The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
SMD291SNL500T3 Chip Quik Inc SOLDER PASTE SAC305 500G
SMDLTLFP15T4 Chip Quik Inc TWO PART MIX SOLDER PASTE
SMD4300SNL500T4C Chip Quik Inc SOLDER PASTE SAC305 T4 500G
SMDLTLFP500T3 Chip Quik Inc SOLDER PASTE SN42/BI58 500G
SMD291AX500T3 Chip Quik Inc SOLDER PASTE SN63/PB37 500G
SMD4300SNL500T3C Chip Quik Inc SOLDER PASTE SAC305 T3 500G

Solder paste RMA-20-21 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1501a

Abstract: MATERIAL SAFETY Solder powder RMA-15-01A Rosin Flux Type RMA 150-1A
Text: property 1 ~ 2 Solder Ball Test Range 1 ~ 3 Solder Paste Residue Adhesive Test after Reflow No , percentage Ag 0 Others < 0.5 wt% RMA-15-01A Solder Paste Solder Paste Composition De-oxygen True , : Follow the Lead poisoning prevention regulations Solder Paste RMA ­ 15 ­ 01A Low-activated RMA , surface of solder paste will harden and may influence parts adhesion. 7. Reflow Conditions: The following diagram is a reference for reflowing. Follow it to minimize solder paste collapse & balls


Original
PDF RMA-15-01A 40oC/90% 85oC/85% 200oC 183oC 1501a MATERIAL SAFETY Solder powder RMA-15-01A Rosin Flux Type RMA 150-1A
1995 - CU-106A

Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Text: , CASTIN Pb-free solder paste , and ENTEK® PLUS Organic Solderability Preservative (OSP) as the PWB surface , finishes is visual only. By using TI 4-layer Ni/Pd finished IC components, AIM CASTIN Pb-free solder paste , paste for surface mount operations and bar solder for wave soldering operations. Elimination of Pb in , finished IC components, a Pb-free solder paste , and a non-Sn/Pb coating on the Cu land patterns the IC , . Table 1: L9 Designed Experiment Run Lead Finish Solder Paste 1 Sn/Pb Sn/Pb RMA 2


Original
PDF 28September CU-106A entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
2014 - Not Available

Abstract: No abstract text available
Text: implied is made in regards to the following recommendations. 1 Solder Paste Printing 2 , the optimum solder paste for the pattern, printing process, and solder joint quality. The , Typical solder paste alloy is 63Sn/37Pb. RMA,No-Clean or Halide Free Water Soluble fluxes should be , . CAUTION CAUTION Since solder paste usually contains a high percentage of activators, you must ensure adequate cleaning to remove all residues. Consult your solder paste supplier for cleaning


Original
PDF
24-7068-1407

Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: Products Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products , , lead-free, no-clean solder paste . NXG3 is engineered for the high thermal demands of assembling with , solder paste . NXG5 is engineered for the high thermal demands of assembling with lead-free alloys , ' expectations for high yield le Formula NXG33 Zero halogen, lead-free, no-clean solder paste . NXG3 is , Designator ROL0 Suggested Packaging Style 500g jar or 600g cartridges STANDARD SOLDER PASTE REFLOW


Original
PDF
sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: Materials Table of Contents Table of Contents Products Solder Paste Fluxes Solder Wire Bar , Product Characteristics Sn96.5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste . NXG3 is , .5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste . NXG5 is engineered for the high thermal demands of , , no-clean solder paste . NXG3 is engineered for manufacturing. NXG33 is engineered for the high thermal de , 600g cartridges STANDARD SOLDER PASTE REFLOW PROFILE STANDARD SOLDER PASTE REFLOW PROFILE FOR


Original
PDF
GR-78-CORE

Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A sn63pb37 solder wire bellcore GR-78 RF771 959T TC-527
Text: Core Size 66 66 66 66 66 Solder Paste No-Clean Solder Paste for Stencil Printing Applications , , 600g, 1400g cartridges Solder Paste for Syringe Dispensing Applications Formula Type Alloy Product , for Antimony, which is specified to a maximum of 0.2%. Page 7 Page 8 Solder Paste Kester , , Kovar Zinc, Mild Steel, Chromium, Inconel, Monel, Stainless Steel Solder Paste and Tacky Soldering , (Category 1, 2, 3, or 4). STANDARD SOLDER PASTE REFLOW PROFILE FOR KESTER PASTE CONTAINING ALLOYS: Sn96


Original
PDF 65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A sn63pb37 solder wire bellcore GR-78 RF771 959T TC-527
QQ-S-571E

