driver GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM The XR- 2272 is a monolithic high voltage display driver array specifically designed to drive , a gas discharge panel. The XR- 2272 is particularly well suited to interfacing with Panaplex II type , °C to + 70 °C 0°C to +70°C SYSTEM DESCRIPTION The XR- 2272 high voltage display driver features , and mono lithic pull-up resistors. The output is an emitter follower. 7-4 XR- 2272 V SS


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PDF XR-2272 XR-2272 XR-1568M XR-1568/XR-1468C XR-1468/1568 CIR 2272 TL 2272 R integrated circuit TL 2272 TL 2272 TL 2272 M 2272C panaplex XR2272CP XR2272
2011 - LM700

Abstract: XBDAWT-00-0000-00000LEE4
Text: designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak Time Profile , (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 0.284 0.284 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34


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PDF CLD-DS45 80-min 70-min LM700 XBDAWT-00-0000-00000LEE4
2011 - Not Available

Abstract: No abstract text available
Text: designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak Time Profile , (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 0.36 0.36 2.34 2.34 0.284 0.284 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28


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PDF CLD-DS45 80-min 70-min
2011 - CLD-DS45

Abstract: LM-80 cree K3-700 TL 2272
Text: designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak Time Profile , (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284


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PDF CLD-DS45 80-min 70-min LM-80 cree K3-700 TL 2272
311P409-2S-B-12

Abstract: 311p409-3s 311P409-2S
Text: tijca A M P AMPLIMITE Connectors, Series 109 Electronics Non-Magnetic Crimp Receptacles, Series 109, Standard Density Connectors (NASA Qualified) Connector Material and Finish: Shell — Insert — Brass, gold plated Approved material per M IL-D TL -24308 Retention Clips â , ) 2.159 .311 2.500 2.729 2.272 .494 .422 .039 3.91 55.42 7.9 63.5 , 53.04 41.3 12.55 10.72 0.99 3.05 37 (4) 2.159 .311 2.500 2.729 2.272


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PDF TL-24308 G-10-S1 M22520/2-01 311P409-2S-B-12 311p409-3s 311P409-2S
2011 - lm 739

Abstract: No abstract text available
Text: soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts , tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification , 0.36 B 2.34 0.284 1.136 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED 0.284 AREA IS OPENING) RECOMMENDED PCB 0.36 SOLDER PAD 0.28 0.92 2.34 2.272 THIRD ANGLE PROJECTION UNLESS OTHERWISE


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PDF CLD-DS45 80-minimum 70-minimum lm 739
2011 - Not Available

Abstract: No abstract text available
Text: PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature t , ) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL , 0.426 0.46 B 0.36 0.426 0.82 0.923 0.462 0.284 0.284 2.272 2.272 2.34 , 2.272 RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) 2.34 RECOMMENDED PCB SOLDER PAD


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PDF 80-minimum 70-minimum
2011 - Not Available

Abstract: No abstract text available
Text: TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 , (Tsmax to Tp) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature , 0.46 B 0.36 2.34 0.852 0.426 0.284 2.272 1.136 0.36 A 2.34 0.284 2.272 0.284 0.28 0.36 1.136 0.284 0.92 2.34 0.284 0.28 RECOMMENDED PCB 0.36


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PDF 80-minimum 70-minimum
2011 - Not Available

Abstract: No abstract text available
Text: soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts , tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification , 0.36 B 2.34 0.284 1.136 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED 0.284 AREA IS OPENING) RECOMMENDED PCB 0.36 SOLDER PAD 0.28 0.92 2.34 2.272 THIRD ANGLE PROJECTION UNLESS OTHERWISE


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PDF CLD-DS45 80-minimum 70-minimum
2011 - E349212

Abstract: TM-21-11
Text: Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to , ) Preheat: Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak , 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284 2.272 RECOMMENDED , PCB SOLDER PAD 2.272 D. CRONIN CHECK DATE 09/ TITLE DAT RECOMMENDED STENCIL PATTERN


