The Datasheet Archive

TB379 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2001 - TB334

Abstract: TB363 TB379 AN9940 AN993 ISL83700EVAL ISL837030REF-CD ISL83740EVAL ISL83740REF-CD
Text: Characterization of Packages for ICs ( TB379 ) www.intersil.com/data/tb/tb3/ tb379 / TB379.pdf · Guidelines for


Original
PDF FN8013 ISL837030/ISL83740 AN9935 AN9934 ISL83700EVAL/ ISL83740EVAL ISL83740REF-CD, ISL837030REF-CD, ISL83700EVAL, TB334 TB363 TB379 AN9940 AN993 ISL83700EVAL ISL837030REF-CD ISL83740EVAL ISL83740REF-CD
2009 - TB379

Abstract: TB363 2X2B TB389 ICISL9211A Technical Brief TB389 TB347 ISL9211AIRU68XZ-T ISL9211AIRU58XZ-T ISL9211AIRU48XZ-T
Text: ISL9211A ¬ 2009 4 2 FN6702.0 ISL9211A ICIC ISL9211AN-MOSFET · 24V · 2.0A · IC · +150°CN- MOSFET · ICISL9211A · 1µs · · ICNFET · NFET · RoHS ISL9211A · · · PDA · · · Technical Brief TB363" " · Technical Brief TB379 " · Technical Brief TB389 "QFN PCB (°C) ISL9211A (8 LD µTDFN) PKG. DWG. # ISL9211AIRU48XZ-T* 4XE -40 ~+85 & ( ) 8


Original
PDF ISL9211A FN6702 ISL9211AN-MOSFET ICISL9211A TB363" TB379 TB389 TB379 TB363 2X2B TB389 ICISL9211A Technical Brief TB389 TB347 ISL9211AIRU68XZ-T ISL9211AIRU58XZ-T ISL9211AIRU48XZ-T
2008 - ISL80101IR15Z

Abstract: IS80101 TB379 ISL80101IR33Z-T x05v ISL80101 ISL80101IR18Z ISL80101IRAJZ
Text: of Packaged Semiconductor Devices TB379 8. JC 9 , COUT = 10F TJ = +25 Technical Brief TB379 -40 , Technical Brief TB379 -40 +125 MIN MAX 11 TYP 11 f = 1kHz, ILOAD = 1A


Original
PDF ISL80101 130mV 300Hz 300kHz O220-5 O263-5 OT223-5 FN6931 ISL80101IR15Z IS80101 TB379 ISL80101IR33Z-T x05v ISL80101 ISL80101IR18Z ISL80101IRAJZ
spartan 3a

Abstract: TB379 fn640 ISL65426IRZA ISL65426 ISL65426HRZ MBR0520 MOSFET 6A EN2710
Text: . . . . . . . . . . . . . . . . . . . . -10°C +125°C " " 1JA"" TB379 2JC"" TB379


Original
PDF ISL65426 FN640 ISL65426HRZ* ISL65426HRZ ISL65426IRZA* ISL65426IRZ spartan 3a TB379 ISL65426IRZA ISL65426 ISL65426HRZ MBR0520 MOSFET 6A EN2710
6520cb

Abstract: TB379 FN9009 6520CBZ ISL6520IB ISL6520CR ISL6520CBZ ISL6520CB ISL6520 MO-220
Text: " features. See Tech Brief TB379. 3. For JC, the "case temp" location is the center of the exposed metal , thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. JA is measured in free


Original
PDF ISL6520 FN9009 ISL6520 6520cb TB379 6520CBZ ISL6520IB ISL6520CR ISL6520CBZ ISL6520CB MO-220
acbz

Abstract: 6520ACBZ 6520ACB 6520 ACB 20AIRZ 6520 acbz FN9016 ISL6520ACBZ JEDEC QFN case outline ISL6520AIBZ
Text: conductivity test board with "direct attach" features. See Tech Brief TB379. 3. For JC, the "case temp , component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for


Original
PDF ISL6520A ISL6520A FN9016 acbz 6520ACBZ 6520ACB 6520 ACB 20AIRZ 6520 acbz ISL6520ACBZ JEDEC QFN case outline ISL6520AIBZ
2012 - Not Available