Abstract: IPC-J-STD-004 QQ-S-571 MSDS QQ-S571E QQS-571-E QQ-S-571 AIMTERGE-520A sn100c ROL0 RMA202-25 SN100C
Text: of proper handling and operating conditions. All information pertaining to solder paste is produced , RMA Cored Wire Solder Rosin Mildly Activated Cored Wire Solder Features: - Good Activity Level , mildly activated, general-purpose wire solder for use in applications requiring good activation. RMA , solder joints. RMA wire will leave slight to moderate post-process residues that may be left on , be available upon special request. Application: - Solder iron tip temperature should be between


Original
PDF QQS-571-E IPC-J-STD-004 ISO9001 45-micron QQ-S-571E QQ-S-571 MSDS QQ-S571E QQ-S-571 AIMTERGE-520A sn100c ROL0 RMA202-25 SN100C
SN63PB37

Abstract: No abstract text available
Text: Sn96.5Ag3.0Cu0.5 .062 66 24-9574-6411 K100LD .062 Page 7 Solder Paste Water-Soluble No-Clean Solder Paste for Stencil Printing Applications Formula Type Alloy Easy Profile , Solder Paste for Syringe Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 , to a maximum of 0.2%. Page 8 Solder Paste Kester Part # Description Alloy Packaging , quickly bring the assembly up to a temperature where solder paste can become highly chemically active


Original
PDF EM907 EM828 SN63PB37
1998 - senju solder paste

Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux 62Sn36Pb2Ag solder powder soldering paste Senju
Text: 2.3.1 SOLDER PASTE (1) Material Composition Soldering paste is mainly made from soldering powder and , influences soldering paste viscosity and solder thickness after reflow. Suitable soldering powder and flux , deformation) No separation of flux and solder powder No paste surface solidification after manufacture , . · If paste is too viscous, solder does not separate from the die plate easily, possibly causing , MOUNTING PROCESS 2.3.2 SOLDER SUPPLY PROCESS (1) Soldering paste printability Soldering paste is


Original
PDF 80-95wt% 63Sn/37Pb) 62Sn/36Pb/2Ag) senju solder paste senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux 62Sn36Pb2Ag solder powder soldering paste Senju
1996 - rma 291

Abstract: Solder paste RMA-291 SOL-28 SOL28 package
Text: preferable Thorough cleaning of boards after soldering is required Reflow Soldering Screen solder paste on board and attach components to board Solder paste with RMA flux is recommended Bake boards at , solder paste with vapor phase method the solder paste temperature must be maintained at or above 200 C , solder paste temperature must be maintained at or above 200 C for at least 30 seconds The components , soldering is recommended for DIP packages Solder plated boards are recommended Rosin mildly activated (RMA


Original
PDF Pre255 MDP0038 OT-23 rma 291 Solder paste RMA-291 SOL-28 SOL28 package
2000 - IPC-6012

Abstract: reflow temperature bga laptop IPC 6012 micron tsop 48 PIN tray failure of heating element in hot air gun epoxy adhesive paste cte table PCB design for very fine pitch csp package
Text: producing an opening by which contaminants may enter. Screen print solder paste on side #1 Normally , Combined Wave Solder and Solder Reflow Screen print solder paste on side #1 More mature products , components and selected these SM components accordingly. Attach SMT components Reflow solder paste , Screen print solder paste on side #1 Fine Pitch SM Solder Reflow Side 1 and Side 2 Fine pitch SM , volume of solder paste incorporated in the component interconnection. Apply adhesive on side #1


Original
PDF
1999 - TB370

Abstract: to252 footprint wave soldering TB334 stencil tension
Text: and layout of a circuit board. The main suggested method of attachment is to use a solder paste . ing , single step. Solder pastes are composed of solder Power outline, stencil thickness, flux/ solder paste , critical as for IR reflow. Solder Paste Reflow Profile The following profile is intended as an ideal , components start activation and begin to reduce the oxides on component leads, PCB pads, and solder paste , temperature. Zone 3: Reflow Stage (180-235oC) Solder paste is brought to approximately 30oC above the


Original
PDF TB370 TB370 TB334 to252 footprint wave soldering stencil tension
2002 - Not Available

Abstract: No abstract text available
Text: (wave) soldering is not appropriate for this device. The type of solder paste selected for reflow , fluxes. Metal content of the paste for screen and/or stencil applications is generally 85-90% by weight, slightly lower for nozzel dispensing applications. When screening or stenciling, solder paste thickness of , °C MAX 250 200 150 100 50 PREHEAT SOLDER FLUX MELT/ACTIVATION PASTE SOLDER SPHERE MELT , reflow temperature be approximately 10-30°C (20-55°F) above solder liquidus temperature. Typical