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PDF CLD-DS45 80-minimum 70-minimum E349212 TM-21-11
2011 - Not Available

Abstract: No abstract text available
Text: designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature t , ) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL , 0.82 0.36 0.426 0.82 0.46 B 0.36 2.34 0.852 0.426 0.284 2.272 1.136 0.36 A 2.34 0.284 2.272 0.284 0.28 0.36 1.136 0.284 0.92 2.34 0.284


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PDF 80-minimum 70-minimum
2011 - Not Available

Abstract: No abstract text available
Text: Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down , : Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of , 0.36 B 2.34 0.284 1.136 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED 0.284 AREA IS OPENING) RECOMMENDED PCB 0.36 SOLDER PAD 0.28 0.92 2.34 2.272 THIRD ANGLE PROJECTION UNLESS OTHERWISE


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PDF CLD-DS45 80-minimum 70-minimum
2011 - Not Available

Abstract: No abstract text available
Text: PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak , : Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 0.426 0.852 0.852 0.36 0.36 2.34 2.34 0.284 0.284 1.136 1.136 2.272 2.272 A


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PDF CLD-DS45 80-minimum 70-minimum
2011 - TL 2272

Abstract: No abstract text available
Text: PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak , : Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284


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PDF CLD-DS45 80-minimum 70-minimum TL 2272
TL 2272 M

Abstract: TL 2272
Text: 1.083 0.020 0.090 44 1.534 1.852 2.088 1.625 0.020 0.090 62 2.182 2.500 2.729 2.272 0.023 0.094 , CONTACT ACCEPTS 28 - 24 AWG WIRE mm ©[mmim© "LT TL ©©[MPILOMW I® THESE DRAWINGS AND , 0.250 XI 03X.0.250" (MATING SIDE) - CN8 0.250 j_r 0.293 -1 "LT TL ©OIMPILOMT te mm \m©M Â


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PDF 180-MYY-10YLYYY 180-MYY-10YLYYY TL 2272 M TL 2272
2011 - XBDAWT00-0000

Abstract: No abstract text available
Text: PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak , : Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature ( TL ) Time Maintained Above: Time ( tL ) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284 2.272 RECOMMENDED


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PDF CLD-DS45 80-minimum 70-minimum XBDAWT00-0000
311P407-2P-B-15

Abstract: 311P407-4P-B-12
Text: tifca A M P AM PLI M ITE Connectors, Series 90 Electronics Non-Magnetic Crimp Plugs, Series 90, High Density Connectors (NASA Qualified) Connector Material and Finish Shell — Brass, gold plated tnsert — Approved material per M IL-D TL -24308 R etention C lips — Copper alloy , 10.72 10.82 .120 3.05 .154 2.182 .329 2.500 2.729 .230 2.272 .494 .422 .426 3.91 55.42 8.36 63.5 , 5.84 .230 5.84 .230 5.84 .230 5.84 .759 19.28 1.083 27.51 1.625 41.3 2.272 57.7 2.178


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PDF TL-24308 G-08-P1 311P407-2P-B-15 311P407-4P-B-12
TL 2272

Abstract: No abstract text available
Text: 0.971 1.312 1.541 1.083 0.020 0.090 44 1.511 1.852 2.088 1.625 0.020 0.090 62 2.159 2.500 2.729 2.272 , ACCEPTS 28 - 24 AWG WIRE mm ©©ÄH ©mwoM© "LT _ TL ©©[MPILOMW I® THESE DRAWINGS AND , 0.293 0.250 XI 03X.0.250" (MATING SIDE) - CN8 0.250 j_r 0.293 -1 mm EmwDNi© "LT TL Â


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PDF 180-MYY-20YLYYY 180-MYY-20YLYYY TL 2272
Not Available

