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75160-829-22LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,22 position, 2.54mm pitch |
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10129382-924001BLF
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Amphenol Communications Solutions
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EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 24 Positions, 2.54mm Pitch, 5.84mm (0.23inch) Mating, 3.05mm (0.12inch) Tail |
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10114829-20106LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 6 Positions |
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10129382-920003BLF
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Amphenol Communications Solutions
|
EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 20 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 3.05mm (0.12inch) Tail |
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10114829-20206LF
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Amphenol Communications Solutions
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1.25mm Wire-to-Board Connector System, Wire to Board, MINITEK®1.25 WTB 1.25MM WAFER THROUGH HOLE VERTICAL, 6 POSITIONS, Matte Tin. |
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75970-829-20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,20 Positions, 2.54 mm (0.100in) Pitch. |
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