Original
PDF 178mm/800 300mm/3000 EIA-481-1
J-STD-003

Abstract: J-STD-005 heller 1700 ISO-9453-1990 QQ-S-571F J-STD-004 SN60 SN63 TR1000 IEC-1191-1
Text: paste consisting of very small solder particles suspended in flux · Metal content ­ The amount of , and Test Methods for Solder Paste IPC-TM-650 - Test Methods Manual IEC-1191-1 - Generic Standard , Considerations/Topics ­ ­ ­ ­ ­ ­ ­ ­ ­ PWB footprint (layout) Solder mask use/layout Type of solder Temperature profile Type of soldering equipment Stencil Flux Cleanup Standards , preferences, the PWB footprint will be: ­ the same size as the part solder pad layout, or ­ slightly larger


Original
PDF SM20H: ANSI/J-STD-001 ANSI/J-STD-002 ANSI/J-STD-003 ANSI/J-STD-004 ANSI/J-STD-005 IPC-TM-650 IEC-1191-1 ISO-9453-1990 J-STD-003 J-STD-005 heller 1700 QQ-S-571F J-STD-004 SN60 SN63 TR1000
Not Available

Abstract: No abstract text available
Text: A suggested solder mask pattern is shown in Figure 3. The solder paste should be applied to all the , solder paste pattern. The second need is to supply a miniature packaged circuit which can be tested , devices which are to be surface mounted, should have their solder paste screened on at the same time , of solder paste application in this instance should be taken into account in the stencil design , the substrate. Solder paste is appl ied using a teflon or polyurethane squeegee as shown in Fig. 7


OCR Scan
PDF LP508
Alpha WS609 solder

Abstract: Kester steam aging system solder paste alpha WS609 7406D kester solder paste WS609 mountaingate TL082 SHINKO ALS245 LS245
Text: Water Soluble and No-Clean Solder Paste Study Degradation by Moisture Pre-Conditioning PDIP Board , No-Lead Solder Paste Compatibility Other Component Suppliers Acknowledgements 66 References 67 , Reflow (IR) furnace or Vapor Phase Reflow (VPR) is used to heat the solder paste to the melting , board temperature rises to 215-220°C and quickly drops off after the solder paste is reflowed. The , encounter during the solder reflow process. This test procedure begins with screening solder paste onto a


Original
PDF
2003 - J-STD-005

Abstract: IPC-SM-785 dispense needle for csp underfill dispense needle PCB design for very fine pitch csp package
Text: Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width , include printing solder paste onto the PCB. Solder Paste Characteristics NSMD Type 3 (25 ­ 45 mm powder), Type 4 (20 ­ 38 mm powder) or Type 5 (15 ­ 25 mm powder) ANSI/J-STD-005 compliant solder paste is suggested. No-clean solder paste is recommended. RMA or water soluble (OA) solder paste flux may , bond pads are recommended. It is highly recommended that the solder paste height, uniformity


Original
PDF AND8081/D J-STD-005 IPC-SM-785 dispense needle for csp underfill dispense needle PCB design for very fine pitch csp package
EL2009

Abstract: EL2009C ELLS 110 w s p 1620 transformer EL2009CT QCX0002 high speed op amp voltage booster E2130 MDP0028
Text: soldering is required. Reflow Soldering: Screen solder paste on board and attach components to board. Solder paste with RMA flux is recommended. Bake boards at 65°C-90°C for 15 minutes. Preheat boards to within 60°C-70°C of the solder temperature. To reflow solder paste with vapor phase method, the solder , temperature can not exceed 215°C. For the IR reflow method, the solder paste temperature must be maintained , ±50mA Tst Storage Temp. Range - 65°C to + 150°C PD Power Dissipation (Note 2) See Curves Tld Lead Solder


OCR Scan
PDF EL2009C EL2009CT T0-220 MDP0028 O-220 EL2009 amplifi16 3121S57 EL2009C ELLS 110 w s p 1620 transformer QCX0002 high speed op amp voltage booster E2130 MDP0028
2006 - NC-SMQ230

Abstract: tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste 97SC tamura solder paste PROFILE soft solder dispensing
Text: Packaging PC Board Pad Design Automatic Placement Equipment Considerations Solder Paste Reflow Soldering , (0.008 in.) of recommended size. Automatic Placement Equipment Considerations Solder Paste , . For best results, an SN63 eutectic solder paste , liquidus at +183ºC (+361ºF), should be used. SN62 solder paste containing 2% silver, liquidus at +189 ºC (+372 ºF), may be used with the chip LED devices, with the advantage of obtaining stronger solder connections, but higher cost. The solder paste should