Abstract: No abstract text available
Text: tqca Electronics AMP AMPLIM1TE Connectors, Series 109 Straight PCB, Series 109, Standard Density Connectors (MIL Qualified) Material and Finish: j Shell — Insert — Steel, cadm ium plated Approved material per M IL-D TL -24308 Contact — Copper alloy plated gold over nickel , 69.32 2.182 55.42 2.500 63.5 .329 8.36 .494 12.55 2.272 57.71 .422 10,72 .039 0.99 Receptacle 2.729 69.32 2.159 54.84 2.500 63.5 .311 7,90 .494 12.55 2.272


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PDF TL-24308 23-23F 24-23F 1218t27-5 23-11F 23-15F 23-16F 23-20F 23-21F
CN10

Abstract: No abstract text available
Text: DESCRIPTION: HIGH DENSITY - MACHINED CONTACTS - VERTICAL 4-40 THREADS 00.120 ¥ D ± 0.005 ¥ 00.026 DIMENSIONS (IN.) No. OF PINS A B C D E F 15 0.666 0.984 1.213 0.759 0.010 0.090 25 0.994 1.312 1.541 1.083 0.020 0.090 44 1.534 1.852 2.088 1.625 0.020 0.090 62 2.182 2.500 2.729 2.272 0.023 0.094 "LT _ TL MATERIALS AND FINISH: SHELL: STEEL MATERIAL, NICKEL FINISH INSULATOR , 0.293 -1 "LT TL ©OIMPILOMT te mm EmwDNi© THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF


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PDF 00VAC 655-Iâ 180-MYY-11YRYYY CN10
TL 2272 R

Abstract: No abstract text available
Text: 1.625 2.272 E 0.010 0.020 0.020 0.023 F 0.090 0.090 0.090 0.094 ACCEPTS 28 - 24 AWG WIRE § )(2 Ä , . SMITH DATE: 02- 12-08 i_r _ TL ©©MtPtLDMOTT NorComp SHEET OF REV DWG NO


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PDF 000VAC 180-MYY-1 180-MYY-10YLYYY TL 2272 R
180M 290

Abstract: TL 2272 R ON 973
Text: 1.511 2.159 B 0.984 1.312 1.852 2.500 C 1.213 1.541 2.088 2.729 D 0.759 1.083 1.625 2.272 E 0.010 0.020 , 12-08 i_r _ TL ©©MtPtLDMOTT NorComp SCALE: SHEET OF REV DWG NO. 180-M YY


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PDF 000VAC 180-MYY-21 180-M YY-21YRYYY 180M 290 TL 2272 R ON 973
Not Available

Abstract: No abstract text available
Text: C 1.213 1.541 2.088 2.729 D 0.759 1.083 1.625 2.272 E 0.010 0.020 0.020 0.023 F 0.090 0.090 0.090 , : C. SMITH CHECKED: DATE: 02- 12-08 i_r _ TL ©©MtPtLDMOTT NorComp SCALE: SHEET


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PDF 000VAC 180-MYY-11YRYYY
Not Available

Abstract: No abstract text available
Text: AMPLIMITE Connectors, Series 90 Electronics Crimp Receptacles, Series 90, High Density Connectors (MIL Qualified) .429 . Material and Finish - 005 * 010 [10.9 ±0.25] (Outside) Shell — Steel, cadmium plated Insert — Approved material per M IL-D TL -24308 Retention Clips — Stainless steel or copper alloy . 120*«“ Dia. {3.05*"3 2 Holes ] B  , 2-30F 204528-1 204540-2 2.500 2.729 2.272 63.5 69.32 57.7 204506-1 204518-2 2-300F


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PDF TL-24308 M24308 MIL-DTL-24308.
TL 2272 R

Abstract: ODD44 ODD26
Text: 2.159 2.500 2.729 2.272 0.023 0.094 mm m@m mmm® "LT _ TL ©©[MPILOMW I® THESE DRAWINGS AND , I— 0.090 "LT TL ©©DMOMÄM N OTE: female locator plate shown flip for male MATERIAL


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PDF 181-MYY-2YYRYYY TL 2272 R ODD44 ODD26
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