Abstract: No abstract text available
Text: ©³ç´°ã¯ãƒ†ã‚¯ãƒ‹ã‚«ãƒ«ï½¥ãƒ–リーフ「Thermal Characterization of Packaged Semiconductor Devices ( TB379 )」を参照してくだã , ƒ©ã‚¤ãƒ³ã«å¾“わなければなり ません。13 ページの「消費電力」とテクニカル・ブリーフ TB379 , ®ã€Œæ¶ˆè²»é›»åŠ›ã€ã¨ãƒ†ã‚¯ãƒ‹ã‚«ãƒ«ï½¥ãƒ–リーフ TB379 を参照してください。 太字のリミット値はジャンクション温度 (TJ , ®ã€Œæ¶ˆè²»é›»åŠ›ã€ã¨ãƒ†ã‚¯ãƒ‹ã‚«ãƒ«ï½¥ãƒ–リーフ TB379 を参照してください。 太字のリミット値はジャンクション温度 (TJ


Original
PDF ISL28127, ISL28227 ISL80111ã ISL80112ã ISL80113 ISL80111/ISL80112/ISL80113 100kHz 5m-1994 FN7841
2011 - smd 58a transistor 6-pin

Abstract: ISL75051SRH SMD 5962-11212
Text: . Please refer to “Applications Information” on page 11 of the datasheet and Tech Brief TB379. Pulse , and Tech Brief TB379. Pulse load techniques used by ATE to ensure TJ = TA defines guaranteed limits , temperature. Please refer to “Applications Information” on page 11 of the datasheet and Tech Brief TB379. , board with “direct attach” features. See Tech Brief TB379 6. For θJC, the “case tempâ


Original
PDF ISL75051SRH ISL75051SRH 038mm) FN7610 smd 58a transistor 6-pin SMD 5962-11212
2008 - ISL6292

Abstract: ISL9211 ISL9211IRU58XZ-T ISL9211IRU68XZ-T TB347 TB363 TB379 TB389
Text: " features. See Tech Brief TB379. 3. JC, "case temperature" location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications Typical values are , Technical Brief TB379 "Thermal Characterization of Packaged Semiconductor Devices" BATTERY PACK ·


Original
PDF ISL9211 ISL9211 5m-1994. FN6658 ISL6292 ISL9211IRU58XZ-T ISL9211IRU68XZ-T TB347 TB363 TB379 TB389
2006 - TB379

Abstract: 187AA ISL88031 ISL88031EVAL1 ISL88031IU8HFZ
Text: 3. qJA TB379 VDD IDD1 VDD VDD=5.0V IDD2 V2MON


Original
PDF ISL88031 FN8227 120ms 1888INTERSIL 18884683774Intersil MSL20 MO187BA TB379 187AA ISL88031 ISL88031EVAL1 ISL88031IU8HFZ
2008 - 093 425

Abstract: No abstract text available
Text: "direct attach" features. See Tech Brief TB379. 3. JC, "case temperature" location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. Electrical Specifications PARAMETER , GND FAULT VB RVB BATTERY PACK · Technical Brief TB379 "Thermal Characterization of Packaged


Original
PDF ISL9211 FN6658 ISL9211 5m-1994. 093 425
2008 - Not Available

Abstract: No abstract text available
Text: thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 3. JC, "case temperature" location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379. , GND FAULT VB RVB BATTERY PACK · Technical Brief TB379 "Thermal Characterization of Packaged


Original
PDF ISL9211 FN6658 ISL9211 5m-1994.
2010 - Not Available

Abstract: No abstract text available
Text: conductivity test board with "direct attach" features. See Tech Brief TB379. 5. For JC, the "case temp , worst case junction temperature. Please refer to "Functional Description" on page 7 and Tech Brief TB379. , refer to "Functional Description" on page 7 and Tech Brief TB379. Boldface limits apply over the


Original
PDF ISL80101A ISL80101A 5m-1994. FN7712
2004 - Not Available

Abstract: No abstract text available
Text: Brief TB379. Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO , air. See Tech Brief TB379 for details. 4. θJA is measured in free air with the component mounted on


Original
PDF ISL6700 ISL6700 12-lead
2003 - jedec package MO-220 vggc

Abstract: MO-220-VGGC ISL6700 ISL6700IB ISL6700IR MO-220
Text: temp" is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379. , in free air. See Tech Brief TB379 for details. 3. JA is measured in free air with the component


Original
PDF ISL6700 ISL6700 12-lead FN90il jedec package MO-220 vggc MO-220-VGGC ISL6700IB ISL6700IR MO-220
ISL8104

Abstract: ISL8104CBZ ISL8104CRZ ISL8104IBZ ISL8104IRZ QFN "200 pin" PACKAGE 04IRZ 28 ld qfn 4x4 intersil 6 lead tsoc package
Text: Tech Brief TB379. 3. For JC, the "case temp" location is the center of the exposed metal pad on the , test board in free air. See Tech Brief TB379 for details. 2. JA is measured in free air with the