Original
PDF 5989-2268EN AV01-0654EN NC-SMQ230 tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste 97SC tamura solder paste PROFILE soft solder dispensing
ALPHA RMA-390 DH3

Abstract: Ultrasonic Cleaning Transducer R-229-25 hearing aid integrated circuits hearing aid amplifiers loop GB512 Hearing Aid Circuit Diagram circuit for hearing aid devices hearing aid chip hearing aid class d
Text: . The solder paste should be applied to all the lands on the substrate in one stroke through the stencil , the substrate fixed when the stencil is raised for "snap-off" from the solder paste pattern. Note: All other devices which are to be surface mounted, should have their solder paste screened on at the , being assembled. The accuracy and consistency of solder paste application in this instance should be , substrate on the vacuum chuck and lowers the stencil onto the substrate. Solder paste is applied


OCR Scan
PDF GB512/LD51 GB512 LD512 3T3S763 ALPHA RMA-390 DH3 Ultrasonic Cleaning Transducer R-229-25 hearing aid integrated circuits hearing aid amplifiers loop Hearing Aid Circuit Diagram circuit for hearing aid devices hearing aid chip hearing aid class d
Not Available

Abstract: No abstract text available
Text: is shown in Figure 3. The solder paste should be applied to all the lands on the substrate in one , substrate fixed when the stencil is raised for “snap-off" from the solder paste pattern. The second , mounted, should have their solder paste screened on at the same time, (i.e. stencil should be designed , € number of circuit board patterns being assembled. The accuracy and consistency of solder paste , operator places the substrate on the vacuum chuck and lowers the stencil onto the substrate. Solder paste


OCR Scan
PDF LX509
Not Available

Abstract: No abstract text available
Text: solder mask pattern is shown in Figure 3. The solder paste should be applied to all the lands on the , the substrate fixed when the stencil is raised for “snap-off" from the solder paste pattern , to be surface mounted, should have their solder paste screened on at the same time, (i.e. stencil , of solder paste application in this instance should be taken into account in the stencil design , the substrate. Solder paste is appl ied using a teflon or polyurethane squeegee as shown in Fig. 7


OCR Scan
PDF LT505
el7556cm

Abstract: No abstract text available
Text: is required. Reflow Soldering: Screen solder paste on board and attach components to board. Solder paste with RMA flux is recommended. Bake boards at 65°C-90°C for 15 minutes. Preheat boards to within 60°C-70°C of the solder temper­ ature. To reflow solder paste with vapor phase method, the solder paste temperature must be maintained at or above 200°C for at least 30 sec­ onds. The components temperature can not ex­ ceed 215°C. For the IR reflow method, the solder paste temperature m


OCR Scan
PDF EL7556C 7556C EL7556C el7556cm
25CC

Abstract: EL7761 EL7761C EL7761CN EL7761CS QCX0002 QCXU002
Text: soldering is required. Reflow Soldering: Screen solder paste on board and attach components to board. Solder paste with RMA flux is recommended. Bake boards at 65°C-90°C for 15 minutes. Preheat boards to within 60°C-70°C of the solder temperature. To reflow solder paste with vapor phase method, the solder , temperature can not exceed 215°C. For the IR reflow method, the solder paste temperature must be maintained , Boards DIP Packages Wave soldering is recommended for DIP packages. Solder plated boards are recommended


OCR Scan
PDF EL7761C EL7761CN 16-Pin MDP0031 EL7761CS -4irC016 25CC EL7761 EL7761C EL7761CN QCX0002 QCXU002
2002 - Alpha WS609 solder

Abstract: mountaingate Kester steam aging system solder paste alpha WS609 ALS245 free energy Dissolve Oxygen TL082 LS245 matsua saw
Text: Water Soluble and No-Clean Solder Paste Study Degradation by Moisture Pre-Conditioning PDIP Board , No-Lead Solder Paste Compatibility Other Component Suppliers Acknowledgements 66 References 67 , Reflow (IR) furnace or Vapor Phase Reflow (VPR) is used to heat the solder paste to the melting , board temperature rises to 215-220°C and quickly drops off after the solder paste is reflowed. The , encounter during the solder reflow process. This test procedure begins with screening solder paste onto a


Original
PDF
Supplyframe Tracking Pixel