Original
PDF ISL8104 FN9257 ISL8104 5m-1994. ISL8104CBZ ISL8104CRZ ISL8104IBZ ISL8104IRZ QFN "200 pin" PACKAGE 04IRZ 28 ld qfn 4x4 intersil 6 lead tsoc package
2006 - TB379

Abstract: ISL88021 ISL88022
Text: TB379 VDD 5.5 V IDD1 VDD VDD


Original
PDF ISL88021ISL88022 FN8226 ISL88021 ISL88022 ISL88021 600mV 140ms TB379 ISL88022
6227CAZ

Abstract: 6227CA ISL6227 qfn 5x5 thermal resistance FN9094 ISL6227IAZ ISL6227IA ISL6227CAZ ISL6227CA 5L-B
Text: board with "direct attach" features. See Tech Brief TB379. 4. For JC, the "case temp" location is the , a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3


Original
PDF ISL6227 ISL6227 FN9094 6227CAZ 6227CA qfn 5x5 thermal resistance ISL6227IAZ ISL6227IA ISL6227CAZ ISL6227CA 5L-B
2004 - Not Available

Abstract: No abstract text available
Text: TB379. Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO, Unless , test board in free air. See Tech Brief TB379 for details. 3. JA is measured in free air with the


Original
PDF ISL6700 FN9077 ISL6700 12-lead
2006 - baara

Abstract: ic baara el75321 JESD22-A114-B TB379 EL7532IY-T7 EL7532IY EL7532IYZ-T13 MDP0043 MSOP10
Text: EL7532 MSOP10 MSOP10 JA 115/W JA 4 100/W 2 125/W TB379 PC · · VINPGND · PC -


Original
PDF EL7532 FN7435 18in2 MSOP10 100msPOR 100ms 18in2EL7532 baara ic baara el75321 JESD22-A114-B TB379 EL7532IY-T7 EL7532IY EL7532IYZ-T13 MDP0043 MSOP10
2002 - VHS-03V

Abstract: FN907 ISL6700 ISL6700IB ISL6700IR jedec package MO-220 68 MO-220
Text: TB379. Maximum Recommended Operating Conditions Supply Voltage, V DD . . . . . . . . . . . . . . . . , in free air. See Tech Brief TB379 for details. 3. JA is measured in free air with the component


Original
PDF ISL6700 ISL6700 12-lead FN9077il VHS-03V FN907 ISL6700IB ISL6700IR jedec package MO-220 68 MO-220
20 pins qfn 4x4 footprint

Abstract: QFN PACKAGE Junction to PCB thermal resistance MO-220-VGGD-1 AN1139 TB389 TB379 MO-220 ISL6271ACR ISL6271A ISL6271
Text: Embedded Processors Related Literature · Technical Brief TB379 "Thermal Characterization of Packaged , mounted on a high effective thermal conductivity test board with "direct attach" features ( TB379 ). 2. For


Original
PDF ISL6271A FN9171 ISL6271A 5m-1994. 20 pins qfn 4x4 footprint QFN PACKAGE Junction to PCB thermal resistance MO-220-VGGD-1 AN1139 TB389 TB379 MO-220 ISL6271ACR ISL6271
ISL6406IBZ

Abstract: ISL6406IR ISL6406IRZ ISL6406IV ISL6406IVZ MO-220 ISL6406 ISL6406IB
Text: board with "direct attach" features. See Tech Brief TB379. 4. For JC, the "case temp" location is the , on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3


Original
PDF ISL6406 ISL6406 15MHz FN9073 ISL6406IBZ ISL6406IR ISL6406IRZ ISL6406IV ISL6406IVZ MO-220 ISL6406IB
qfn 5x5 thermal resistance

Abstract: HIP6601B HIP6602B HIP6603B ISL6558 ISL6558CB ISL6558CB-T ISL6605 MO-220
Text: thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. JA is measured in free , " features. See Tech Brief TB379 for details. 3. JC, "case temperature" location is at the center of the


Original
PDF ISL6558 ISL6558 HIP6601B, HIP6602B, HIP6603B, ISL6605 TB389. MO-220VHHC FN9027 qfn 5x5 thermal resistance HIP6601B HIP6602B HIP6603B ISL6558CB ISL6558CB-T MO-220
2003 - jedec package MO-220 vggc

Abstract: ISL6700 ISL6700IB ISL6700IR MO-220
Text: TB379. Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, No Load on LO or HO, unless , test board in free air. See Tech Brief TB379 for details. 3. JA is measured in free air with the


Original
PDF ISL6700 ISL6700 12-lead FN9077 jedec package MO-220 vggc ISL6700IB ISL6700IR MO-220
Supplyframe Tracking Pixel